Semiconductor package

STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Semiconductor package having passive component and semiconductor memory module including the same

Semiconductor device having a semiconductor chip enclosed by a body structure and a base

Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture

Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit

Multi Lead Frame Power Package

Method for making a semiconductor multi-package module having inverted wire bond carrier second package

Semiconductor device and method for manufacturing same

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Leaded stacked packages having elevated die paddle

SEMICONDUCTOR CHIP

Chip having two groups of chip contacts

Heat dissipating semiconductor package and heat dissipating structure thereof

Electronic circuit in a package-in-package configuration and production method

Brick type stackable semiconductor package

Stack type semiconductor package and method of fabricating the same

Pillar Bump Package Technology

Hybrid Microelectronic Package

Chip package structure and manufacturing method thereof

Surface mount multichip devices

Chip package structure

Leaded stacked packages having integrated upper lead

Semiconductor structure of a high side driver

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

Power semiconductor apparatus

Semiconductor device and an information management system therefor

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

Transformer coils for providing voltage isolation

Chip structure with redistribution traces

SEMICONDUCTOR PACKAGE HAVING ADVANTAGE FOR STACKING AND STACK-TYPE SEMICONDUCTOR PACKAGE

Semiconductor package and fabrication method thereof

Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

Semiconductor Package Having Improved Adhesion and Solderability

Integrated circuit package system with flashless leads

Integrated circuit package system employing an exposed thermally conductive coating

Wire bonding apparatus

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AND FABRICATING METHOD THEREOF

Quad flat no-lead (QFN) chip package assembly apparatus and method

Structure of high performance combo chip and processing method

Miniature optical element for wireless bonding in an electronic instrument

Thermally conductive composite and uses for microelectronic packaging

BONDING PAD STRUCTURE FOR ELECTRONIC DEVICE

Bottom substrate of package on package and manufacturing method thereof

Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead frames

Superfine-circuit semiconductor package structure

Semiconductor device for pipe for passing refrigerant liquid

Flip chip package including a non-planar heat spreader and method of making the same

SEMICONDUCTOR PACKAGE

Integrated circuit package system with ground bonds

Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board

Integrated circuit package-in-package system

Integrated circuit packaging system with ultra-thin die

Multi-chip semiconductor connector assemblies

Chip package structure and fabricating method thereof

Semiconductor device

Semiconductor device

Method and apparatus for measuring oscillation amplitude of an ultrasonic device

Bonding pad structure and method for making the same

Transfer mold solution for molded multi-media card

CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE

Semiconductor device

Stack package having pattern die redistribution

Chip stack, chip stack package, and method of forming chip stack and chip stack package

Semiconductor package having optimal interval between bond fingers for reduced substrate size

System-in-package structure

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Method of fabricating an integrated circuit with etched ring and die paddle

Optoelectronic device

Vent Closing Method And The Use Of An Ultrasonic Bonding Machine For Carrying Out The Method

Wire clamp gap control mechanism and method

Methods of operating electronic devices, and methods of providing electronic devices

Manufacturing method for a leadless multi-chip electronic module

Encapsulated optoelectronic device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit package system with offset stack

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Heat dissipating structure and method for fabricating the same

Semiconductor device having heat spreader with center opening

Package Using Selectively Anodized Metal and Manufacturing Method Thereof

Compliant integrated circuit package substrate

Semiconductor package having functional and auxiliary leads, and process for fabricating it

Semiconductor apparatus with decoupling capacitor

Semiconductor device, and life prediction circuit and life prediction method for semiconductor device

METHOD OF ALIGNING A CONTACTLESS SEMICONDUCTOR DEVICE INTERFACE

Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages

Manufacturing method of wiring substrate

IC packages with internal heat dissipation structures

Integrated circuit (IC) package stacking and IC packages formed by same

SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device

Structure and method for producing multiple size interconnections

Printed circuit board for package of electronic components and manufacturing method thereof

Semiconductor device having semiconductor element with back electrode on insulating substrate

High frequency semiconductor device

Semiconductor device having an element mounted on a substrate and an electrical component connected to the element

Thermal improvement for hotspots on dies in integrated circuit packages

DIE STACK CAPACITORS, ASSEMBLIES AND METHODS

Nested integrated circuit package on package system

MULTI-CHIP PACKAGE STRUCTURE

High power shunt switch with high isolation and ease of assembly

Multi-chip stacked package with reduced thickness

Package-on-package system

Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device

Coreless cavity substrates for chip packaging and their fabrication

Semiconductor device capable of suppressing current concentration in pad and its manufacture method

Semiconductor package and method of assembling the same

Stacked Chips with Underpinning

Method of fixing curved circuit board and wire bonding apparatus

Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same

Magnetic shielding for magnetic random access memory

Computer systems having an interposer including a flexible material

Semiconductor Device

Method of making thermally enhanced substrate-base package

Mounting integrated circuit dies for high frequency signal isolation

Power semiconductor device connected in distinct layers of plastic

System-in-package device

Semiconductor device with improved high current performance

Semiconductor device

Package structure and lead frame using the same

Methods and apparatus for a semiconductor device package with improved thermal performance

Advanced multilayer coreless support structures and method for their fabrication

Multiple row exposed leads for MLP high density packages

Chip stack package and manufacturing method thereof

Semiconductor device encapsulated with resin composition

Semiconductor package and method for fabricating the same

Encapsulated electronic device

Semiconductor device

Stackable semiconductor package

Interlayer dielectric and pre-applied die attach adhesive materials

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of passive element device

Process to reform a plastic packaged integrated circuit die

Multilayer electronic component, electronic device, and method for producing multilayer electronic component

Chip stack, method of fabrication thereof, and semiconductor package having the same

Semiconductor integrated circuit device

Method of manufacturing an electronic component package

Multiple die stack apparatus employing T-shaped interposer elements

Semiconductor device having a bonding wire and method for manufacturing the same

Stacked package electronic device

Stack structure of circuit board with semiconductor component embedded therein

Stackable semiconductor package

Microelectronic package having solder-filled through-vias

Lead frame and method of manufacturing the same and semiconductor device

Leadframe IC packages having top and bottom integrated heat spreaders

Multilayer structures for magnetic shielding

Electric circuit device and related manufacturing method

Semiconductor device and method for manufacturing the same

Semiconductor device with reduced parasitic inductance

Light-emitting device manufacturing method and light-emitting device

Method for producing a chip-substrate connection

SUBSTRATE AND LAYOUT METHOD

Separation method of semiconductor device

Integrated circuit, and a mobile phone having the integrated circuit

Semiconductor integrated circuit device with power lines improved

Interconnect structure and formation for package stacking of molded plastic area array package

Method of wire bonding over active area of a semiconductor circuit

Integrated circuit package having exposed thermally conducting body

Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier

Semiconductor device

SYSTEM IN PACKAGE MODULE

Palladium-Plated Lead Finishing Structure For Semiconductor Part And Method Of Producing Semiconductor Device

Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body

Equalization in capacitively coupled communication links

SEMICONDUCTOR PACKAGE

Dual MOSFET package

Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages

No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

Integrated circuit package system with different mold locking features

Electronic component having a semiconductor power device

Copper straps

Integrated circuit having stress tuning layer

Methods and apparatus having an integrated circuit attached to fused silica

Integrated circuit chip packaging

Micro-package, multi-stack micro-package, and manufacturing method therefor

Integrated circuit package system with contoured encapsulation

High Withstand Voltage Semiconductor Device Covered with Resin and Manufacturing Method Therefor

Method for fabricating semiconductor package with multi-layer die contact and external contact

Semiconductor device having a chip stack on a rewiring plate

Semiconductor device

Electronic device with integrated heat distributor

COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same

Method of fabricating microelectronic devices

THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICIAL METAL BASE

INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS

Semiconductor device having shifted stacked chips

Semiconductor Housings Having Coupling Coatings

Lead frame and semiconductor device using the same

Package structure

CHIP PACKAGE

Test pads on flash memory cards

Wafer level stack structure for system-in-package and method thereof

DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION

System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices

Low resistance integrated MOS structure

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

Encapsulation for particle entrapment

Attaching heat sinks to integrated circuit packages

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Stackable semiconductor package

Bump structure, method of forming bump structure, and semiconductor apparatus using the same

Power semiconductor module as H-bridge circuit and method for producing the same

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Memory package structure

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME

Molded SiP package with reinforced solder columns

Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same

Packaging of integrated circuits to lead frames

Leadframe structures for semiconductor packages

Light emitting diode package with direct leadframe heat dissipation

Chip structure with half-tunneling electrical contact to have one electrical contact formed on inactive side thereof and method for producing the same

Method for fabricating semiconductor package free of substrate

Semiconductor die package including multiple dies and a common node structure

Semiconductor element mounting board and optical transmission module

Surface mounting electronic component and manufacturing method thereof

Inductor element and method for production thereof, and semiconductor module with inductor element

Filter device substrate and filter device

Integrated circuit devices with stacked package interposers

IC chip package with minimized packaged-volume

Semiconductor device and method of manufacturing the same

Utra-thin substrate package technology

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component

Ball Grid array package structure

Embedded integrated circuit package-on-package system

Leadframe enhancement and method of producing a multi-row semiconductor package

Package for optical device and method of manufacturing the same

Memory circuit system having semiconductor devices and a memory

MULTI-DIE INDUCTOR

MOSFET power package

Semiconductor device using semiconductor chip

Method of manufacturing a through electrode

POP Semiconductor Device Manufacturing Method

Electronic device with lead-free metal thin film formed on the surface thereof

Multilayer wiring board

Chip package

ELECTRODE, MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR DEVICE HAVING THE SAME

Programmable system in package

Stacked integrated circuit package-in-package system

Electronic component device

Electronic component package

Overmolded semiconductor package with a wirebond cage for EMI shielding

Semiconductor device package with base features to reduce leakage

Semiconductor light emitting device with first and second leads

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

Hybrid stacking package system

Chip with power and signal pads connected to power and signal lines on substrate

High frequency IC package and method for fabricating the same

Common Assembly Substrate and Applications Thereof

Integrated circuit package system with wire bond pattern

Single package wireless communication device

Power semiconductor module with flush terminal elements

Semiconductor device having an adhesion promoting layer and method for producing it

Substrate for a microelectronic package and method of fabricating thereof

Integrated circuit package system with ground ring

Chip package structure

Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation

Electronic device with selective nickel palladium gold plated leadframe and method of making the same

Multichip package system

QFN housing having optimized connecting surface geometry

Methods of Packaging Using Fluid Resin

Methods of forming semiconductor assemblies

Semiconductor device manufacturing method

Method for making a wedge wedge wire loop

Method of correcting bonding coordinates using reference bond pads

Stacked integrated circuit package system with connection protection

Tape wiring substrate and tape package using the same

Packaged microelectronic devices recessed in support member cavities, and associated methods

Semiconductor device with guard rings that are formed in each of the plural wiring layers

Ball grid array housing having a cooling foil

Semiconductor packaging unit with sliding cage

Power semiconductor component with a power semiconductor chip and method for producing the same

Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer

Method for fabricating chip package structure

Semiconductor device with lead frames

Memory card

Folding chip planar stack package

Semiconductor module with current connection element

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Connecting device for electronic components

Method of packaging integrated circuit devices using preformed carrier

PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

Separation method for cutting semiconductor package assemblage for separation into semiconductor packages

Manufacturing method of a package structure

Semiconductor device

On-die bond wires system and method for enhancing routability of a redistribution layer

Method for precision assembly of integrated circuit chip packages

Chip package with a ring having a buffer groove that surrounds the active region of a chip

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Power transistor and power semiconductor device

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Power electronics equipments

Manufacturing method of semiconductor device

Microelectronic devices and methods for manufacturing microelectronic devices

Optical semiconductor device

Power electronics equipment for transmitting signals to switching devices through air-cored insulating transformer

Memory card structure and method for manufacturing the same

Multichip module with improved system carrier