209651 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material Selective modification
Sub-classes:SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME
#2Contact structures with porous networks for solder connections, and methods of fabricating same
#3Semiconductor Device Manufacturing Method
#4Semiconductor Device and Method of Forming Substrate Having Conductive Columns
#5Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
#6Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
#7Semiconductor device and method for manufacturing semiconductor device
#8Electrically conductive structure on a semiconductor substrate formed from printing
#9ELECTRONIC COMPONENT FORMING APPARATUS, ELECTRONIC COMPONENT FORMED WITH IT AND FORMING METHOD THEREOF
#10Method of bonding
#11Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body