STACKED AND SHIELDED DIE PACKAGES WITH INTERCONNECTS

Detector system and detector subassembly

Electronic component assembly with composite material carrier

Method of creating contour structures to highlight inspection region

METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Method for fabricating a low cost integrated circuit (IC) package

Method of assembling chips

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, HEAT SINK, SEMICONDUCTOR CHIP, INTERPOSER SUBSTRATE, AND GLASS PLATE

Semiconductor device

Semiconductor device

Semiconductor package, method of fabricating the same, and semiconductor package mold

SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Semiconductor device and method of manufacturing the same

Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof

Semiconductor device

Integrated circuit package system with bonding in via

Semiconductor package

Ball grid array package and its substrate

Semiconductor device

Semiconductor device and manufacturing method thereof

Package structure and method of manufacturing the same

Controlling substrate surface properties via colloidal coatings

Semiconductor device and method of manufacturing the same

Composite semiconductor device

Image sensing devices including image sensor chips, image sensor package modules employing the image sensing devices, electronic products employing the image sensor package modules, and methods of fabricating the same

Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement

Semiconductor device with different sized ESD protection elements

Light emitting diode lamp with low thermal resistance

LIGHT RECEIVING APPARATUS

Method of wire bonding over active area of a semiconductor circuit

Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

CONVERSION SUBSTRATE FOR A LEADFRAME AND THE METHOD FOR MAKING THE SAME

Output Circuit

Semiconductor package land grid array substrate and plurality of first and second electrodes

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Semiconductor device and its manufacturing method

Semiconductor device and method for manufacturing the same

Wire-bonded semiconductor component with reinforced inner connection metallization

Semiconductor integrated circuit device and fabrication process thereof

Stackable semiconductor device and fabrication method thereof

Integrated circuit and method for producing the same

Semiconductor device and method for manufacturing thereof

Structure and electronics device using the structure

Semiconductor device including mounting board with stitches and first and second semiconductor chips

Semiconductor package and the method of making the same

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

CHIP PACKAGE STRUCTURE

Integrated circuit package system with lead support

SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME

Leadframe design for QFN package with top terminal leads

Fibrous laminate interface for security coatings

Wire bonding method and related device for high-frequency applications

Integrated circuit package system employing multi-package module techniques

Method of joining chips utilizing copper pillar

Power delivery package having through wafer vias

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Device having a bonding structure for two elements

METHOD, APPARATUS, AND SYSTEM FOR PHASE CHANGE MEMORY PACKAGING

Lead structure for a semiconductor component and method for producing the same

Base substrate for chip scale packaging

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Package structure and stacked package module using the same

Multi-chip package with a single die pad

Method and apparatus for fabricating a plurality of semiconductor devices

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

OPTOELECTRONIC DEVICE ALIGNMENT IN AN OPTOELECTRONIC PACKAGE

CHIP PACKAGE STRUCTURE

Lead frame, semiconductor device, and method of manufacturing the semiconductor device

Circuit component and method of manufacture

CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device package

Semiconductor device and manufacturing method of the same

BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME

Semiconductor component and production method

Semiconductor module

Method of fabricating module having stacked chip scale semiconductor packages

Thin film deposition as an active conductor and method therefor

Class D amplifier arrangement

Digital isolator with communication across an isolation barrier

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Substrate with feedthrough and method for producing the same

Semiconductor device

Stacked-Chip Semiconductor Device

Semiconductor component and method of manufacture

Chip package substrate and structure thereof

Package substrate strip, metal surface treatment method thereof and chip package structure

Resin molded semiconductor device and differential amplifier circuit

Space-efficient package for laterally conducting device

Method for manufacturing the BGA package board

SEMICONDUCTOR PACKAGE HAVING ENHANCED HEAT DISSIPATION AND METHOD OF FABRICATING THE SAME

Resin encapsulation molding method for semiconductor device

Substrate based unmolded package

Carbon nanotube bond pad structure and method therefor

Method of assembling chips

Interposer for die stacking in semiconductor packages and the method of making the same

Electronic package and manufacturing method thereof

Planar multi semiconductor chip package and method of manufacturing the same

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME

Memory IC package assembly having stair step metal layer and apertures

Semiconductor package configuration with improved lead portion arrangement

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Light emitting apparatus

Soldering method and method of manufacturing semiconductor device including soldering method

Electronic component structure and method of making

CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL, AND SEMICONDUCTOR DEVICE

Component assembly

Package having a plurality of mounting orientations

THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME

CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE

Semiconductor package and fabrication method thereof

INTEGRATED CIRCUIT

Semiconductor integrated circuit device and fabrication method for the same

Universal substrate for a semiconductor device having selectively activated fuses

Stackable bare-die package

Stackable integrated circuit package system with multiple interconnect interface

High Frequency Switch With Low Loss, Low Harmonics, And Improved Linearity Performance

Leadframe enhancement and method of producing a multi-row semiconductor package

Package board and method for manufacturing thereof

DIE COAT PERIMETER TO ENHANCE SEMICONDUCTOR RELIABILITY

Semiconductor package having stacked semiconductor chips

Single-sided, flat, no lead, integrated circuit package

CHIP PACKAGE

Module comprising a semiconductor chip comprising a movable element

Semiconductor device package with multi-chips and method of the same

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CONNECTING THROUGH-HOLE AND METHOD OF THE SAME

Semiconductor device package with multi-chips and method of the same

Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method

Stacked electronic component and manufacturing method thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Device Package with an Additional Contact Pad, a Lead Frame and an Electronic Device

Electronic component and method for manufacturing an electronic component

Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same

Bond head link assembly for a wire bonding machine

Transfer mask in micro ball mounter

Method for manufacturing passive device and semiconductor package using thin metal piece

Electronic component module and method for manufacturing the same

High-frequency module

Method For Establishing an Electrical and Mechanical Connection Between Chip Contact Surfaces and Antenna Contact Surfaces and Transponder

Panel, semiconductor device and method for the production thereof

Integrated circuit including gas phase deposited packaging material

Module with silicon-based layer

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND METHOD OF THE SAME

Image sensor package with die receiving opening and method of the same

SEMICONDUCTOR DEVICE AND PACKAGING STRUCTURE THEREFOR

CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR CHIP SUPPRESSING A VOID DURING A DIE ATTACHING PROCESS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Method of fabricating chip package structure

Monolithic Controller for the Generator Unit of a Motor Vehicle

Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same

Semiconductor package substrate

Semiconductor substrate

Semiconductor device

Integrated circuit packaging system with interposer

Heat dissipating device with preselected designed interface for thermal interface materials

Stackable semiconductor package having metal pin within through hole of package

Microelectronic packages and methods therefor

SEMICONDUCTOR PACKAGE STRUCTURE AND CARRIER STRUCTURE

Chip package structure

PACKAGE-ON-PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME BY USING A LEADFRAME

Integrated circuit package system with integral inner lead and paddle

Package-level electromagnetic interference shielding

Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip

High performance sub-system design and assembly

Passivation layer for a circuit device and method of manufacture

Method for manufacturing integrated circuit device having antenna conductors

Low Cost Stacked Package

Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate

Die package with asymmetric leadframe connection

Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same

Method for precision assembly of integrated circuit chip packages

Fabrication method of semiconductor package

BOND PAD FOR SEMICONDUCTOR DEVICE

Circuit module and circuit device including circuit module

ELECTRONIC PACKAGE STRUCTURE

Semiconductor module, module substrate structure, and method of fabricating the same

PACKAGE STRUCTURE WITH EMBEDDED CAPACITOR, FABRICATING PROCESS THEREOF AND APPLICATIONS OF THE SAME

Structure and method for self protection of power device

SEMICONDUCTOR PACKAGE HAVING EVAPORATED SYMBOLIZATION

Wiring board and semiconductor device

Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package

Integrated circuit package system with an encapsulant cavity and method of fabrication thereof

Multi-chip semiconductor package and method for fabricating the same

ELECTRONIC PACKAGE STRUCTURE

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

Lead frame for chip packages with wire-bonding at single-side pads

Modular board device, high frequency module, and method of manufacturing the same

Fabrication method of multichip stacking structure

IC package reducing wiring layers on substrate and its chip carrier

Multichip stacking structure

Chip having side pad, method of fabricating the same and package using the same

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device having a high frequency electrode positioned with a via hole

Chip arrangement and method for producing a chip arrangement

Semiconductor device including isolation layer

Semiconductor device with parylene coating

Method of manufacturing a printed wiring board lead frame package

Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package

Signal isolators using micro-transformers

Circuit substrate and the semiconductor package having the same

Plastic semiconductor packages having improved metal land-locking features

Semiconductor device and programming method

IC chip package with near substrate scale chip attachment

Stack type semiconductor chip package having different type of chips and fabrication method thereof

Semiconductor device and method of fabricating the same

Enhanced durability multimedia card

Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof

Electric Device Comprising a Housing and a Cooling Body

Semiconductor device

MULTI-CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Substrate improving immobilization of ball pads for BGA packages

Chip package structure

Microelectronic component assemblies with recessed wire bonds and methods of making same

Semiconductor power device

Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package

Thin semiconductor package having stackable lead frame and method of manufacturing the same

Method for reduction of soft error rates in integrated circuits

CHIP PACKAGE CAPABLE OF MINIMIZING ELECTRO-MAGNETIC INTERFERENCE

MEMS microphone package and method thereof

Integrated circuit/printed circuit board substrate structure and communications

Pin with shape memory alloy

Method of forming component package

Method of making a semiconductor device having multiple die redistribution layer

Local wireless communications within a device

Stacked type chip package structure

Sub-assembly

Integrated circuit package with top pad

Semiconductor device package having pseudo chips

Semiconductor components having through interconnects

Semiconductor device having multiple die redistribution layer

Control of Standoff Height Between Packages with a Solder-Embedded Tape

Method for fabricating heat-dissipating package and heat-dissipating structure applicable thereto

Heat dissipation semiconductor pakage

Memory module for improving impact resistance

Semiconductor device with chip mounted on a substrate

Method of making a multi-layered semiconductor device

Integrated circuit package with molded cavity

Laterally Interconnected IC Packages and Methods

Bridge stack integrated circuit package-on-package system

Lead Frame

CHIP PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE

Stacked-package quad flat null lead package

Microelectronic Assembly Using Chip-On-Lead (COL) and Cantilever Leads

Stress mitigation in packaged microchips

Alignment and cutting of microelectronic substrates

SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Light emitting diode package with direct leadframe heat dissipation

Accessible electronic storage apparatus

System in package integrating a plurality of semiconductor chips

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Circuit for suppressing voltage jitter and method thereof

Voltage regulator integrated with semiconductor chip

Semiconductor package and method of manufacturing the same

Stacked-die packages with silicon vias and surface activated bonding

Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape

Integrated circuit package system employing mold flash prevention technology

Semiconductor package on package having plug-socket type wire connection between packages

Semiconductor package structure and method for manufacturing the same

Inverted lead frame in substrate

Multi-die IC package and manufacturing method

IC package encapsulating a chip under asymmetric single-side leads

Multi-chip package

SEMICONDUCTOR DEVICE PACKAGE

Plastic electronic component package

Integrated circuit device mounting with folded substrate and interposer

Method for fabricating a circuit component

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Manufacturing method for micro-SD flash memory card

Circuit board and manufacturing method thereof

Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chips

Light source module, light source apparatus and liquid crystal display

MICROBALL MOUNTING METHOD AND MOUNTING DEVICE

Semiconductor package having non-ceramic based window frame

Three-dimensional package and method of making the same

Stress management in BGA packaging

Chip package and method of manufacturing the same

3D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA

Integrated circuit package system employing a support structure with a recess

Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof

Semiconductor device package diepad having features formed by electroplating

Integrated circuit package with elevated edge leadframe

Manufacturing process of a carrier

Semiconductor chip and production process therefor

Microelectronic devices and methods for forming interconnects in microelectronic devices

METHOD OF MANUFACTURING MULTI-STACK PACKAGE

Integrated circuit package system employing thin profile techniques

Method for manufacturing an antenna

Memory chip and insert card having the same thereon

Signal isolator using micro-transformers

Stacked die in die BGA package

Semiconductor package and method of manufacturing the same

Method for manufacturing semiconductor device and semiconductor device

High power semiconductor package and method of making the same

Semiconductor package and method for manufacturing the same