Integrated circuit package system

Multichip package system

Integrated circuit package-in-package system

Leadless leadframe implemented in a leadframe-based BGA package

Chip package and wafer treating method for making adhesive chips

Method for making QFN package with power and ground rings

Semiconductor chip assembly

Semiconductor Device Including a Plurality of Semiconductor Chips Packaged in a Common Housing

Method and structure for improving bonding reliability in bond pads

Method for fabricating a semiconductor package

Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device

Multi-chip package

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

Microelectronic device assemblies including assemblies with recurved leadframes, and associated methods

Board on chip package and manufacturing method thereof

Integrated circuit package system having interconnect stack and external interconnect

GaAs power transistor

Semiconductor chip package having a slot type metal film carrying a wire-bonding chip

Ball grid array substrate having window and method of fabricating same

SiP module with a single sided lid

Layer between interfaces of different components in semiconductor devices

Microelectromechanical microphone packaging system

Microelectonic packages and methods therefor

Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means

Semiconductor package structure and method for manufacturing the same

Horn-holder pivot type bonding apparatus

Compliant wirebond pedestal

Sub-assembly

Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same

Stackable integrated circuit package system with multiple interconnect interface

Electronic assembly and method for forming the same

Stacked integrated circuit package system

Semiconductor device and semiconductor module therewith

Power semiconductor device and method for producing it

INTEGRATED CIRCUIT CHIP AND PACKAGE

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages

Integrated circuit package system including die stacking

Semiconductor bulk resistance element

Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface

Manufacturing method of semiconductor device

Manufacturing method of semiconductor device

DC/DC converter

Integrated circuit package system with L-shaped leadfingers

Integrated circuit package system with bonding lands

Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same

Ball grid array package

Electronic circuit, a semiconductor device and a mounting substrate

Substrate of chip package and chip package structure thereof

Semiconductor package including transformer or antenna

Chip package and stacked structure of chip packages

Semiconductor module and method of manufacturing the same

Semiconductor device

Semiconductor apparatus containing multi-chip package structures

Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies

Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor

Semiconductor chip package having an adhesive tape attached on bonding wires

Wafer level chip packaging

Integrated circuit package system with exposed interconnects

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Integrated circuit package system with heat sink

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

Method of fabricating a 3-D package stacking system

Semiconductor component with semiconductor chip and adhesive film, and method for its production

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Customizable power and ground pins

COL-TSOP with nonconductive material for reducing package capacitance

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Ceramic multilayer substrate

Active area bonding compatible high current structures

Method for producing a surface-mountable semiconductor component

Method and structure for coupling two microcircuits

Impedance matching commonly and independently

Semiconductor device

Integrated circuit package system including zero fillet resin

Plurality of devices attached by solder bumps

Semiconductor device with an improved solder joint

Semiconductor device having through contact blocks with external contact areas

Semiconductor device

Stacked integrated circuit package system with face to face stack configuration

Semiconductor device package and methods for producing same

Stacked semiconductor structure and fabrication method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device, electronic device, and manufacturing method of the same

Interdigitated conductive lead frame or laminate lead frame for GaN die

Electronic module with stacked semiconductors

Method for setting capillary contact position data and wire bonding apparatus using the same

WIRE BONDING METHOD AND APPARATUS

Ground shields for semiconductors

Interconnect substrate, semiconductor device, and method of manufacturing the same

Wafer level chip scale package system

INTEGRATED CIRCUIT SYSTEM WITH WAFERSCALE SPACER SYSTEM

Fabrication of an integrated circuit package

Method of packaging semiconductor die without lead frame or substrate

Hybrid multilayer substrate and method for manufacturing the same

Power semiconductor component having chip stack

Semiconductor device

Bonding pad structure

Plastic ball grid array package with integral heatsink

Thin integrated circuit device packages for improved radio frequency performance

Integrated circuit underfill package system

Semiconductor package

Circuit board, semiconductor package having the same, and method of manufacturing the circuit board

Semiconductor module having a semiconductor chip stack and method

INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING DIE-ATTACH PAD WITH ELEVATED BONDLINE THICKNESS

Multi-chips module package and manufacturing method thereof

Warpage-reducing packaging design

Methods for fabricating stiffeners for flexible substrates

Semiconductor apparatus manufacturing method

Optical bond-wire interconnections and a method for fabrication thereof

Flip-attached and underfilled stacked semiconductor devices

Multilayer integrated circuit for RF communication and method for assembly thereof

Wafer level stack structure for system-in-package and method thereof

Stack chip and stack chip package having the same

Integrated circuit package system including wide flange leadframe

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

Padless die support integrated circuit package system

Integrated circuit package system with multiple molding

Microelectronic interconnect device comprising localised conductive pins

Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package

OVERMOLDED OPTICAL PACKAGE

Nonvolatile memory system

Semiconductor device and electric apparatus

Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device

Method of wire bonding over active area of a semiconductor circuit

Method of wire bonding over active area of a semiconductor circuit

Power configuration method for structured ASICs

Semiconductor chip package with attached electronic devices, and integrated circuit module having the same

Integrated circuit having second substrate to facilitate core power and ground distribution

Method of wire bonding over active area of a semiconductor circuit

Interconnects with interlocks

Carbon nanotube circuit component structure

Thermally enhanced semiconductor package and method of producing the same

Semiconductor wafer scale package system

Managed memory component

METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT

Semiconductor package structure and fabrication method thereof

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Low cost method to produce high volume lead frames

Semiconductor package structure and fabrication method thereof

Semiconductor package and process for making the same

CHIP PACKAGE WITH BUILT-IN CAPACITOR STRUCTURE

Strip for integrated circuit packages having a maximized usable area

Method of manufacturing wiring substrate

Method for fabricating a flip chip system in package

Printed circuit board and method of manufacturing semiconductor package using the same

Millimeter-wave radar apparatus and millimeter radar system using the same

Arrangement and method impedance matching

Semiconductor device and electronic component module using the same

Semiconductor component and apparatus for production of a semiconductor component

Power semiconductor module

Through-hole contacts in a semiconductor device

Method for manufacturing mold type semiconductor device

SEMICONDUCTOR PACKAGE HAVING IMPROVED SOLDER JOINT RELIABILITY AND METHOD OF FABRICATING THE SAME

Semiconductor device

Pad layout

Circuit module

Connecting module having passive components

Package optical chip with conductive pillars

Managed memory component

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Electronic circuit package

Integrated circuit package-in-package system

Low profile managed memory component

Stacked integrated circuit package-in-package system

Multi-chip package system

Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates

Interconnected IC packages with vertical SMT pads

Circuit board and electronic assembly

Overhang integrated circuit package system

Semiconductor device

Rounded contact fingers on substrate/PCB for crack prevention

Method for manufacturing high-frequency module device

Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages

Method of fabricating leadframe based flash memory cards including singulation by straight line cuts

Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package

ARRAY CIRCUIT SUBSTRATE AND WIRE BONDING PROCESS USING THE SAME

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Hidden plating traces

Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same

Electrical ground method for ball stack package

Multichip leadframe package

Test pads on flash memory cards

Package method for flash memory card and structure thereof

Chip-spacer integrated radio frequency ID tags, methods of making same, and systems containing same

Microelectronic packages and methods therefor

Microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor package having improved thermal performance

System to wirebond power signals to flip-chip core

Semiconductor device with semiconductor device components embedded in a plastic housing composition

Semiconductor device and method of manufacturing the same

Multi-chip package sharing temperature-compensated self-refresh signal and method thereof

Semiconductor chip and semiconductor device

Stacked packages with interconnecting pins

Packaged chip having features for improved signal transmission on the package

Techniques for packaging multiple device components

Semiconductor component including semiconductor chip and method for producing the same

Package having exposed integrated circuit device

Plating bar design for high speed package design

Circuit board, semiconductor device, and manufacturing method of circuit board

Semiconductor device and electronic control unit using the same

Method for fabricating semiconductor packages, and structure and method for positioning semiconductor components

Wire bonding system and method of use

Stackable molded packages and methods of making the same

Package for high power density devices

Schottky Diode Device with Aluminum Pickup of Backside Cathode

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Semiconductor device, and inspection method thereof

Stack package of ball grid array type

Semiconductor device and manufacturing method of the same

Packaging method of a plurality of chips stacked on each other and package structure thereof

Semiconductor package

HEAT FIXTURE FOR WIRE BONDING

Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

Light-receiving module

Multi-strand substrate for ball-grid array assemblies and method

Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors

Negative thermal expansion material filler for low CTE composites

Combination quad flat no-lead and thin small outline package

Space-efficient package for laterally conducting device

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

System-in-package structure

Microelectronic devices having a curved surface and methods for manufacturing the same

Multichip stacking structure

Semiconductor package having increased resistance to electrostatic discharge

Semiconductor chip mounted interposer, semiconductor device, semiconductor chip interposer fabrication method, bare chip mounted interposer, and interposer sheet

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Chip package structure

Surface processing agent for tin or tin alloy material

Carbon nanotube reinforced metallic layer

Microelectronic component assemblies having lead frames adapted to reduce package bow

Devices and system for electrostatic discharge suppression

Sensor system having a substrate and a housing, and method for manufacturing a sensor system

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device with a wiring substrate and method for producing the same

Metal core, package board, and fabricating method thereof

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes

MEMORY CARD

Chip package structure

Leadframe comprising tin plating or an intermetallic layer formed therefrom

Interconnection element for BGA housings and method for producing the same

Semiconductor device having high frequency components and manufacturing method thereof

Circuit under pad structure and bonding pad process

Method of making semiconductor package having exposed heat spreader

Protection for an integrated circuit chip containing confidential data

Radio-frequency system in package including antenna

A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LAST ALUMINUM METAL LINE LAYER

Semiconductor device

Interposer and stacked chip package

Circuit substrate and method of manufacture

Semiconductor/printed circuit board assembly, and computer system

Semiconductor integrated circuit

Method and apparatus that provides differential connections with improved ESD protection and routing

Two-step high bottleneck type capillary for wire bonding device

Power module

Method for the interconnection of active and passive components and resulting thin heterogeneous component

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

Flip-chip semiconductor device manufacturing method

Method of manufacturing a wafer level package with a cap structure for hermetically sealing a micro device

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Semiconductor package with heat sink, stack package using the same and manufacturing method thereof

Semiconductor package structure and method of manufacture

Stackable semiconductor package and method for its fabrication

Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides

Integrated circuit package system with lead structures including a dummy tie bar

Ultra-thin quad flat no-lead (QFN) package

Semiconductor devices including voltage switchable materials for over-voltage protection

Method and device for connecting chips

Method of fabricating an exposed die package

Integrated circuit package system with heat sink

Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure

Method of forming a leaded molded array package

Micro chip-scale-package system

Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate

INTEGRATED CIRCUIT PACKAGE SYSTEM

Enhancing shock resistance in semiconductor packages

Method and apparatus for forming a DMD window frame with molded glass

Wafer scale heat slug system

Semiconductor device and method for producing it, and use of an electrospinning method

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Microelectronic connection component

Bumped chip carrier package using lead frame and method for manufacturing the same

Stacked integrated circuit leadframe package system

Low voltage drop and high thermal performance ball grid array package

Integrated circuit package system with heat dissipation enclosure

Integrated circuit package system using heat slug

Semiconductor package system with thermal die bonding

Integrated circuit package system with a heat sink

Integrated circuit package system including shield

Semiconductor package that includes stacked semiconductor die

Chip stack package and manufacturing method thereof

Method for fabricating semiconductor package with stacked chips

Semiconductor device and method of manufacturing the same

Integrated circuit package to package stacking system

Integrated circuit package system with multi-planar paddle