NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES

Three-dimensional semiconductor device comprising an inter-die connection on the basis of functional molecules

METALLURGY FOR COPPER PLATED WAFERS

Manufacturing method of semiconductor device and semiconductor device

Method for manufacturing semiconductor device, and semiconductor manufacturing apparatus used in said method

Structure and method for forming pillar bump structure having sidewall protection

Manufacturing method of semiconductor device including Au bump on seed film

Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT

Stress-engineered interconnect packages with activator-assisted molds

Manufacturing method for electronic devices

Bump pad structure

In-situ cavity integrated circuit package

High quality electrical contacts between integrated circuit chips

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULES

Filp chip interconnection structure with bump on partial pad and method thereof

Active device array substrate with particular test circuit

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

TCP-type semiconductor device

Manufacturing method of mounting part of semiconductor light emitting element, manufacturing method of light emitting device, and semiconductor light emitting element

Solder bump UBM structure

Semiconductor device and method for manufacturing semiconductor device

METHOD OF FORMING CONNECTION TERMINAL

Underbump metallization structure

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

Micro-machined structure production using encapsulation

Double-coated pressure sensitive adhesive sheet for fixing flexible printed circuit board

Method of manufacturing semiconductor device

Structures and methods for improving solder bump connections in semiconductor devices

Structures and methods for improving solder bump connections in semiconductor devices

Bonding inspection structure

Package carrier

Solder joints with enhanced electromigration resistance

Wafer structure with conductive bumps and fabrication method thereof

Light emitting device and method for manufacturing same

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE MODULE

Interconnection of lead frame to die utilizing flip chip process

Device mounting board and semiconductor module

Method of manufacturing semiconductor device

Semiconductor device and connection checking method for semiconductor device

Solder ball mounting method and apparatus

Method of thinning a block transferred to a substrate

Semiconductor integrated circuit devices and display apparatus including the same

Metal line in semiconductor device and method for forming the same

Conductive paths for transmitting an electrical signal through an electrical connector

BUMPED CHIP WITH DISPLACEMENT OF GOLD BUMPS

Chip structure and chip package structure

Electrical Component

Voltage switchable dielectric material containing conductor-on-conductor core shelled particles

Semiconductor package having bump ball

Metallic bump structure without under bump metallurgy and manufacturing method thereof

Method for manufacturing semiconductor device having electrode for external connection

Methods of forming solder connections and structure thereof

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Crystal structure of a solder bump of flip chip semiconductor device

Semiconductor device and method of fabricating semiconductor device

PRESSURE-HEATING APPARATUS AND METHOD

Conductive nanowires for electrical interconnect

PROCESS FOR COATING A BUMPED SEMICONDUCTOR WAFER

Image sensor package and camera module utilizing the same

Adhesive composition

Interconnection of lead frame to die utilizing flip chip process

Intermetallic diffusion block device and method of manufacture

Semiconductor chip having TSV (through silicon via) and stacked assembly including the chips

Integrated circuit system having different-size solder bumps and different-size bonding pads

Contact structure and forming method thereof and connecting structure thereof

Flip chip interconnection structure with bump on partial pad and method thereof

Semiconductor device and semiconductor device manufacturing method

Semiconductor device manufacturing method

Method and system for improving alignment precision of parts in MEMS

Electrical connecting structure and bonding structure

Wafer processing method for processing wafer having bumps formed thereon

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Method for manufacturing metal chips by plasma from a layer comprising several elements

METHOD FOR FORMING FILM PATTERN, METHOD FOR FORMING CONTACT HOLE, METHOD FOR FORMING BUMP, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus

Manufacturing method of contact structure

Multi-die processor

Manufacturing method for electronic devices

Method for fabricating electrical bonding pads on a wafer

Solder ball attachment ring and method of use

Multilayer pillar for reduced stress interconnect and method of making same

I/O pad structures for integrated circuit devices

Heat-resistant resin paste and method for producing same

Method of testing using a temporary chip attach carrier

Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layer

Power semiconductor component with metal contact layer and production method therefor

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

Method for producing a matrix for detecting electromagnetic radiation and method for replacing an elementary module of such a detection matrix

Demountable interconnect structure

Temporary chip attach carrier

High power density switch module with improved thermal management and packaging

Structure and method for enhancing resistance to fracture of bonding pads

Solder composition doped with a barrier component and method of making same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method for manufacturing the same

Conductive structure for a semiconductor integrated circuit and method for forming the same

Apparatus and method for semiconductor wafer bumping via injection molded solder

Apparatus and method for semiconductor wafer bumping via injection molded solder

Apparatus and method for semiconductor wafer bumping via injection molded solder

Semiconductor device

Under bump metallurgy structure of a package and method of making same

Micro-machined structure production using encapsulation

Method and apparatus for applying external coating to grid array packages for increased reliability and performance

Structure and method for enhancing resistance to fracture of bonding pads

Semiconductor device

Microball placement solutions

Camera module and assembling process thereof

Semiconductor device contact resistant to deterioration due to heat and method for manufacturing contact

Contact structure having a compliant bump and a test pad

BLM structure for application to copper pad

Integrated circuit mount system with solder mask pad

Methods of forming solder connections and structure thereof

METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS

Chip level biostable interconnect for implantable medical devices

Method for forming C4 connections on integrated circuit chips and the resulting devices

Space transformer having multi-layer pad structures

Method, system, and apparatus for gravity assisted chip attachment

STACKED CONTACT BUMP

Semiconductor device and manufacturing method for the same

Semiconductor device, method of manufacturing the same, and camera module

Manufacturing method for semiconductor device and semiconductor device

Bonding apparatus having adjacent hot-heads for liquid crystal display manufacture

Flip-chip light emitting diode device without sub-mount

Photosensitive composition

Integrated circuit solder bumping system

Mechanical integrity evaluation of low-k devices with bump shear

Method and apparatus for applying external coating to grid array packages for increased reliability and performance

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Chip level biostable interconnect for implantable medical devices

Method for depositing an adhesion-promoting layer on a metallic layer of a chip

Solder structures for out of plane connections

Micro-machined structure production using encapsulation

Method for forming interconnects on thin wafers

Contact structure for nanometer characteristic dimensions

Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance

Multi-chip package structure

Underfill system for die-over-die arrangements

Anisotropic conductive sheet and manufacture thereof

Method for mounting semiconductor chips and corresponding semiconductor chip system

Flip-chip light emitting diode device without sub-mount

Manufacturing method for semiconductor device and semiconductor device

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Methods of providing solder structures for out plane connections

Multi-die processor