Dual cavity, high-heat dissipating printed wiring board assembly

Functional-Element-Mounted Module, Process for Producing the Same, Resin Sealing Plate for Use Therein, and Substrate Structure for Resin Sealing

Semiconductor device with offset stacked integrated circuits

Memory card and its manufacturing method

Semiconductor assembly having a housing

Semiconductor device sealed in a resin section and method for manufacturing the same

Circuit module and electrical component

Method for packaging semiconductor dies having through-silicon vias

Semiconductor device

QUAD FLAT PACKAGE WITH EXPOSED COMMON ELECTRODE BARS

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Method of manufacturing printed wiring board

Capacitive isolator

METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DEVICE

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Electronic assemblies without solder and methods for their manufacture

Semiconductor assembly

Integrated circuit package system with flexible substrate and mounded package

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Semiconductor module, and hybrid vehicle drive device including the same

Electronic device which disconnects first and second terminals upon lapse of a prescribed device lifetime

Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip

Integrated circuit package system with wire-in-film isolation barrier

Microelectronic package element and method of fabricating thereof

Integrated circuit package for semiconductor devices with improved electric resistance and inductance

Integrated circuit package system with multiple molding

INTEGRATED CIRCUIT PACKAGE STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE

Component with sensitive component structures and method for the production thereof

Method of fabricating chip package

Stacked microelectronic devices and methods for manufacturing microelectronic devices

PRODUCING A SURFACE-MOUNTABLE RADIATION EMITTING COMPONENT

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

RFID integrated circuit with integrated antenna structure

Dual mirror chips, wafer including the dual mirror chips, multi-chip packages, methods of fabricating the dual mirror chip, the wafer, and multichip packages, and a method for testing the dual mirror chips

Stackable microelectronic device carriers, stacked device carriers and methods of making the same

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Chip package

Semiconductor device with welded leads and method of manufacturing the same

Semiconductor device

Heat dissipation plate and semiconductor device

Semiconductor package system with patterned mask over thermal relief

High-Density Fine Line Structure And Method Of Manufacturing The Same

Ultra slim semiconductor package and method of fabricating the same

Integrated circuit package system with flex bump

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Multi-chip electronic package with reduced stress

ELECTRONIC APPARATUS

Method of fabricating a semiconductor package having through holes for molding back side of package

Method for fabricating semiconductor package free of substrate

METHOD OF PACKAGE STACKING USING UNBALANCED MOLDED TSOP

Method of fabricating a two-sided die in a four-sided leadframe based package

Method of fabricating a semiconductor die having a redistribution layer

Method of fabricating a memory card using SiP/SMT hybrid technology

METHOD OF MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Multilayer wiring element having pin interface

Chip attack protection

Semiconductor device with a buffer region with tightly-packed filler particles

Integrated circuit package system with overhang die

Semiconductor die having a distribution layer

Semiconductor device and wire bonding method

High-density fine line structure and method of manufacturing the same

Integrated circuit package system with overhanging connection stack

Structure and method for wire bond integrity check on BGA substrates using indirect electrical interconnectivity pathway between wire bonds and ground

Integrated circuit package in package system with adhesiveless package attach

High thermal performance packaging for circuit dies

Semiconductor device including semiconductor chips having contact elements

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING

High-Density Fine Line Structure And Method Of Manufacturing The Same

Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same

Integrated circuit package system with top and bottom terminals

Electronic component and a method of fabricating an electronic component

Semiconductor module for a switched-mode power supply and method for its assembly

Two-sided die in a four-sided leadframe based package

MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof

Integrated circuit package system with integral inner lead and paddle

PACKAGE STACKING USING UNBALANCED MOLDED TSOP

Thinned wafer having stress dispersion parts and method for manufacturing semiconductor package using the same

Packaged device and method of manufacturing the same

Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module

Manufacturing Method of Semiconductor Integrated Circuit Device

MCU with integrated voltage isolator and integrated galvanically isolated asynchronous serial data link

Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates

Semiconductor device including a stress buffer

SEMICONDUCTOR WAFER THAT SUPPORTS MULTIPLE PACKAGING TECHNIQUES

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Electrical shielding in stacked dies by using conductive die attach adhesive

Structure and manufactruing method of chip scale package

Integrated circuit package system employing device stacking

Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE

Semiconductor device having through contacts through a plastic housing composition and method for the production thereof

RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks

RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction

Array molded package-on-package having redistribution lines

Lead frame, semiconductor device using same and manufacturing method thereof

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM

Method of making a wafer level integration package

Semiconductor device and semiconductor package having the same

Method for designing dummy pattern, exposure mask, semiconductor device, method for semiconductor device, and storage medium

Thin double-sided package substrate and manufacture method thereof

Semiconductor module

Wire bonding apparatus and process

Lead frame and method for fabricating semiconductor package employing the same

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Method Of Manufacturing A Fingerprint Sensor And Corresponding Sensor

Semiconductor memory device

Semiconductor package and fabrication method thereof

Die offset die to die bonding

Semiconductor device with heat sink plate

Heat dissipation package structure and method for fabricating the same

Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package

Embedded chip package

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

EMI shielded semiconductor package

BOND HEAD FOR A WIRE BONDER

METHOD OF MANUFACTURING WIRING BOARD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRING BOARD

Method of fabricating a semiconductor device

Method for fabricating semiconductor device installed with passive components

Plastic electronic component package

SEMICONDUCTOR MOLDED PANEL HAVING REDUCED WARPAGE

Electronic circuit package

Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel

Circuit arrangement and integrated circuit

High-Density Fine Line Structure And Method Of Manufacturing The Same

Chip-in-slot interconnect for 3D chip stacks

Semiconductor package and method for fabricating the same

Integrated circuit package system with contoured die

Microelectronic packages having cavities for receiving microelectric elements

Leadframe with die pad and leads corresponding thereto

Three-dimensional package structure

Lead frame-BGA package with enhanced thermal performance and I/O counts

Integrated circuit package system with leadfinger

Integrated circuit package system with leaded package

WIRE CLAMP FOR A WIRE BONDER

Methods of making metal core foldover package structures

Chip scale package having flip chip interconnect on die paddle

Integrated circuit die with logically equivalent bonding pads

One piece method for integrated circuit (IC) assembly

Wiring board having a connecting pad area which is smaller than a surface plating layer area

Method of manufacturing infrared rays receiver and structure thereof

Current sensor

Resin molded semiconductor device

Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BONDS AND METHODS OF MAKING SAME

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING

Reduced inductance in ball grid array packages

Multi-die wafer level packaging

Semiconductor package

Package stacking through rotation

Microelectronic package having interconnected redistribution paths

Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Packages and assemblies including lidded chips

Semiconductor chip mounting board with multiple ports

CONCENTRATION PHOTOVOLTAIC MODULE

Fully integrated RF transceiver integrated circuit

Arrangement of at least one power semiconductor module and a printed circuit board

Semiconductor package, printed circuit board, and electronic device

Semiconductor device and process for fabrication thereof

SEMICONDUCTOR PACKAGE HAVING MOLDED BALLS AND METHOD OF MANUFACTURING THE SAME

Chip Assembly and Method of Manufacturing Thereof

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Mounting board, mounted body, and electronic equipment using the same

STACKED CHIP SEMICONDUCTOR DEVICE

LEAD FRAME FOR SEMICONDUCTOR DEVICE

Leadframe with extended pad segments between leads and die pad, and leadframe package using the same

Integrated circuit package system with relief

Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component

METHOD OF PACKAGING INTEGRATED CIRCUITS

Semiconductor device

Bonding pad structure disposed in semiconductor device and related method

Semiconductor device and method of blowing fuse thereof

Capacitor structure in a semiconductor device

Transistor package with wafer level dielectric isolation

Integrated circuit for various packaging modes

MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD

Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same

Method of making integrated circuit package with transparent encapsulant

Method for Fabricating Array-Molded Package-On-Package

Base semiconductor component for a semiconductor component stack and method for the production thereof

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE

METHODS OF FABRICATING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE, AND CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE FABRICATED USING THE METHODS

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Integrated circuit package system with thin profile

Semiconductor device and fabrication method

Semiconductor package using chip-embedded interposer substrate

Stacked package structure and fabrication method thereof

Die stacking system and method

Multi layer low cost cavity substrate fabrication for pop packages

Housed active microstructures with direct contacting to a substrate

System-in-package type semiconductor device

Circuit substrate, molding semiconductor device, tray and inspection socket

Multi-chip semiconductor device having leads and method for fabricating the same

Semiconductor Package Having Reduced Thickness

Methods of forming stacked semiconductor devices with a leadframe and associated assemblies

Semiconductor Device and Its Fabrication Method

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Method for manufacturing light reflecting metal wall

Multilayer ceramic substrate

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Etch method

Digital Isolator Interface with Process Tracking

Semiconductor package and method of forming the same, and printed circuit board

RF-coupled digital isolator

RF-coupled digital isolator

Device comprising an element with electrodes coupled to connections

Semiconductor device including an interconnect

Semiconductor package and method of forming the same

Semiconductor device and a method of manufacturing the same

Flash memory card

LIGHT-EMITTING DIODE ASSEMBLY WITHOUT SOLDER

Electronic device manufacturing method and supporter

Circuit board and method of fabricating the same

Al-AlN composite material, related manufacturing method and heat exchanger using such composite material

Semiconductor package having through-hole via on saw streets formed with partial saw

Semiconductor device package with multi-chips and method of the same

Method of assembling electronic components of an electronic system, and system thus obtained

Multi-layer thermal insulation for a bonding system

Integrated circuit package system with interference-fit feature

Memory card and method for fabricating the same

SEMICONDUCTOR DEVICE INCLUDING MULTILAYER WIRING BOARD WITH POWER SUPPLY CIRCUIT

SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS

Land grid array semiconductor package

Integrated circuit package system with device cavity

Package-on-package using through-hole via die on saw streets

Through-hole via on saw streets

Same size die stacked package having through-hole vias formed in organic material

Semiconductor die package and integrated circuit package and fabricating method thereof

Semiconductor die with through-hole via on saw streets and through-hole via in active area of die

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

High Density Nanotube Devices

Thermal insulation for a bonding tool

Temperature control of a bonding stage

Substrate with feedthrough and method for producing the same

Chip package

Bidirectional multiplexed RF isolator

Magnetoresistive device and method of packaging same

Housing for an electronic circuit and method for sealing the housing

Phase change cooled electrical connections for power electronic devices

Over-voltage protection for power and data applications

Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like

Semiconductor device package having a semiconductor element with a roughened surface

Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure

Semiconductor device having a sealing resin and method of manufacturing the same

Semiconductor chip with post-passivation scheme formed over passivation layer

SUBSTRATE WITH PIN, WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Etched interposer for integrated circuit devices

Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications

Integrated circuit package device with improved bond pad connections, a lead-frame and an electronic device

Structure and method for self protection of power device with expanded voltage ranges

STACKED SEMICONDUCTOR DEVICE ASSEMBLY AND PACKAGE

Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like

Printed wiring board and method for manufacturing printed wiring board

Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components

On chip transformer isolator

Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion

Semiconductor device

Semiconductor device

Fabric type semiconductor device package and methods of installing and manufacturing same

Three-dimensional semiconductor device

Integration type semiconductor device and method for manufacturing the same

Semiconductor Device and Method for Fabricating the Same

Wiring board manufacturing method, semiconductor device manufacturing method and wiring board

Cut-out heat slug for integrated circuit device packaging

Heat-dissipating semiconductor package structure and method for manufacturing the same

Integrated circuit package system for package stacking and method of manufacture therefor

High Input/Output, Low Profile Package-On-Package Semiconductor System

Simplified Substrates for Semiconductor Devices in Package-on-Package Products

Ultra-thin chip packaging

Wiring board and semiconductor package using the same

LEAD FRAME FREE PACKAGE AND METHOD OF MAKING

Leadframe for leadless package, structure and manufacturing method using the same

Non-leaded semiconductor package and a method to assemble the same

Etched leadframe structure including recesses

Semiconductor device with power noise suppression

LIGHT-EMITTING DIODE AND METHOD FOR PRODUCING IT

LEAD FRAME, MOLDING DIE, AND MOLDING METHOD

Electronic Circuit Assembly, Device Comprising Such Assembly and Method for Fabricating Such Device

Chip stack package and method of fabricating the same

SEMICONDUCTOR DEVICE INCLUDING WIRING SUBSTRATE HAVING ELEMENT MOUNTING SURFACE COATED BY RESIN LAYER

Multi-chip module

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

Package on-package secure module having BGA mesh cap

Package-on-package secure module having anti-tamper mesh in the substrate of the upper package

Plastic package and method of fabricating the same

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

Apparatus for shielding integrated circuit devices

Mounting substrate and electronic device

Wiring design support apparatus for bond wire of semiconductor devices

Integrated circuit carrier arrangement with electrical connection islands

Arrangement for Energy Conditioning

Solid-state image sensing device

Method And System for Output Matching of Rf Transistors

Interconnect for chip level power distribution

Heat dissipation unit and a semiconductor package that has the heat dissipation unit

Semiconductor device

Semiconductor device

Chip package structure