Method of joining electronic package capable of prevention for brittle fracture

Method for producing electrically conductive bushings through non-conductive or semiconductive substrates

Chip and wafer integration process using vertical connections

Method of making reliable wafer level chip scale package semiconductor devices

Chip structure with bumps and testing pads

Power module having stacked flip-chip and method of fabricating the power module

Wiring substrate and electronic device

Wafer Level Package Using Silicon Via Contacts for Cmos Image Sensor and Method of Fabricating the Same

Phosphor composition and method for producing the same, and light-emitting device using the same

Semiconductor device and a method of manufacturing the same

IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND METHOD OF THE SAME

Encapsulated chip scale package having flip-chip on lead frame structure

Phosphor composition and method for producing the same, and light-emitting device using the same

Illumination System Comprising a Red-Emitting Ceramic Luminescence Converter

Glass dam structures for imaging devices chip scale package

Sensor semiconductor package and fabrication

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Phosphor composition and method for producing the same, and light-emitting device using the same

Light-emitting material, scintillator containing the light-emitting material, x-ray detector equipped with the scintillator, image display device using the light-emitting material, and light source using the light-emitting material

Semiconductor integrated circuit device including wiring lines and interconnections

Semiconductor device and package including the same

MOSFET package

Optical semiconductor package having an optical module with a progressively varying refractive index

Illumination System Comprising Ceramic Luminescence Converter

Method and apparatus for providing thermal management on high-power integrated circuit devices

MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF AND METHOD OF MAKING SAME

Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

SEMICONDUCTOR DEVICE HAVING ANTIFUSE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of protecting passivation layer in a solder bump process

Microelectronic packages having improved input/output connections and methods therefor

Chip structure and process for forming the same

Manufacturing method for semiconductor light emitting device

Electroluminescent module with thermal-conducting carrier substrate

Contact Pad And Bump Pad Arrangement for High-Lead Or Lead-Free Bumps

Chip structure and process for forming the same

Chip structure and process for forming the same

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH A CAPTURED PAD GEOMETRY

Method and structure for optimizing yield of 3-D chip manufacture

Semiconductor device

Stacked die in die BGA package

Chip structure and process for forming the same

Semiconductor device

Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications

Semiconductor device and manufacturing method of the same

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Semiconductor device and manufacturing method thereof

Intergrated Circuits Device Having a Reinforcement Structure

Semiconductor device having elastic solder bump to prevent disconnection

Stress decoupling structures for flip-chip assembly

Phosphor composition and method for producing the same, and light-emitting device using the same

Chip structure and process for forming the same

Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps

Silica nanoparticles thermoset resin compositions

Rotation joint and semiconductor device having the same

Chip structure and process for forming the same

Solder bump structure and method of manufacturing same

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME

SEMICONDUCTOR DEVICE INCLUDING CORROSION RESISTANT WIRING STRUCTURE

Method and system for fabricating semiconductor components with lens structures and lens support structures

Top layers of metal for integrated circuits

Interconnect For Microelectronic Structures With Enhanced Spring Characteristics

CMOS imager array with recessed dielectric

Solder joint reliability in microelectronic packaging

Method of sealing or welding two elements to one another

INTEGRATED CIRCUIT DIE/PACKAGE INTERCONNECT

Stacked die with a recess in a die BGA package

INTEGRATED CIRCUIT STRUCTURE, DISPLAY MODULE, AND INSPECTION METHOD THEREOF

Light-Emitting Device

CHIP STRUCTURE AND WAFER STRUCTURE

Integrated circuit with a reduced pad bump area and the manufacturing method thereof

Microelectronic packages fabricated at the wafer level and methods therefor

CHIP WITH BUMP STRUCTURE

Wafer-level interconnect for high mechanical reliability applications

Wafer level chip scale package of image sensor and manufacturing method thereof

Wafer level package structure of optical-electronic device and method for making the same

Electronic device and method of manufacturing the same

Oxynitride Phosphor and Light-Emitting Device

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

CHIP PACKAGE, CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF

MOULD HAVING NANO-SCALED HOLES

INTEGRATED CIRCUIT INTERCONNECTION DEVICES AND METHODS

Optical device and method for making the same

RELIABLE PRINTED WIRING BOARD ASSEMBLY EMPLOYING PACKAGES WITH SOLDER JOINTS AND RELATED ASSEMBLY TECHNIQUE

Structure of mounting electronic component

Electronic device and method of manufacturing the same

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Chip package and method for fabricating the same

Chip structure and process for forming the same

Chip structure and process for forming the same

Semiconductor package and method for manufacturing the same

Top layers of metal for integrated circuits

Semiconductor integrated circuit device and a method of manufacturing the same

Trace design to minimize electromigration damage to solder bumps

BUMP STRUCTURES AND PACKAGED STRUCTURES THEREOF

Stacked semiconductor components with through wire interconnects (TWI)

Solid state image pick-up device and method for manufacturing the same with increased structural integrity

Semiconductor integrated circuit device

Bond Wireless Package

Structure and method of making sealed capped chips

Chip scale package and method for manufacturing the same

Method of fabricating a stacked die having a recess in a die BGA package

Light emitting device, method of making the same, and light source device comprising the same

Semiconductor light emitting element and manufacturing method thereof

Electronic device including a conductive stud over a bonding pad region

Contact structure having a compliant bump and a testing area

Solder connector structure and method

Method and apparatus for precisely aligning integrated circuit chips

Semiconductor integrated circuit device

Pillar Bump Package Technology

Semiconductor device with a photoelectric converting portion and a light-shading means

Semiconductor device and method for manufacturing semiconductor device

THERMAL INTERFACE APPARATUS, SYSTEMS, AND FABRICATION METHODS

Semiconductor package substrate for flip chip packaging

Microelectronic imaging devices and associated methods for attaching transmissive elements

Die package and probe card structures and fabrication methods

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Interposer containing bypass capacitors for reducing voltage noise in an IC device

Integrated circuit (IC) package stacking and IC packages formed by same

INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING

CHIP STRUCTURE

Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same

Chip and flat panel display apparatus comprising the same

Semiconductor Device

Semiconductor photodetector and method of manufacturing the same

Low profile side emitting LED

IMAGE SENSING DEVICE AND PACKAGE METHOD THEREFOR

On-chip inductor using redistribution layer and dual-layer passivation

Semiconductor device and method for fabricating the same

System and method to reduce metal series resistance of bumped chip

Dual-sided chip attached modules

Super high density module with integrated wafer level packages

Method for fabricating semiconductor package with multi-layer die contact and external contact

Interconnection structure, electronic component and method of manufacturing the same

Phosphor composition and method for producing the same, and light-emitting device using the same

Semiconductor device including a buffer layer structure for reducing stress

Test pads on flash memory cards

Ceramic substrate for mounting a light emitting element and method for manufacturing the same

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device having a smaller electrostatic capacitance electrode

Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device

Solid-state imaging device, its production method, camera with the solid-state imaging device, and light receiving chip

Wafer level semiconductor module and method for manufacturing the same

Optical display package and the method thereof

Semiconductor die packages using thin dies and metal substrates

High frequency IC package and method for fabricating the same

Semiconductor device that improves electrical connection reliability

Semiconductor chip having fine pitch bumps and bumps thereon

Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium

SYSTEM AND METHOD FOR ADHERING LARGE SEMICONDUCTOR APPLICATIONS TO PCB

Chip package

Semiconductor integrated circuit device

Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry

Semiconductor wafer coat layers and methods therefor

Semiconductor device

Semiconductor light emitting element mounting member, and semiconductor light emitting device employing it

Compound semiconductor light-emitting device with AlGaInP light-emitting layer formed within

High-density illumination system

Composite bump

Semiconductor device and manufacturing method thereof

Integrated circuit package system

TEST CONTACT SYSTEM FOR TESTING INTEGRATED CIRCUITS WITH PACKAGES HAVING AN ARRAY OF SIGNAL AND POWER CONTACTS

Semiconductor packaging method

Method for manufacturing semiconductor device

Redistribution connecting structure of solder balls

Bond pad structures with reduced coupling noise

Chip underfill in flip-chip technologies

Semiconductor device and method of manufacturing semiconductor device

Integrated circuit architecture for reducing interconnect parasitics

Semiconductor device and method for manufacturing the semiconductor device

Connection structure and method for fabricating the same

Semiconductor device with signal line having decreased characteristic impedance

Patterned gold bump structure for semiconductor chip

Chip with bump structure

Method of fabricating wafer level package

Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same

Semiconductor device having a bump formed over an electrode pad

Method for forming a redistribution layer in a wafer structure

Semiconductor light emitting device with transparent substrate and reflective slope

Thin-film capacitor and method of manufacturing the same

Semiconductor device with surface-mountable external contacts and method for manufacturing the same

Semiconductor device having flange structure

Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)

Method of forming a microelectronic package and microelectronic package formed according to the method

Interconnection pattern design

Semiconductor package and fabricating method thereof

Substrate and semiconductor device

Semiconductor device having alignment post electrode and method of manufacturing the same

Semiconductor module and method of forming a semiconductor module

MEMS device seal using liquid crystal polymer

Method for fabricating semiconductor package with build-up layers formed on chip

Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same

Integrated circuit package-in-package system

Photodiode array, method for manufacturing same, and radiation detector

Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel

Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same

Package structure and manufacturing method thereof

Methods including fluxless chip attach processes

Super high-density module with integrated wafer level packages

Test pads on flash memory cards

Electronic micromodule and method for manufacturing the same

Compliant terminal mountings with vented spaces and methods

Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers

Low temperature bumping process

CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS

Super high-density module with integrated wafer level packages

Techniques for packaging multiple device components

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Flip-chip mounting substrate and flip-chip mounting method

Compliant terminal mountings with vented spaces and methods

Wafer-level flipchip package with IC circuit isolation

PAD STRUCTURE OF SEMICONDUCTOR DEVICE AND FORMATION METHOD

PAD STRUCTURE IN A SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A PAD STRUCTURE

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Projected contact structures for engaging bumped semiconductor devices

AllnGaP LED having reduced temperature dependence

Color-mixing LED

Integrated Circuit With Dual Electrical Attachment Pad Configuration

Mounting flexible circuits onto integrated circuit substrates

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device

Semiconductor components having through wire interconnects (TWI)

Interconnect assemblies and methods

Intermediate connection for flip chip in packages

Wiring board, electronic component mounting structure, and electronic component mounting method

Methods for fabricating protective layers on semiconductor device components

Semiconductor Device with Improved Stud Bump

Low Profile Stacking System and Method

Hybrid solder pad

Low Profile Stacking System and Method

Integrated circuit package system with bump pad

Integrated passive device system

Wafer level chip scale packaging structure and method of fabricating the same

Semiconductor device and method for manufacturing the same

Bonding pad with high bonding strength to solder ball and bump

Chip structure and manufacturing method of the same

Semiconductor device

Semiconductor device

Method of fabricating multi layer MEMS and microfluidic devices

CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME

Semiconductor device and manufacturing method of the same

Semiconductor device with solder balls having high reliability

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Back-face and edge interconnects for lidded package

Stacked wafer or die packaging with enhanced thermal and device performance

Semiconductor package with controlled solder bump wetting

Semiconductor device with a dummy electrode

SEMICONDUCTOR DEVICE

Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor

Method for manufacture of wafer level package with air pads

Chip scale power LDMOS device

Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure

Bump structure and its forming method

Method and structure for optimizing yield of 3-D chip manufacture

Electronic device with conductive connection structure

Optical imaging device for optical proximity communication

Resonator system for optical proximity communication

Method and apparatus for facilitating proximity communication and power delivery

Semiconductor device

Solder joint intermetallic compounds with improved ductility and toughness

Semiconductor chip and semiconductor device

Light emitting device

Semiconductor module and method of forming a semiconductor module

Semiconductor device and method for manufacturing same

Semiconductor sensor device with sensor chip and method for producing the same

Method of electrically connecting a microelectronic component

Semiconductor device

Light-receiving element, manufacturing method for the same, optical module, and optical transmitting device

Semiconductor device

Semiconductor device

Integrated circuit device mountable on both sides of a substrate and electronic apparatus

METHODS OF FABRICATING AND USING SHAPED SPRINGS

Metal duplex method

Manufacturing method of electronic device

Semiconductor device and method for fabricating the same

Metal duplex method

Electronic device and method of manufacturing thereof

Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness

Radiant energy heating for die attach

Wafer-level package and IC module assembly method for the wafer-level package

Pad open structure

Chip package and bump connecting structure thereof

Wafer structure with a multi-layer barrier in an UBM layer network device with power supply

Printed wiring board and method for fabricating the same

Ball grid array interface structure and method

Lead-containing solder bumps

Insulating layer between bumps of semiconductor chip, and display panel using the same with anisotropic conductive film between semiconductor chip and substrate

Lead-containing solder paste

Lead-containing anodes

Wafer integrated rigid support ring

Microfeature assemblies including interconnect structures and methods for forming such interconnect structures

Microelectronic imaging devices and associated methods for attaching transmissive elements

Encapsulated chip scale package having flip-chip on lead frame structure and method

Chip packages with covers

Semiconductor device

MOSFET package

MOSFET package

Semiconductor device

Semiconductor device

Integrated circuit with low-stress under-bump metallurgy

Chip-sized flip-chip semiconductor package and method for making the same