209652 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material; Selective modification using a laser or a focussed ion beam [FIB]
LASER ASSISTED BONDING METHOD
#2Conductive member cavities
#3Conductive member cavities
#4Semiconductor device manufacturing method and semiconductor device
#5Method of manufacturing chip-on-chip structure comprising sinterted pillars
#6Flip-chip hybridization of microelectronic components by local heating of connecting elements
#7Micro bump and method for forming the same
#8Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device
#9Conductive bump, method for producing the same, and electronic component mounted structure
#10CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING THE SAME
#11Method of providing solder bumps on a substrate using localized heating
#12Method for forming multi-layer bumps on a substrate
#13Method for forming multi-layer bumps on a substrate
#14Method for forming solder contacts on mounted substrates