H01L2224/1152 - CPC Classification Index

ClassID:

209647 ⎘

H01L2224/1152 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material Self-assembly, e.g. self-agglomeration of the bump material in a fluid

Sub-classes:

H01L2224/11522 » Auxiliary means therefor, e.g. for self-assembly activation 14
H01L2224/11524 » with special adaptation of the surface or of an auxiliary substrate, e.g. surface shape specially adapted for the self-assembly process 6
H01L2224/11526 » involving the material of the bonding area, e.g. bonding pad or under bump metallisation [UBM] 4

Recent Application in this class:

20180047708

2018-02-15

Semiconductor packaging structure and method

20170179083

2017-06-22

Semiconductor packaging structure and method

20140317915

2014-10-30

Composition and methods of forming solder bump and flip chip using the same

20130187268

2013-07-25

Semiconductor packaging structure and method

20130001280

2013-01-03

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK

20120261174

2012-10-18

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, ELECTRONIC MEMBER WITH CONDUCTIVE CONNECTING MATERIAL AND ELECTRONIC COMPONENT

20110207048

2011-08-25

METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PRODUCTION DEVICE, AND PHOTOSENSITIVE RESIST

20110133137

2011-06-09

METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCESS AND BUMP-FORMING PROCESS USING THE SAME

20110114708

2011-05-19

Metal nanoink and process for producing the metal nanoink, and die bonding method and die bonding apparatus using the metal nanoink

#10

20110089577

2011-04-21

Method and structure for bonding flip chip

#11

20110049218

2011-03-03

Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film

#12

20110014785

2011-01-20

Method for manufacturing semiconductor device, and semiconductor manufacturing apparatus used in said method

#13

20100320596

2010-12-23

Method for fabricating a semiconductor package

#14

20100148376

2010-06-17

Flip chip mounting process and flip chip assembly

#15

20100052189

2010-03-04

Electronic component mounting structure and method for manufacturing the same

#16

20100047971

2010-02-25

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

#17

20100006625

2010-01-14

Composition and methods of forming solder bump and flip chip using the same

#18

20090203169

2009-08-13

Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method

#19

20090174052

2009-07-09

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

#20

20090162657

2009-06-25

Method for manufacturing metal chips by plasma from a layer comprising several elements

#21

20080197173

2008-08-21

Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition

#22

20080165518

2008-07-10

Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei

#23

20080142966

2008-06-19

Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same

#24

20080017995

2008-01-24

Flip chip mounting process and flip chip assembly

#25

20080011402

2008-01-17

#26

20070257362

2007-11-08

Process for forming bumps and solder bump

#27

20070001280

2007-01-04

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages