210070 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector; Core members of the connector Material
Semiconductor chip having bond pads
#5102Wire bonding method
#5103Semiconductor device, fabrication method therefor, and film fabrication method
#5104Micro lead frame packages and methods of manufacturing the same
#5105Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
#5106Packaging methods
#5107Mm-wave antenna using conventional IC packaging
#5108Constant voltage diode
#5109Semiconductor device and method of manufacturing the same
#5110Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device
#5111Coupling substrate for semiconductor components and method for producing the same
#5112Method for making stacked integrated circuits (ICs) using prepackaged parts
#5113Single chip and stack-type chip semiconductor package and method of manufacturing the same
#5114Lead arrangement and chip package using the same
#5115Low profile semiconductor package
#5116Ultrathin leadframe BGA circuit package
#5117Fabrication method for a chip packaging structure
#5118METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD
#5119Board on chip package and method of manufacturing the same
#5120Electronic assembly having graded wire bonding
#5121Chip stack structure having shielding capability and system-in-package module using the same
#5122Semiconductor chip with post-passivation scheme formed over passivation layer
#5123Structure and self-locating method of making capped chips
#5124Structure and method of making capped chips having vertical interconnects
#5125Back-face and edge interconnects for lidded package
#5126Package device with electromagnetic interference shield
#5127Electronic-part built-in substrate and manufacturing method therefor
#5128Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture
#5129Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die
#5130Integrated circuit package system including high-density small footprint system-in-package
#5131Implantable microelectronic device and method of manufacture
#5132Packaging for high speed integrated circuits
#5133Substrate frame
#5134LEADFRAME FOR SEMICONDUCTOR PACKAGES
#5135Integrated circuit packaging
#5136Three-dimensionally integrated electronic assembly
#5137High frequency chip packages with connecting elements
#5138Method and apparatus for attaching a workpiece to a workpiece support
#5139Complex RF device and method for manufacturing the same
#5140Semiconductor heat-transfer method
#5141Semiconductor component and method for production of a semiconductor component
#5142Embedded inductor and application thereof
#5143Embedded inductor element and chip package applying the same
#5144Semiconductor device with improved encapsulation
#5145Integrated circuit package encapsulating a hermetically sealed device
#5146Semiconductor device with reduced package cross-talk and loss
#5147Closed loop thermally enhanced flip chip BGA
#5148Integrated chip device in a package
#5149Semiconductor device that attains a high integration
#5150Integrated circuit mounting for thermal stress relief useable in a multi-chip module
#5151Multi-chip package structure
#5152Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
#5153Lead frame having outer leads coated with a four layer plating
#5154Housed DRAM chip for high-speed applications
#5155Production process for manufacturing such semiconductor package
#5156Semiconductor component and method for contracting said semiconductor component
#5157Method for applying a structure of joining material to the back surfaces of semiconductor chips
#5158CHIP PACKAGE METHOD
#5159Method of improving power distribution in wirebond semiconductor packages
#5160Encapsulation of a chip module
#5161Re-enforced ball-grid array packages for semiconductor products
#5162Power semiconductor device in lead frame employing connecting element with conductive film
#5163Integrated circuit package system using etched leadframe
#5164Semiconductor insulation structure
#5165Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside
#5166Power semiconductor module with overcurrent protective device
#5167Semiconductor package with position member
#5168Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages
#5169Bonding apparatus comprising improved oscillation amplification device
#5170Semiconductor device with semiconductor chip and adhesive film and method for producing the same
#5171Package for high frequency waves containing high frequency electronic circuit
#5172Semiconductor device
#5173Bond pads and methods for fabricating the same
#5174Arrangement of conductive pads on grid array package and on circuit board
#5175Electronic apparatus
#5176Semiconductor module having a coupling substrate, and methods for its production
#5177Lead frame package structure with high density of lead pins arrangement
#5178Microelectronic interconnect substrate and packaging techniques
#5179Ultrasonic horn
#5180Microelectronic packages and methods therefor
#5181CHIP PACKAGE STRUCTURE
#5182Relay board and semiconductor device having the relay board
#5183Electronic device, semiconductor device using same, and method for manufacturing semiconductor device
#5184Method of forming a molded array package device having an exposed tab and structure
#5185Integrated circuit package system with multi-surface die attach pad
#5186Die package and method for making the same
#5187Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package
#5188Flash memory card
#5189Flash memory card
#5190Packaged die on PCB with heat sink encapsulant and methods
#5191Cavity chip package
#5192Package with barrier wall and method for manufacturing the same
#5193Package of leadframe with heatsinks
#5194Molded semiconductor package
#5195Insulated gate semiconductor device having a clamping element to clamp gate-emitter voltage and method of manufacturing thereof
#5196LSI design support apparatus and LSI design support method
#5197Semiconductor device and a method of manufacturing the same
#5198Semiconductor manufacturing method
#5199Method of forming an electrical contact
#5200Method for manufacturing an adhesive substrate with a die-cavity sidewall
#5201THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY
#5202Optical module with can package
#5203Complete power management system implemented in a single surface mount package
#5204Complete power management system implemented in a single surface mount package
#5205QFN/SON compatible package with SMT land pads
#5206Method of encapsulating packaged microelectronic devices with a barrier
#5207Semiconductor package with internal shunt resistor
#5208Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#5209Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#5210Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#5211Integrated circuit package system with adhesive restraint
#5212Method for producing bonding connection of semiconductor device
#5213Semiconductor apparatus integrating an electrical device under an electrode pad
#5214Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#5215Image sensing device package structure
#5216Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#5217Monitoring deformation and time to logically constrain a bonding process
#5218Selective consolidation methods for fabricating semiconductor device components and conductive features thereof
#5219INDUCTIVE STRUCTURE
#5220Method of forming an electrical contact
#5221Semiconductor chip having bond pads
#5222Semiconductor device having metallic plate with groove
#5223External contact material for external contacts of a semiconductor device and method of making the same
#5224Semiconductor chip having bond pads and multi-chip package
#5225Integrated circuit package and method of manufacture thereof
#5226System in package (SIP) structure
#5227Multi-chip stack structure
#5228Semiconductor device with operation mode set by external resistor
#5229Protective barrier layer for semiconductor device electrodes
#5230Method and apparatus for decoupling conductive portions of a microelectronic device package
#5231Semiconductor package and manufacturing method thereof
#5232THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME
#5233Resin mold type semiconductor device
#5234Semiconductor package with a conductive post and wiring pattern
#5235Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness
#5236Multi-chip package type semiconductor device
#5237Semiconductor module
#5238Solid image pickup unit and camera module
#5239Computing device including a stacked semiconductor device
#5240Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
#5241Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same
#5242Stacked microelectronic devices and methods for manufacturing microelectronic devices
#5243Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
#5244Chip package structure
#5245Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices
#5246Semiconductor multi-chip package including two semiconductor memory chips having different memory densities
#5247Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
#5248Land grid array semiconductor device packages
#5249Printed circuit board assembly with strain-alleviating structures
#5250Quad flat pack (QFP) package and flexible power distribution method therefor
#5251Test carrier for semiconductor components having conductors defined by grooves
#5252Microelectronic devices and methods for manufacturing microelectronic devices
#5253Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#5254Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#5255SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
#5256Lead frame-based semiconductor device packages incorporating at least one land grid array package
#5257Power semiconductor device having lines within a housing
#5258BONDING PAD STRUCTURE AND METHOD OF FORMING THE SAME
#5259Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
#5260Bonding program
#5261Method for producing an electronic component or module and a corresponding component or module
#5262Actuator and bonding apparatus
#5263Two layer substrate ball grid array design
#5264Multi-chip package for reducing parasitic load of pin
#5265Thermally enhanced cavity down ball grid array package
#5266Heat-conducting packaging of electronic circuit units
#5267Semiconductor component comprising an interposer substrate
#5268Power semiconductor device comprising a semiconductor chip stack and method for producing the same
#5269Semiconductor device
#5270Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly
#5271Leadframe package with dual lead configurations
#5272Bi-directional switch, and use of said switch
#5273Semiconductor device and capacitance regulation circuit
#5274Semiconductor device and capacitance regulation circuit
#5275METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY
#5276Method and apparatus for fine pitch solder joint
#5277Bonding apparatus
#5278Bonding pattern discrimination device
#5279Bonding pattern discrimination program
#5280Semiconductor chip and multi-chip package
#5281Mount for a programmable electronic processing device
#5282Printed circuit board, semiconductor package and multi-stack semiconductor package using the same
#5283Thin IC package for improving heat dissipation from chip backside
#5284Stackable single package and stacked multi-chip assembly
#5285Semiconductor module
#5286Package frame and semiconductor package using the same
#5287Semiconductor device
#5288Semiconductor device
#5289Circuit board and manufacturing method thereof
#5290Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load
#5291Method and apparatus for removing encapsulating material from a packaged microelectronic device
#5292Packaged integrated circuit having a heat spreader and method therefor
#5293Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
#5294Board-on-chip package and stack package using the same
#5295SEMICONDUCTOR DEVICE
#5296Integrated circuit package and method of assembling the same
#5297Multilayered circuit substrate and semiconductor package structure using the same
#5298Power plane design and jumper wire bond for voltage drop minimization
#5299Stack package implementing conductive support
#5300Jig structure for manufacturin a stacked memory card
#5301Enhanced multi-die package
#5302SEMICONDUCTOR DEVICE
#5303Semiconductor device and method of manufacturing the same
#5304Methods of bonding two semiconductor devices
#5305Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof
#5306Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure
#5307Scalable subsystem architecture having integrated cooling channels
#5308Radio frequency power amplifier module
#5309Output match transistor
#5310Semiconductor power device and RF signal amplifier
#5311Semiconductor package
#5312ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE
#5313Dual BGA alloy structure for improved board-level reliability performance
#5314Integrated circuit chip and integrated device
#5315Semiconductor device, power amplifier device and PC card
#5316Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device
#5317Substrate based IC-package
#5318Copper substrate with feedthroughs and interconnection circuits
#5319METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE
#5320Semiconductor package and manufacturing method thereof
#5321Package structure having recession portion on the surface thereof and method of making the same
#5322Method and system for customized radio frequency shielding using solder bumps
#5323Method and apparatus for attaching microelectronic substrates and support members
#5324Packaging method for segregating die paddles of a leadframe
#5325Relay board with bonding pads connected by wirings
#5326Method and apparatus for attaching microelectronic substrates and support members
#5327Stress and force management techniques for a semiconductor die
#5328Security apparatus
#5329Reduced inductance in ball grid array packages
#5330Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
#5331Ball grid array package and substrate within
#5332Wiring substrate and semiconductor package implementing the same
#5333Electronic component and electronic configuration
#5334Packaging for high speed integrated circuits
#5335Packaging for high speed integrated circuits
#5336Packaging for high speed integrated circuits
#5337Packaging for high speed integrated circuits
#5338Packaging for high speed integrated circuits
#5339Packaging for high speed integrated circuits
#5340Electronic device and carrier substrate for same
#5341High-frequency device including high-frequency switching circuit
#5342Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same
#5343Copper alloy for electronic machinery and tools and method of producing the same
#5344Bumped die and wire bonded board-on-chip package
#5345Integrated circuit device and electronic instrument
#5346Method and structure for reduction of soft error rates in integrated circuits
#5347MEMS packaging method for enhanced EMI immunity using flexible substrates
#5348Semiconductor module
#5349Packaging of a microchip device
#5350Semiconductor package having pre-plated leads and method of manufacturing the same
#5351MEMS package using flexible substrates, and method thereof
#5352Micro-package, multi-stack micro-package, and manufacturing method therefor
#5353Package structure for a semiconductor device incorporating enhanced solder bump structure
#5354Structure and method for producing multiple size interconnections
#5355Semiconductor package having dual interconnection form and manufacturing method thereof
#5356High frequency package device with internal space having a resonant frequency offset from frequency used
#5357SEMICONDUCTOR MULTI-CHIP PACKAGE
#5358Surface mount package
#5359Advanced leadframe having predefined bases for attaching passive components
#5360Method of manufacturing a passive integrated matching network for power amplifiers
#5361Method for producing a circuit module
#5362Method and System for Applying an Adhesive Substance on an Electronic Device
#5363Substrate warpage control and continuous electrical enhancement
#5364Method of reducing warpage in an over-molded IC package
#5365METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE
#5366Optical module and optical transmission device
#5367Semiconductor device with semiconductor device components embedded in a plastics composition
#5368Semiconductor device with improved signal transmission characteristics
#5369Semiconductor device advantageous in improving water resistance and oxidation resistance
#5370Semiconductor device
#5371Stacked semiconductor package
#5372Adhesive layer forming a capacitor dielectric between semiconductor chips
#5373BUMP FOR OVERHANG DEVICE
#5374Anti-warp heat spreader for semiconductor devices
#5375Semiconductor device and method of manufacturing the same
#5376System and method for venting pressure from an integrated circuit package sealed with a lid
#5377Apparatus having reduced warpage in an over-molded IC package
#5378Semiconductor package having lead free conductive bumps and method of manufacturing the same
#5379Semiconductor device and package, and method of manufacturer therefor
#5380Die package with asymmetric leadframe connection
#5381System, method and apparatus for routing signals from an integrated circuit using thickfilm and printed circuit interconnects
#5382Methods of operating electronic devices, and methods of providing electronic devices
#5383Method of manufacturing a semiconductor device
#5384Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#5385Standoffs for centralizing internals in packaging process
#5386Method of fabricating a stacked die in die BGA package
#5387Method of fabricating a stacked die in die BGA package
#5388Three dimensional device integration method and integrated device
#5389Stacked die in die BGA package
#5390Heat-dissipating semiconductor package and fabrication method thereof
#5391Method for manufacturing device having optical semiconductor element
#5392Radio frequency receiver chip with improved electrostatic discharge level
#5393Semiconductor device
#5394Relay switch including an energy detection circuit
#5395Multi-chip device and method for producing a multi-chip device
#5396Packaging logic and memory integrated circuits
#5397Stacked memory card and method for manufacturing the same
#5398Alignment using fiducial features
#5399Reliable integrated circuit and package
#5400Semiconductor device having firmly secured heat spreader