210009 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector; Disposition Connecting within a semiconductor or solid-state body, i.e. fly strap, bridge strap
SENSOR PACKAGES
#2Semiconductor Package Providing an Even Current Distribution and Stray Inductance Reduction and a Semiconductor Device Module
#3Semiconductor device having an airbridge and method of fabricating the same
#4Semiconductor device having an airbridge and method of fabricating the same