209550 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas; Disposition the bonding areas being at different heights
Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
#302High luminance light emitting diode and liquid crystal display device using the same
#303Optimized contact design for thermosonic bonding of flip-chip devices
#304Thin-film capacitor and method for fabricating the same, electronic device and circuit board
#305Semiconductor device
#306Method of producing image display unit
#307Interconnects for semiconductor light emitting devices
#308Solder composition for electronic devices
#309Bonding pad on IC substrate and method for making the same
#310Phosphor, production method thereof and light-emitting device using the phosphor
#311High brightness light-emitting device and manufacturing process of the light-emitting device
#312Structure and method for producing multiple size interconnections
#313Light-emitting device
#314Method for self-assembling microstructures
#315Method of manufacturing a substrate-free flip chip light emitting diode
#316Backside method for fabricating semiconductor components with conductive interconnects
#317Electrode structure, and semiconductor light-emitting device having the same
#318Light emitting element mounting member, and semiconductor device using the same
#319High reflectivity p-contacts for group lll-nitride light emitting diodes
#320Electronic device and method for fabricating the same
#321Luminescent body and optical device including the same
#322Card type LED illumination source
#323Method for processing a base that includes connecting a first base to a second base with an insulating film
#324Connection between a semiconductor chip and a circuit component with a large contact area
#325Light extraction from a semiconductor light emitting device via chip shaping
#326Light emitting element and method of making same
#327High brightness light-emitting device and manufacturing process of the light-emitting device
#328Method for forming bump on electrode pad with use of double-layered film
#329Method for making a semiconductor device
#330White light emitting device
#331Card-type LED illumination source
#332Card-type LED illumination source
#333Led chip mounting structure and image reader having same
#334Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes
#335Semiconductor flip-chip package and method for the fabrication thereof
#336Light emitting element
#337LED illumination apparatus and card-type LED illumination source
#338Flip chip light-emitting diode package
#339Semiconductor light emitting device
#340Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereof
#341Flip chip assemblies and lamps of high power GaN LEDs, wafer level flip chip package process, and method of fabricating the same
#342Capacitor device and method of manufacturing the same
#343P and N contact pad layout designs of GaN based LEDs for flip chip packaging
#344Method for mounting semiconductor chip and semiconductor chip-mounted board
#345Flip chip device having supportable bar and mounting structure thereof
#346Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
#347Light emitting element and light emitting device
#348Electrode structure, and semiconductor light-emitting device having the same
#349Light emitting device assembly
#350SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same
#351Light emitting apparatus
#352Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element
#353Light-emitting device with enlarged active light-emitting region
#354Light-emitting device
#355Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element
#356Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element
#357Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element
#358Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element
#359Semiconductor device having a light emitting element
#360Semiconductor light-emitting device and method of manufacturing the same and mounting plate
#361Light emitting diode package structure
#362Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking
#363Three-dimensional memory device containing self-aligned interlocking bonded structure and method of making the same
#364MPS-C2 semiconductor device having shorter supporting posts