H01L2224/1605 - CPC Classification Index

ClassID:

209721 ⎘

H01L2224/1605 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector Shape

Sub-classes:

H01L2224/16052 » in top view 17
H01L2224/16057 » in side view 139
H01L2224/1607 » of bonding interfaces, e.g. interlocking features 65

Recent Application in this class:

20170352634

Semiconductor device and manufacturing method thereof

20170125318

Electronic component package and method of manufacturing the same

20150303162

INTEGRATED CIRCUIT CHIP AND DISPLAY APPARATUS

20150147851

No flow underfill or wafer level underfill and solder columns

20150147846

No flow underfill or wafer level underfill and solder columns

20140217584

Flow underfill for microelectronic packages

20130062757

No flow underfill or wafer level underfill and solder columns

20120168937

FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

20120104595

No flow underfill

20120098126

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

20120088362

Thermal compressive bond head