209650 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material; Self-assembly, e.g. self-agglomeration of the bump material in a fluid involving the material of the bonding area, e.g. bonding pad or under bump metallisation [UBM]
Bump structure of the semiconductor package
#2METAL ON MOLD COMPOUND IN FAN-OUT WAFER-LEVEL PACKAGING OF INTEGRATED CIRCUITS
#3Semiconductor package
#4Semiconductor structure and manufacturing method thereof