Patents-Review.com
ClassID:

209703 ⎘

H01L2224/13599 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector; Coating Material

Recent Application in this class:
#1
20250246576
2025-07-31

ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME

 #2
20190096797
2019-03-28

Method for manufacturing package structure having elastic bump

 #3
20170339785
2017-11-23

Electronic device having a liquid crystal polymer solder mask and related devices

 #4
20160035948
2016-02-04

Electronic component and electronic unit

 #5
20160035686
2016-02-04

Methods of forming flip chip systems

 #6
20150294949
2015-10-15

Metal contact for chip packaging structure

 #7
20140054776
2014-02-27

Devices for metallization

 #8
20130120054
2013-05-16

Die power structure

 #9
20130075884
2013-03-28

Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method

 #10
20130056869
2013-03-07

Pillar structure having a non-planar surface for semiconductor devices

 #11
20130049233
2013-02-28

Chip package and method for making same

 #12
20130037926
2013-02-14

Lead assembly for a flip-chip power switch

 #13
20130032941
2013-02-07

Routing layer for mitigating stress in a semiconductor die

 #14
20130027623
2013-01-31

Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device

 #15
20130015577
2013-01-17

Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking

 #16
20130001778
2013-01-03

Bump-on-trace (BOT) structures

 #17
20130001773
2013-01-03

Semiconductor Device and Method of Forming a Wafer Level Package Structure Using Conductive Via and Exposed Bump

 #18
20120329212
2012-12-27

Recovery method for poor yield at integrated circuit die panelization

 #19
20120321907
2012-12-20

BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS

 #20
20120312447
2012-12-13

Multilayer pillar for reduced stress interconnect and method of making same

 #21
20120299180
2012-11-29

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

 #22
20120299174
2012-11-29

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

 #23
20120292761
2012-11-22

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

 #24
20120286398
2012-11-15

SEMICONDUCTOR CHIP MODULE AND PLANAR STACK PACKAGE HAVING THE SAME

 #25
20120280386
2012-11-08

Package-on-package assembly with wire bonds to encapsulation surface

 #26
20120280308
2012-11-08

Vertical power transistor die packages and associated methods of manufacturing

 #27
20120276377
2012-11-01

Cover tape, method for manufacturing cover tape, and electronic part package

 #28
20120273945
2012-11-01

Integrated circuit device including a copper pillar capped by barrier layer

 #29
20120273942
2012-11-01

Flip-chip Mounting Structure and Flip-chip Mounting Method

 #30
20120273941
2012-11-01

Package structure having embedded electronic component and fabrication method thereof

 #31
20120273940
2012-11-01

SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME

 #32
20120273934
2012-11-01

Reduced-stress bump-on-trace (BOT) structures

 #33
20120273931
2012-11-01

Integrated circuit chip package and manufacturing method thereof

 #34
20120273929
2012-11-01

Multi-die packages incorporating flip chip dies and associated packaging methods

 #35
20120270396
2012-10-25

Etchant and method for manufacturing semiconductor device using same

 #36
20120270388
2012-10-25

Routing layer for mitigating stress in a semiconductor die

 #37
20120268147
2012-10-25

STRUCTURE FOR MEASURING BUMP RESISTANCE AND PACKAGE SUBSTRATE COMPRISING THE SAME

 #38
20120267788
2012-10-25

Hybrid TSV and method for forming the same

 #39
20120267786
2012-10-25

Microelectronic devices with through-silicon vias and associated methods of manufacturing

 #40
20120267778
2012-10-25

Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device

 #41
20120267731
2012-10-25

Sensor mounted in flip-chip technology on a substrate

 #42
20120267149
2012-10-25

Method of manufacturing power module substrate and power module substrate

 #43
20120264258
2012-10-18

Method of assembling semiconductor device including insulating substrate and heat sink

 #44
20120264257
2012-10-18

MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES

 #45
20120262883
2012-10-18

Heat radiator and manufacturing method thereof

 #46
20120262231
2012-10-18

Contact and contactless differential I/O pads for chip-to-chip communication and wireless probing

 #47
20120261812
2012-10-18

SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION

 #48
20120261809
2012-10-18

Chip package and manufacturing method thereof

 #49
20120261608
2012-10-18

Etchant and method for manufacturing semiconductor device using same

 #50
20120261171
2012-10-18

ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE, AND CONNECTING METHOD

 #51
20120256312
2012-10-11

Semiconductor device and method for fabricating the same

 #52
20120255771
2012-10-11

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

 #53
20120252168
2012-10-04

Copper post solder bumps on substrate

 #54
20120252166
2012-10-04

Semiconductor device manufacturing apparatus and method for manufacturing semiconductor device

 #55
20120252163
2012-10-04

Stacked package, method of fabricating stacked package, and method of mounting stacked package fabricated by the method

 #56
20120248623
2012-10-04

Via network structures and method therefor

 #57
20120248621
2012-10-04

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS

 #58
20120248600
2012-10-04

Semiconductor device having plural stacked chips

 #59
20120248586
2012-10-04

SEMICONDUCTOR APPARATUS FOR PREVENTING CROSSTALK BETWEEN SIGNAL LINES

 #60
20120248539
2012-10-04

Flip chip semiconductor device

 #61
20120241973
2012-09-27

Integrated circuit packaging system with filled vias and method of manufacture thereof

 #62
20120241964
2012-09-27

Integrated circuit packaging system with interconnects and method of manufacture thereof

 #63
20120241962
2012-09-27

Integrated circuit packaging system with lead frame etching and method of manufacture thereof

 #64
20120241949
2012-09-27

Semiconductor device, method of manufacturing the same, and method of manufacturing wiring board

 #65
20120241928
2012-09-27

Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof

 #66
20120241926
2012-09-27

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METHOD OF MANUFACTURE THEREOF

 #67
20120241923
2012-09-27

IC wafer having electromagnetic shielding effects and method for making the same

 #68
20120241915
2012-09-27

Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die

 #69
20120236230
2012-09-20

DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

 #70
20120235304
2012-09-20

ULTRAVIOLET (UV)-REFLECTING FILM FOR BEOL PROCESSING

 #71
20120235301
2012-09-20

Semiconductor apparatus including a metal alloy between a first contact and a second contact

 #72
20120235291
2012-09-20

Semiconductor apparatus and method for manufacturing the same

 #73
20120235278
2012-09-20

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM USING THE SAME

 #74
20120235227
2012-09-20

Power semiconductor device

 #75
20120234584
2012-09-20

Substrate for mounting semiconductor chip and method for producing same

 #76
20120231583
2012-09-13

DIE-BONDING FILM AND USE THEREOF

 #77
20120231557
2012-09-13

Method of manufacturing film for semiconductor device

 #78
20120231236
2012-09-13

Dicing film with protecting film

 #79
20120228769
2012-09-13

Carrier-free semiconductor package

 #80
20120228764
2012-09-13

Package structure, fabricating method thereof, and package-on-package device thereby

 #81
20120228696
2012-09-13

STACKED DIE POWER CONVERTER

 #82
20120228004
2012-09-13

Carrier structure and manufacturing method thereof

 #83
20120225198
2012-09-06

Conductive metal ink composition and method for forming a conductive pattern

 #84
20120223435
2012-09-06

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF

 #85
20120223434
2012-09-06

Co-axial restraint for connectors within flip-chip packages

 #86
20120223433
2012-09-06

SEMICONDUCTOR PACKAGE INCLUDING CONNECTING MEMBER HAVING CONTROLLED CONTENT RATIO OF GOLD

 #87
20120223430
2012-09-06

Solder ball for semiconductor packaging and electronic member using the same

 #88
20120223428
2012-09-06

Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate

 #89
20120222808
2012-09-06

MOUNTING DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE

 #90
20120217640
2012-08-30

Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer

 #91
20120217632
2012-08-30

Extending metal traces in bump-on-trace structures

 #92
20120217629
2012-08-30

Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump

 #93
20120212918
2012-08-23

Electrical component having an electrical connection arrangement and method for the manufacture thereof

 #94
20120211901
2012-08-23

Semiconductor device, manufacturing method of semiconductor device, and power source device

 #95
20120211895
2012-08-23

CHIP MODULE AND METHOD FOR PROVIDING A CHIP MODULE

 #96
20120211891
2012-08-23

Anchoring structure and intermeshing structure

 #97
20120211884
2012-08-23

WAFER CHIP SCALE PACKAGE CONNECTION SCHEME

 #98
20120211549
2012-08-23

Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device

 #99
20120211257
2012-08-23

Pyramid bump structure

 #100
20120205797
2012-08-16

BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME

 #101
20120205796
2012-08-16

Semiconductor package and method for manufacturing the same

 #102
20120205626
2012-08-16

Semiconductor chip with graphene based devices in an interconnect structure of the chip

 #103
20120199988
2012-08-09

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE

 #104
20120199968
2012-08-09

SEMICONDUCTOR PACKAGE

 #105
20120199966
2012-08-09

Elongated bump structure for semiconductor devices

 #106
20120196390
2012-08-02

3D integrated circuit with logic

 #107
20120193800
2012-08-02

Solder, soldering method, and semiconductor device

 #108
20120193782
2012-08-02

Semiconductor device, method of manufacturing semiconductor device, and electronic device

 #109
20120193781
2012-08-02

CUSTOMIZED RF MEMS CAPACITOR ARRAY USING REDISTRIBUTION LAYER

 #110
20120187509
2012-07-26

Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components

 #111
20120182703
2012-07-19

Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices

 #112
20120182702
2012-07-19

Method of making an electronic device having a liquid crystal polymer solder mask and related devices

 #113
20120182651
2012-07-19

Shared Electrostatic Discharge Protection For Integrated Circuits, Integrated Circuit Assemblies And Methods For Protecting Input/Output Circuits

 #114
20120182355
2012-07-19

Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties

 #115
20120182082
2012-07-19

Method and device for routing over a void for high speed signal routing in electronic systems

 #116
20120181708
2012-07-19

Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device

 #117
20120181688
2012-07-19

Packaging substrate with conductive structure

 #118
20120181672
2012-07-19

Chip package and method for forming the same

 #119
20120181290
2012-07-19

Package carrier and manufacturing method thereof

 #120
20120181071
2012-07-19

Multilayer pillar for reduced stress interconnect and method of making same

 #121
20120175746
2012-07-12

Selective Deposition in the Fabrication of Electronic Substrates

 #122
20120175660
2012-07-12

Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device

 #123
20120171866
2012-07-05

Substrate structure including functional region and method for transferring functional region

 #124
20120171858
2012-07-05

Method of manufacturing semiconductor device

 #125
20120171362
2012-07-05

HYDROCARBON ADHESIVE COMPOSITION AND METHOD FOR TREATING SUBSTRATE SURFACE USING SAME

 #126
20120170237
2012-07-05

Substrate assembly provided with capacitive interconnections, and manufacturing method thereof

 #127
20120168956
2012-07-05

CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDER BUMP CONTACTS

 #128
20120168944
2012-07-05

Through hole via filling using electroless plating

 #129
20120168937
2012-07-05

FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

 #130
20120168929
2012-07-05

Semiconductor package and method of manufacturing the same

 #131
20120168920
2012-07-05

LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

 #132
20120168210
2012-07-05

Methods and Structures Involving Terminal Connections

 #133
20120161856
2012-06-28

Die power structure

 #134
20120161336
2012-06-28

Semiconductor device and assembling method thereof

 #135
20120161331
2012-06-28

Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same

 #136
20120161323
2012-06-28

SUBSTRATE FOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

 #137
20120161314
2012-06-28

Template wafer and process for small pitch flip-chip interconnect hybridization

 #138
20120161312
2012-06-28

NON-SOLDER METAL BUMPS TO REDUCE PACKAGE HEIGHT

 #139
20120161129
2012-06-28

Method and apparatus of fabricating a pad structure for a semiconductor device

 #140
20120160539
2012-06-28

CONDUCTIVE ADHESIVE TAPE

 #141
20120153509
2012-06-21

Semiconductor package and manufacturing method therefor

 #142
20120153506
2012-06-21

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

 #143
20120153500
2012-06-21

Semiconductor devices and methods of manufacturing semiconductor devices

 #144
20120153499
2012-06-21

Semiconductor package and package on package having the same

 #145
20120153475
2012-06-21

Method of assembling two integrated circuits and corresponding structure

 #146
20120153473
2012-06-21

LEAD PIN FOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE PRINTED CIRCUIT BOARD INCLUDING THE SAME

 #147
20120153465
2012-06-21

Package structure

 #148
20120153460
2012-06-21

Bump structure and manufacturing method thereof

 #149
20120153449
2012-06-21

Method of manufacturing non-leaded package structure

 #150
20120146236
2012-06-14

Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure

 #151
20120146216
2012-06-14

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

 #152
20120146215
2012-06-14

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

 #153
20120146213
2012-06-14

High performance low profile QFN/LGA

 #154
20120146203
2012-06-14

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

 #155
20120146202
2012-06-14

Top exposed package and assembly method

 #156
20120146177
2012-06-14

Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integration

 #157
20120146153
2012-06-14

Chip package and method for forming the same

 #158
20120145446
2012-06-14

Brace for long wire bond

 #159
20120145019
2012-06-14

Roller microcontact printing device and printing method thereof

 #160
20120141786
2012-06-07

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

 #161
20120139120
2012-06-07

Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package

 #162
20120139107
2012-06-07

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING THE CHIP

 #163
20120139100
2012-06-07

Laminated transferable interconnect for microelectronic package

 #164
20120133379
2012-05-31

Mechanisms for resistivity measurement of bump structures

 #165
20120133040
2012-05-31

Semiconductor chip and solar system

 #166
20120131979
2012-05-31

Fin fabrication process for entrainment heat sink

 #167
20120127659
2012-05-24

HEATING SPREADING ELEMENT WITH ALN FILM AND METHOD FOR MANUFACTURING THE SAME

 #168
20120126429
2012-05-24

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

 #169
20120125669
2012-05-24

PACKAGE CARRIER

 #170
20120122311
2012-05-17

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

 #171
20120119372
2012-05-17

Semiconductor device and method of manufacturing the same

 #172
20120119370
2012-05-17

Semiconductor package and semiconductor system including the same

 #173
20120119369
2012-05-17

Semiconductor device

 #174
20120119357
2012-05-17

SEMICONDUCTOR APPARATUS

 #175
20120119345
2012-05-17

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF MANUFACTURE THEREOF

 #176
20120118939
2012-05-17

PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #177
20120118480
2012-05-17

ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND ELECTRONIC PARTS CONNECTION METHOD USING SAME

 #178
20120112622
2012-05-10

Light emitting device with electrode having recessed concave portion

 #179
20120112361
2012-05-10

Semiconductor devices and methods of manufacturing the same

 #180
20120112343
2012-05-10

Electroplated posts with reduced topography and stress

 #181
20120112339
2012-05-10

SEMICONDUCTOR DEVICE

 #182
20120111612
2012-05-10

THERMOSETTING ADHESIVE TAPE OR SHEET, AND FLEXIBLE PRINTED CIRCUIT BOARD

 #183
20120111610
2012-05-10

HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

 #184
20120108034
2012-05-03

Substrate Structure Having Buried Wiring And Method For Manufacturing The Same, And Semiconductor Device And Method For Manufacturing The Same Using The Substrate Structure

 #185
20120106172
2012-05-03

Encapsulating method for sealed and water-proof LED and luminescent holder

 #186
20120106111
2012-05-03

ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAGNETIC NANO-PARTICLES

 #187
20120106109
2012-05-03

Power module using sintering die attach and manufacturing method thereof

 #188
20120104624
2012-05-03

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

 #189
20120104622
2012-05-03

Through level vias and methods of formation thereof

 #190
20120104602
2012-05-03

Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device

 #191
20120103668
2012-05-03

Chip Package

 #192
20120103475
2012-05-03

METHOD OF MANUFACTURING METAL BASE PACKAGE WITH VIA

 #193
20120098144
2012-04-26

VERTICAL ELECTRODE STRUCTURE USING TRENCH AND METHOD FOR FABRICATING THE VERTICAL ELECTRODE STRUCTURE

 #194
20120098143
2012-04-26

METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE

 #195
20120098141
2012-04-26

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

 #196
20120098125
2012-04-26

Integrated circuit package and physical layer interface arrangement

 #197
20120098124
2012-04-26

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME

 #198
20120097972
2012-04-26

Light emitting device and method for manufacturing same

 #199
20120091578
2012-04-19

Semiconductor chip having different pad width to UBM width ratios and method of manufacturing the same

 #200
20120091576
2012-04-19

Under-bump metallization (UBM) structure and method of forming the same

 #201
20120091562
2012-04-19

Semiconductor package

 #202
20120086004
2012-04-12

Elastic encapsulated carbon nanotube based electrical contacts

 #203
20120083116
2012-04-05

Cost-effective TSV formation

 #204
20120081868
2012-04-05

Electronic assemblies and methods of forming electronic assemblies

 #205
20120080088
2012-04-05

Method of Contacting a Semiconductor Substrate

 #206
20120074578
2012-03-29

Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element

 #207
20120073869
2012-03-29

Conductive adhesive, and circuit board and electronic component module using the same

 #208
20120068355
2012-03-22

Semiconductor device and method for manufacturing the same

 #209
20120068333
2012-03-22

Wire bond through-via structure and method

 #210
20120067940
2012-03-22

ELECTRICAL CONTACT STRUCTURES SUITABLE FOR USE ON WAFER TRANSLATORS AND METHODS OF MAKING SAME

 #211
20120061832
2012-03-15

Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate

 #212
20120061828
2012-03-15

Semiconductor device having metal posts non-overlapping with other devices and layout method of semiconductor device

 #213
20120061822
2012-03-15

Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking

 #214
20120056334
2012-03-08

Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting

 #215
20120052677
2012-03-01

Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process

 #216
20120049367
2012-03-01

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

 #217
20120049343
2012-03-01

Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method

 #218
20120040524
2012-02-16

Process for making conductive post with footing profile

 #219
20120037687
2012-02-16

Capillary and ultrasonic transducer for ultrasonic bonding

 #220
20120037411
2012-02-16

Packaging substrate having embedded passive component and fabrication method thereof

 #221
20120032338
2012-02-09

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

 #222
20120021174
2012-01-26

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, AND DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

 #223
20120021170
2012-01-26

Micro-machined structure production using encapsulation

 #224
20120019967
2012-01-26

Electrostatic discharge (ESD) protection for electronic devices using wire-bonding

 #225
20120018883
2012-01-26

CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT

 #226
20120007239
2012-01-12

Methods, devices, and materials for metallization

 #227
20120007231
2012-01-12

Method of forming Cu pillar capped by barrier layer

 #228
20120006803
2012-01-12

Implementing selective rework for chip stacks and silicon carrier assemblies

 #229
20120003465
2012-01-05

SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTERED BOND

 #230
20110317386
2011-12-29

CONNECTING STRUCTURE, CIRCUIT DEVICE AND ELECTRONIC APPARATUS

 #231
20110316154
2011-12-29

Semiconductor device having semiconductor substrate, and method of manufacturing the same

 #232
20110316153
2011-12-29

Protection film having a plurality of openings above an electrode pad

 #233
20110315429
2011-12-29

Metal coating for indium bump bonding

 #234
20110309515
2011-12-22

Semiconductor chip having staggered arrangement of bonding pads

 #235
20110309505
2011-12-22

Electrode pad having a recessed portion

 #236
20110309504
2011-12-22

Stack type semiconductor package

 #237
20110309454
2011-12-22

Combined packaged power semiconductor device

 #238
20110305883
2011-12-15

Adhesive resin compositions, and laminates and flexible printed wiring boards using same

 #239
20110304058
2011-12-15

Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad

 #240
20110304030
2011-12-15

Semiconductor device and manufacturing method thereof

 #241
20110293962
2011-12-01

Solder joints with enhanced electromigration resistance

 #242
20110290864
2011-12-01

SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE

 #243
20110287628
2011-11-24

Activation treatments in plating processes

 #244
20110284841
2011-11-24

Semiconductor device including external connection pads and test pads

 #245
20110281445
2011-11-17

Socket connector assembly with compressive contacts

 #246
20110281430
2011-11-17

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

 #247
20110281375
2011-11-17

Magnetic microelectronic device attachment

 #248
20110281136
2011-11-17

COPPER-MANGANESE BONDING STRUCTURE FOR ELECTRONIC PACKAGES

 #249
20110281119
2011-11-17

Adhesive composition

 #250
20110278716
2011-11-17

Method of fabricating bump structure

 #251
20110277861
2011-11-17

Ventilating apparatus

 #252
20110277858
2011-11-17

Ventilating apparatus

 #253
20110266039
2011-11-03

Method of mounting devices in substrate and device-mounting substrate structure thereof

 #254
20110262861
2011-10-27

Photosensitive composition

 #255
20110260339
2011-10-27

Semiconductor device

 #256
20110260317
2011-10-27

Cu pillar bump with electrolytic metal sidewall protection

 #257
20110259941
2011-10-27

APPARATUS FOR MONITORING BONDING SURFACE BOUNCING, WIRE BONDING APPARATUS HAVING THE SAME AND METHOD FOR MONITORING BONDING SURFACE BOUNCING

 #258
20110254161
2011-10-20

Integrated Circuit Package Having Under-Bump Metallization

 #259
20110254154
2011-10-20

Routing layer for mitigating stress in a semiconductor die

 #260
20110253767
2011-10-20

Manufacturing method for electronic devices

 #261
20110237065
2011-09-29

SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME

 #262
20110233766
2011-09-29

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

 #263
20110228535
2011-09-22

METHOD AND STRUCTURES OF A MINIATURIZED LINE LAMP

 #264
20110210419
2011-09-01

Multi-chip package with improved signal transmission

 #265
20110209548
2011-09-01

Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts

 #266
20110203731
2011-08-25

Method for mounting a component

 #267
20110199569
2011-08-18

Wiring board and liquid crystal display device

 #268
20110199116
2011-08-18

METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE

 #269
20110198388
2011-08-18

Flux-free chip to wafer joint serial thermal processor arrangement

 #270
20110193239
2011-08-11

Semiconductor element and display device provided with the same

 #271
20110193220
2011-08-11

Pillar structure having a non-planar surface for semiconductor devices

 #272
20110182046
2011-07-28

ELECTRONIC CIRCUIT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

 #273
20110180920
2011-07-28

Co-axial restraint for connectors within flip-chip packages

 #274
20110169143
2011-07-14

Method for establishing and closing a trench of a semiconductor component

 #275
20110163454
2011-07-07

Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device

 #276
20110156256
2011-06-30

Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

 #277
20110151657
2011-06-23

Method for fabricating electrical bonding pads on a wafer

 #278
20110151645
2011-06-23

Manufacturing method of semiconductor device

 #279
20110147950
2011-06-23

METALLIZATION LAYER STRUCTURE FOR FLIP CHIP PACKAGE

 #280
20110140269
2011-06-16

Semiconductor device and method for manufacturing the same

 #281
20110136270
2011-06-09

Method for manufacturing semiconductor device

 #282
20110134618
2011-06-09

CONNECTION STRUCTURE FOR CHIP-ON-GLASS DRIVER IC AND CONNECTION METHOD THEREFOR

 #283
20110126409
2011-06-02

Method of manufacturing printed circuit board

 #284
20110122592
2011-05-26

First-level interconnects with slender columns, and processes of forming same

 #285
20110120614
2011-05-26

THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE THERMOSETTING ADHESIVE FILM OR THE ADHESIVE FILM WITH DICING FILM

 #286
20110111217
2011-05-12

SILICONE BASE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND FILM

 #287
20110108994
2011-05-12

Integrated circuits and methods for forming the integrated circuits

 #288
20110101527
2011-05-05

Mechanisms for forming copper pillar bumps

 #289
20110101523
2011-05-05

PILLAR BUMP WITH BARRIER LAYER

 #290
20110095415
2011-04-28

Routing layer for mitigating stress in a semiconductor die

 #291
20110092064
2011-04-21

Preventing UBM oxidation in bump formation processes

 #292
20110086505
2011-04-14

METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFACTURING METHOD THEREOF

 #293
20110084381
2011-04-14

Chip having a metal pillar structure

 #294
20110079897
2011-04-07

Integrated circuit chip and flip chip package having the integrated circuit chip

 #295
20110079894
2011-04-07

Template process for small pitch flip-chip interconnect hybridization

 #296
20110074034
2011-03-31

Method for manufacturing a semiconductor component

 #297
20110073355
2011-03-31

Interposer and electronic device

 #298
20110062580
2011-03-17

Protection layer for preventing UBM layer from chemical attack and oxidation

 #299
20110058348
2011-03-10

SEMICONDUCTOR DEVICE

 #300
20110049707
2011-03-03

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE