H01L2224/401 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector Disposition

• H01L2224/40101 » Connecting bonding areas at the same height, e.g. horizontal bond 30
• H01L2224/40105 » Connecting bonding areas at different heights 33
• H01L2224/4013 » Connecting within a semiconductor or solid-state body i.e. fly strap, bridge strap 3
• H01L2224/40135 » Connecting between different semiconductor or solid-state bodies i.e. chip-to-chip 3
• H01L2224/40151 » Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive 7

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