209738 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors Structure
Sub-classes:BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
#2Substrate and package structure
#3CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
#4Substrate and package structure
#5Bond pad with micro-protrusions for direct metallic bonding
#6Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#7Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#8Stacked radio frequency devices
#9Substrate and package structure
#10Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#11Leadless package with non-collapsible bump
#12Semiconductor package and fabrication method thereof
#13Conductive connections, structures with such connections, and methods of manufacture
#14Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
#15Bond pad with micro-protrusions for direct metallic bonding
#16Micro-scrub process for fluxless micro-bump bonding
#17Substrate and package structure
#18Conductive connections, structures with such connections, and methods of manufacture
#19Planarity-tolerant reworkable interconnect with integrated testing
#20Methods and apparatus of packaging with interposers
#21BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
#22INTERPOSER AND METHOD OF FABRICATING THE SAME
#23Conductive connections, structures with such connections, and methods of manufacture
#24Conductive connections, structures with such connections, and methods of manufacture
#25SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#26Die interconnect
#27Managing parasitic capacitance and voltage handling of stacked radio frequency devices
#28Methods and apparatus for bump-on-trace chip packaging
#29Fan-out package structure and methods for forming the same
#30Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
#31Semiconductor device and method of making bumpless flipchip interconnect structures
#32Bump structure for stacked dies
#33SEMICONDUCTOR PACKAGE
#34SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#35Semiconductor device and semiconductor device manufacturing method
#36Method of forming bump structure having tapered sidewalls for stacked dies
#37Substrate with terminal pads having respective single solder bumps formed thereon
#38Semiconductor package and fabrication method thereof
#39Integrated circuit packaging system with interposer structure and method of manufacture thereof
#40Integrated circuit packaging system with interposer structure and method of manufacture thereof