209598 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
Sub-classes:CHIP STRUCTURE HAVING INTERCONNECT AND MANUFACTURING METHOD THEREOF
#2BONDING ARRANGEMENT HAVING A METAL INVERSE OPALS LAYER
#3ELECTRONIC PACKAGE AND A PACKAGING METHOD
#4BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THE SAME
#5PACKAGE SUBSTRATE WITH EMBEDDED DEVICE, AND MANUFACTURING METHOD THEREFOR
#6METHOD FOR MAKING SEMICONDUCTOR DEVICE
#7METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#8Bulk acoustic wave resonator and method of manufacturing the same
#9Bonding method, display backplane and system for manufacturing display backplane
#10COMPOSITION FOR REMOVING PHOTORESIST
#11Stackable fully molded semiconductor structure with vertical interconnects
#12Transfer carrier for micro light-emitting element
#13Stackable fully molded semiconductor structure with vertical interconnects
#14Manufacturing process of element chip
#15Conductive pillar shaped for solder confinement
#16Semiconductor device
#17Semiconductor device and method of forming the same
#18Methods for bump planarity control
#19Method for manufacturing semiconductor device
#20Conductive pillar shaped for solder confinement
#21Manufacturing process of element chip
#22ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
#23Chip package assembly with enhanced interconnects and method for fabricating the same
#24Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices
#25MULTIBATH PLATING OF A SINGLE METAL
#26Method of manufacturing micro light-emitting element array, transfer carrier, and micro light-emitting element array
#27Conductive micro pin
#28Conductive ball and electronic device
#29Assembly comprising hybrid interconnecting means including intermediate interconnecting elements and sintered metal joints, and manufacturing process
#30INTEGRATED DEVICE COMPRISING BUMP ON EXPOSED REDISTRIBUTION INTERCONNECT
#31Semiconductor device and semiconductor detector, methods for manufacturing same, and semiconductor chip or substrate
#32Mixed UBM and mixed pitch on a single die
#33Conductive pillar shaped for solder confinement
#34Mixed UBM and mixed pitch on a single die
#35Mixed UBM and mixed pitch on a single die
#36Conductive pillar shaped for solder confinement
#37Fluid discharge device, fluid discharge method, and fluid application device
#38Conductive connections, structures with such connections, and methods of manufacture
#39Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits
#40Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages
#41Interconnect structures and methods for fabricating interconnect structures
#42Conductive connections, structures with such connections, and methods of manufacture
#43Method of manufacturing micro pins and isolated conductive micro pin
#44SOLDER TRANSFER SHEET
#45Direct injection molded solder process for forming solder bumps on wafers
#46Conductive connections, structures with such connections, and methods of manufacture
#47Conductive connections, structures with such connections, and methods of manufacture
#48Method of fabricating connection structure for a substrate
#49Method for handling very thin device wafers
#50Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package
#51Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package
#52Direct injection molded solder process for forming solder bumps on wafers
#53Substrates having bumps with holes, semiconductor chips having bumps with holes, semiconductor packages formed using the same, and methods of fabricating the same
#54Method of manufacturing a semiconductor device and wafer
#55Circuit board and process for producing the same
#56Semiconductor device, method of manufacturing the same, and method of manufacturing wiring board
#57Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package
#58Semiconductor package structure and manufacturing process thereof
#59Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
#60METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PRODUCTION DEVICE, AND PHOTOSENSITIVE RESIST
#61Flip chip mounting method and bump forming method
#62METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFACTURING METHOD THEREOF
#63Bonding metallurgy for three-dimensional interconnect
#64Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof
#65Methods for Passivating Metallic Interconnects
#66Metallic bump structure without under bump metallurgy and manufacturing method thereof
#67Bonding metallurgy for three-dimensional interconnect
#68Process for Preparing a Solder Stand-Off
#69Circuit board and process for producing the same
#70Method for manufacturing metal chips by plasma from a layer comprising several elements
#71Flip chip mounting method and bump forming method
#72Flip chip mounting method and bump forming method
#73Flip chip mounting method and bump forming method
#74Flip-chip mounting resin composition and bump forming resin composition
#75WAFER SCALE THIN FILM PACKAGE
#76Method for producing means of connecting and/or soldering a component
#77Methods and structures for interconnect passivation
#78Device mounting method and device transport apparatus
#79Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same
#80Robust pillar structure for semicondcutor device contacts