Semiconductor device

Stack package and stack packaging method

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Multi-layer semiconductor package

LDO regulator with ground connection through package bottom

Integrated circuit package system employing structural support

Fabrication method of semiconductor package and structure thereof

COMPLEX MEMORY CHIP, MEMORY CARD HAVING THE SAME, AND METHOD OF MANUFACTURING THE MEMORY CARD

Resin-sealed electronic device and method of manufacturing the same

Microcircuit package having ductile layer

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor package having semiconductor device featuring externally-accessible endless ring-shaped resistance circuit

CHIP PACKAGE AND FABRICATING PROCESS THEREOF

System-in-package (SiP) and method of manufacturing the same

Substrate for a flexible microelectronic assembly and a method of fabricating thereof

Stacked die package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Chip on leads

Semiconductor device and printed circuit board

Semiconductor chip and method of producing the same

SEMICONDUCTOR INTEGRATED CIRCUIT AND FABRICATION METHOD FOR THE SAME

Leadframe, semiconductor package and support lead for bonding with groundwires

Illumination device with semiconductor light-emitting elements

Thin film light emitting diode

Light emitting device having a mirror portion

PARTIALLY INSULATION COATED METAL WIRE FOR WIRE BONDING AND WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE USING THE SAME

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE

Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device

Rotation joint and semiconductor device having the same

Semiconductor module with at least two substrates

Balanced semiconductor device packages including lead frame with floating leads and associated methods

Thermally enhanced semiconductor package

HEAT SPREADER FOR AN ELECTRICAL DEVICE

Semiconductor device package

Stamped leadframe and method of manufacture thereof

Collective and synergistic MRAM shields

Flanged transducer having improved rigidity

Spread spectrum isolator

Card adapter for use with a storage apparatus

Accessible electronic storage apparatus for use with support frame

Semiconductor package and fabrication method thereof

BGA package with encapsulation on bottom of substrate

Package structure having through hole in spacer thereof

Package structure of memory card and manufacturing method thereof

Wirebond Package Design for High Speed Data Rates

IC package keeping attachment level of leads on chip during molding process

Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same

Method of manufacturing a memory card

ELECTRONIC DEVICE

Film and chip packaging process using the same

Module with carrier element

Semiconductor integrated circuit and multi-chip module

PATTERN FILM, METHOD OF MANUFACTURING THE PATTERN FILM, AND PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE PATTERN FILM

Semiconductor package

Integration using package stacking with multi-layer organic substrates

Multi stack package and method of fabricating the same

Electronic assembly and circuit board

Integrated circuit package system with encapsulation lock

Component arrangement comprising a carrier

Integrated circuit package system

Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner

Method for fabricating semiconductor package free of substrate

STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME

Circuit device and method of manufacturing the same

Power module and motor integrated control unit

Electrical component having external contacting

SEMICONDUCTOR CHIP STACK PACKAGE WITH REINFORCING MEMBER FOR PREVENTING PACKAGE WARPAGE CONNECTED TO SUBSTRATE

Package structure and package substrate thereof

Semiconductor assembly with one metal layer after base metal removal

Vertical Integration of Passive Component in Semiconductor Device Package for High Electrical Performance

Semiconductor module including components in plastic casing

Stacked integrated circuit package-in-package system

Semiconductor device and manufacturing method of the same

Semiconductor chip, semiconductor device and methods for producing the same

Laminated bond of multilayer circuit board having embedded chips

Base plate for a power semiconductor module

Resilient carrier assembly for an integrated circuit

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Low fabrication cost, high performance, high reliability chip scale package

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR APPARATUS

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Structure of package on package and method for fabricating the same

Insertion-type semiconductor device and fabrication method thereof

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Die-up integrated circuit package with grounded stiffener

Semiconductor package and method of forming wire loop of semiconductor package

Semiconductor storage device, semiconductor device, and manufacturing method therefor

Chip package, method of making same and digital camera module using the package

Array quad flat no-lead package and method of forming same

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

Integrated circuit leadless package system

METHOD FOR PRODUCING AN INTEGRATED CIRCUIT INCLUDING A CONNECTION CONTACT ON A SEMICONDUCTOR BODY

Chip packaging process

Sawn power package and method of fabricating same

Stacked die with a recess in a die BGA package

Ball grid array package and method thereof

Low profile ball grid array (BGA) package with exposed die and method of making same

Partial Solder Mask Defined Pad Design

Semiconductor package and fabrication process thereof

Three dimensional device integration method and integrated device

SEMICONDUCTOR DEVICE

Cooled Integrated Circuit

SEMICONDUCTOR PACKAGE PREVENTING WARPING AND WIRE SEVERING DEFECTS, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Stackable micropackages and stacked modules

CHIP PACKAGE STRUCTURE

Leadframe and mold compound interlock in packaged semiconductor device

Microelectronic packages fabricated at the wafer level and methods therefor

Process for fabricating electronic components using liquid injection molding

ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE

Substrate and manufacturing method of package structure

Stacked semiconductor package having fan-out structure through wire bonding

Semiconductor device and wire bonding method therefor

SIP package with small dimension

Package on package and method thereof

Semiconductor integrated circuit device having reduced terminals and I/O area

Semiconductor package having a bridged plate interconnection

Semiconductor package preventing generation of static electricity therein

Semiconductor device and an information management system therefor

Method for producing a semiconductor component and substrate for carrying out the method

Wiring board

Thermally Enhanced BGA Packages and Methods

Edge connect wafer level stacking

Microelectronic component assemblies and microelectronic component lead frame structures

Electronic device and lead frame

Moveable arm assembly for a wire bonder

Combination wedge bonding and ball bonding transducer

Processes and packaging for high voltage integrated circuits, electronic devices, and circuits

Manufacturing Method of Semiconductor Apparatus

LED lighting apparatus with transparent flexible circuit structure

METHOD AND STRUCTURE TO ENHANCE TEMPERATURE/HUMIDITY/BIAS PERFORMANCE OF SEMICONDUCTOR DEVICES BY SURFACE MODIFICATION

Substrate slot design for die stack packaging

Semiconductor element comprising a supporting structure and production method

PACKAGE FOR MIXED SIGNAL MCU WITH MINIMAL PIN COUNT

Power semiconductor arrangement

Semiconductor device

Stack type semiconductor device package

Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires

Process of forming an electronic device including an inductor

Method of manufacturing semiconductor device

Method of making a semiconductor package and method of making a semiconductor device

Lead frame routed chip pads for semiconductor packages

Elimination of RDL using tape base flip chip on flex for die stacking

Wire pad of semiconductor device

Circuit substrate for preventing warpage and package using the same

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

TWO-WAY HEAT EXTRACTION FROM PACKAGED SEMICONDUCTOR CHIPS

ELECTRONIC DEVICE AND PRODUCTION METHOD

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package and semiconductor system in package using the same

Integrated circuit package system with stacked die

Semiconductor package and semiconductor device

Semiconductor device package

Semiconductor package and stacked semiconductor package

Semiconductor package with inner leads exposed from an encapsulant

Method and apparatus for directing molding compound flow and resulting semiconductor device packages

Module with a shielding and/or heat dissipating element

Memory card

MOVABLE ELECTRONIC FLAME-OFF DEVICE FOR A BONDING APPARATUS

Structure of high performance combo chip and processing method

Structure of high performance combo chip and processing method

Set of resin compositions for preparing system-in-package type semiconductor device

Programmable system in package

Integrated circuit package system with encapsulation lock

Semiconductor assembly with component attached on die back side

Castellation wafer level packaging of integrated circuit chips

Modularized Die Stacking System and Method

Semiconductor device package with groove

Stacked die semiconductor device having circuit tape

Stacked multi-chip package with EMI shielding

Reduction in thickness of semiconductor component on substrate

Electronic component package with EMI shielding

Semiconductor device, lead-frame product used for the same and method for manufacturing the same

SEMICONDUCTOR LEADFRAME FOR UNIFORM MOLD COMPOUND FLOW

Microelectronic component assemblies and microelectronic component lead frame structures

Packaged microelectronic components with terminals exposed through encapsulant

Package semiconductor and fabrication method thereof

Integrated circuit package system with encapsulation lock

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK

Electronic packages with fine particle wetting and non-wetting zones

Printed circuit board for package and manufacturing method thereof

Process for manufacturing semiconductor devices

Methods using die attach paddle for mounting integrated circuit die

Perimeter matrix ball grid array circuit package with a populated center

SYSTEM AND METHOD FOR THERMAL EXPANSION PRE-COMPENSATED PACKAGE SUBSTRATE

WIRE-BONDED PACKAGE WITH ELECTRICALLY INSULATING WIRE ENCAPSULANT AND THERMALLY CONDUCTIVE OVERMOLD

Methods for packaging and sealing an integrated circuit die

Semiconductor apparatus

Method for producing a circuit module comprising at least one integrated circuit

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Die attach paddle for mounting integrated circuit die

Semiconductor component having a semiconductor die and a leadframe

Electronic device having wiring substrate and lead frame

INTEGRATED CIRCUIT PACKAGE

Semiconductor device package and manufacturing method

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC SHIELDING PART

Electronic circuit package and fabricating method thereof

Stacked dual MOSFET package

Systems and methods for supporting a subset of multiple interface types in a semiconductor device

Method of manufacturing a combined multilayer circuit board having embedded chips

Map type semiconductor package

Microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor memory device and semiconductor device

High temperature operating package and circuit design

IC package with a protective encapsulant and a stiffening encapsulant

Distributed semiconductor device methods, apparatus, and systems

SEMICONDUCTOR COMPONENT WITH COOLING APPARATUS

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Wire bonding method, wire bonding apparatus and semiconductor device

POP package and method of fabricating the same

High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies

Spacers for separating components of semiconductor device assemblies, semiconductor device assemblies and systems including spacers and methods of making spacers

Stacked-die electronics package with planar and three-dimensional inductor elements

Semiconductor package and method therefor

Integrated circuit package system with interlock

CHIP CARRIER WITH SIGNAL COLLECTION TAPE AND FABRICATION METHOD THEREOF

Wire bonders and methods of wire-bonding

Semiconductor component with plastic housing, and process for producing the same

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Electric power converter

Semiconductor device

HIGH PERFORMANCE IC PACKAGE AND METHOD

Implantable microelectronic device and method of manufacture

Stacked structure of chips and water structure for making the same

Metal core foldover package structures

Module and mounted structure using the same

Semiconductive device having improved copper density for package-on-package applications

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Circuit Board Assembly Having Passive Component and Stack Structure Thereof

Process of forming a laminate ceramic circuit board

Method of wire bonding over active area of a semiconductor circuit

Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods

Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

High frequency line-to-waveguide converter and high frequency package

Plastic overmolded packages with molded lid attachments

Semiconductor device package and manufacturing method

Bond pad for wafer and package for CMOS imager

BGA package with leads on chip field of the invention

Components, methods and assemblies for stacked packages

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

Stackable semiconductor package

Microelectronic package

Integrated circuit including clip

Power semiconductor component

Apparatus, system and method for use in mounting electronic elements

Semiconductor element and manufacturing method thereof

Interconnect for improved die to substrate electrical coupling

Physical quantity sensor, lead frame, and manufacturing method therefor

Method of manufacturing semiconductor device

CIRCUIT BOARD AND CIRCUIT STRUCTURE

Method for producing a component and device having a component

CONFIGURABLE UNIVERSAL INTERCONNECT DEVICE

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Functional device-mounted module and a method for mounting functional device-mounted module

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Semiconductor device and method of manufacturing the same

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

High density electronic packages

Electronic device and method for producing a device

Multi-chip structure

Semiconductor chip packages and assemblies with chip carrier units

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE

Quad flat package

Package with solder-filled via holes in molding layers

STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME

Process for precision placement of integrated circuit overcoat material

PACKAGE-BASE STRUCTURE OF POWER SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS OF THE SAME

Method for manufacturing a passive integrated matching network for power amplifiers

Structure and method of making sealed capped chips

Integrated circuit package system with down-set die pad and method of manufacture thereof

Method of fabricating a stacked die having a recess in a die BGA package

COMBINATION HEAT DISSIPATION DEVICE WITH TERMINATION AND A METHOD OF MAKING THE SAME

Optoelectronic module

Multiplexed RF isolator

Differential signaling system and method of controlling skew between signal lines thereof

Chip-scale coils and isolators based thereon

Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

Integrated circuit package system

Intergrated circuit utilizing down bond to define the function of the die and the implementing method thereof

Integrated circuit package-in-package system

Chip-stacked package structure

MULTICHIP DEVICE AND METHOD FOR PRODUCING A MULTICHIP DEVICE

Integrated circuit package system with molding vents

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

Stackable multi-chip package system with support structure

Electronic Device and Method For Producing the Same

Integrated circuit package system including die stacking

Micro chip-scale-package system

LEADFRAME AND NON-LEAD PACKAGE THEREWITH

Lead Frame and Fabrication Method thereof

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

Electronic packages with roughened wetting and non-wetting zones

Multiplexed RF isolator circuit

Multi-die DC-DC buck power converter with efficient packaging

Methods for providing and using grid array packages