H01L2224/11524 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material; Self-assembly, e.g. self-agglomeration of the bump material in a fluid with special adaptation of the surface or of an auxiliary substrate, e.g. surface shape specially adapted for the self-assembly process

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