209648 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material; Self-assembly, e.g. self-agglomeration of the bump material in a fluid Auxiliary means therefor, e.g. for self-assembly activation
Magnetic contacts
#2Magnetic contacts
#3Reflow film, solder bump formation method, solder joint formation method, and semiconductor device
#4CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#5Flip chip mounting method and bump forming method
#6Electrode structure and method for forming bump
#7Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates
#8Bump forming method and bump forming apparatus
#9Flip chip mounting method and bump forming method
#10Bump forming method using self-assembling resin and a wall surface
#11Flip chip mounting method and bump forming method
#12Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method
#13Flip chip mounting method and bump forming method
#14Flip-chip mounting resin composition and bump forming resin composition