209995 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector; Coating Disposition, e.g. coating on a part of the core
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#2CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#3Electrical connection member, electrical connection structure, and method for manufacturing electrical connection member
#4Package with vertical interconnect between carrier and clip
#5Electrode terminal, semiconductor device, and power conversion apparatus