209723 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector; Shape in side view
ELECTRONIC MODULE AND MANUFACTURING METHOD OF ELECTRONIC MODULE
#2PACKAGE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE
#3ELECTRONIC DEVICE
#4INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL INTERCONNECTS THERMALLY COUPLING A DIE TO AN INTERPOSER SUBSTRATE FOR DISSIPATING THERMAL ENERGY OF THE DIE, AND RELATED FABRICATION METHODS
#5SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS
#6REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED COMPONENT
#7DISPLAY DEVICE
#8PACKAGE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE
#9Substrate bonding method
#10Semiconductor device with composite middle interconnectors
#11THREE-DIMENSIONAL FAN-OUT MEMORY PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
#12PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
#13Semiconductor device with interconnectors of different density
#14Semiconductor device with composite middle interconnectors
#15THREE-DIMENSIONAL FAN-OUT INTEGRATED PACKAGE STRUCTURE, PACKAGING METHOD THEREOF, AND WIRELESS HEADSET
#16STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
#17Supporting backplane, manufacturing method therefor and backplane
#18SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
#19METHOD OF MANUFACTURING LIGHT-RECEIVING DEVICE AND LIGHT-RECEIVING DEVICE
#20SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#21Package structure and method for forming the same
#22Electronic device
#23Manufacturing method of an electronic apparatus
#24Semiconductor storage device
#25Semiconductor storage device
#26Semiconductor package and method for manufacturing the same
#27Electronic circuit connection method and electronic circuit
#28SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
#29Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#30High frequency module and communication device
#31Fan-out semiconductor package
#32Package-on-package (PoP) structure including stud bulbs
#33Mechanisms for forming hybrid bonding structures with elongated bumps
#34Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same
#35SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#36METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIVE AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
#37Multi-package integrated circuit assembly with package on package interconnects
#38Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#39Embedded graphite heat spreader for 3DIC
#40Package structure, fan-out package structure and method of the same
#41Solder bump stretching method
#42Chip alignment utilizing superomniphobic surface treatment of silicon die
#43Package-on-package (PoP) structure including stud bulbs
#44Deformable conductive contacts
#45Wiring substrate and semiconductor device
#46Semiconductor device substrate, semiconductor device wiring member and method for manufacturing them, and method for manufacturing semiconductor device using semiconductor device substrate
#47Contact area design for solder bonding
#48SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#49METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
#50Chip alignment utilizing superomniphobic surface treatment of silicon die
#51Compact optical transceiver by hybrid multichip integration
#52Bonding structure and method for producing bonding structure
#53Multi-chip microelectronic assembly with built-up fine-patterned circuit structure
#54Mechanisms for forming hybrid bonding structures with elongated bumps
#55Semiconductor chip mounted on a packaging substrate
#56Semiconductor device with a gap control electrode and method of manufacturing the semiconductor device
#57SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#58THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#59Systems and methods for package on package through mold interconnects
#60Semiconductor device and method of forming DCALGA package using semiconductor die with micro pillars
#61Semiconductor chip with patterned underbump metallization and polymer film
#62Package structure, fan-out package structure and method of the same
#63SEMICONDUCTOR PACKAGE
#64Interconnection structure, LED module and method
#65Apparatus and methods for creating environmentally protective coating for integrated circuit assemblies
#66Method of assembly semiconductor device with through-package interconnect
#67Package on-package (PoP) structure including stud bulbs
#68Semiconductor chip having a dense arrangement of contact terminals
#69METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS
#70CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#71Solder bump stretching method for forming a solder bump joint in a device
#72Semiconductor package using flip-chip technology
#73SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#74Reliable device assembly
#75Semiconductor chip package assembly with improved heat dissipation performance
#76Assembly with a carrier substrate and at least one electrical component arranged thereon, and electrical component
#77Semiconductor apparatus, solid state imaging device, imaging apparatus and electronic equipment, and manufacturing method thereof
#78Embedded graphite heat spreader for 3DIC
#79CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#80Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate
#81CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
#82Electrode connection structure and electrode connection method
#833D package with through substrate vias
#84Electronic component and method for manufacturing electronic component
#85Package having substrate with embedded metal trace overlapped by landing pad
#86Methods and apparatus of packaging with interposers
#87Package with multiple plane I/O structure
#88Method for producing an integrated circuit package and apparatus produced thereby
#89Contact area design for solder bonding
#90Stacked semiconductor packages with cantilever pads
#91Semiconductor device
#92Solder joint structure for ball grid array in wafer level package
#93High-temperature cycling BGA packaging
#94Narrow-gap flip chip underfill composition
#95Metal-insulator-metal on-die capacitor with partial vias
#96Organic thin film passivation of metal interconnections
#97Semiconductor structure having a conductive bump with a plurality of bump segments
#98Substrate for semiconductor package and process for manufacturing
#99Method and device for producing and filling containers
#100PACKAGE STRUCTURE
#101Semiconductor chip assembly and method for manufacturing the same
#102Semiconductor package and method for manufacturing the same
#103SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#104Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers
#105INTEGRATED CIRCUIT PACKAGING SYSTEM WITH NO-REFLOW CONNECTION AND METHOD OF MANUFACTURE THEREOF
#106Method of fabricating semiconductor device using gang bonding and semiconductor device fabricated by the same
#107Semiconductor device, imaging device and semiconductor device manufacturing method
#108Flexible package-to-socket interposer
#109PACKAGE STRUCTURE
#110Microelectronic packages with nanoparticle joining
#1113D bond and assembly process for severely bowed interposer die
#112SEMICONDUCTOR PACKAGE HAVING A DISSIPATING PLATE
#113Semiconductor device and manufacturing method thereof
#114Semiconductor device with semiconductor chip and wiring layers
#115Flip-chip package structure and method for an integrated switching power supply
#116Pad structure design in fan-out package
#117Semiconductor package and fabrication method thereof
#118Narrow-gap flip chip underfill composition
#119Circuit connecting material and semiconductor device manufacturing method using same
#120Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods
#121Package on-Package (PoP) structure including stud bulbs and method
#122Electronic component and method for manufacturing electronic component
#123Solder bump stretching method and device for performing the same
#124Semiconductor device and fabrication method thereof and semiconductor structure
#125Semiconductor device and fabrication method thereof
#126Method of forming a reliable microelectronic assembly
#127Semiconductor device and method of simultaneous molding and thermalcompression bonding
#128Organic thin film passivation of metal interconnections
#129Flexible package-to-socket interposer
#130Solder bump joint in a device including lamellar structures
#131Package-on-package (PoP) structure including stud bulbs and method
#132Integrated circuit packaging system with chip stacking and method of manufacture thereof
#133Interconnect pillars with directed compliance geometry
#134SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME
#135Electronic device
#136Microelectronic packages with nanoparticle joining
#137Copper pillar bonding for fine pitch flip chip devices
#138Semiconductor element for package miniaturization
#139METHOD OF INTERCONNECTING CHIPS USING CAPILLARY MOTION
#140Method of manufacturing semiconductor element
#141Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereof
#142Flip-chip component production method
#143INTERCONNECT ASSEMBLIES AND METHODS
#144Semiconductor package for fine pitch miniaturization and manufacturing method thereof
#145Three-dimensional integrated circuit with integrated heat sinks
#146Temporary bonding structures for die-to-die and wafer-to-wafer bonding
#147Compact optical transceiver by hybrid multichip integration
#148Under die surface mounted electrical elements
#149Contact arrangements for stackable microelectronic package structures with multiple ranks
#150Integrated circuit package with solderless interconnection structure