209748 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors Function
Sub-classes:Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure
#2Semiconductor method for forming semiconductor structure having bump on tilting upper corner surface
#3Semiconductor structure having bump on tilting upper corner surface
#4Semiconductor package and fabrication method thereof
#5Planarity-tolerant reworkable interconnect with integrated testing
#6Semiconductor packages
#7Flip-chip package structure and method for an integrated switching power supply
#8SEMICONDUCTOR PACKAGES
#9Semiconductor package and fabrication method thereof