SEMICONDUCTOR PACKAGE

Semiconductor device for driving electric motor

PRE-SOLDER METHOD AND REWORK METHOD FOR MULTI-ROW QFN CHIP

Ultrasonic horn

Ultrasonic horn

Ultrasonic horn

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF, AND CONDUCTIVE FOIL PROVIDED WITH INSULATING LAYER

Method of manufacturing stack type semiconductor package

System and method for multi-chip module die extraction and replacement

Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom

Circuit board, high frequency module, and radar apparatus

Method for manufacturing semiconductor devices having a metallisation layer

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Stacked semiconductor package and method of fabricating the same

Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same

PACKAGE-ON-PACKAGE SEMICONDUCTOR PACKAGE HAVING SPACERS DISPOSED BETWEEN TWO PACKAGE SUBSTRATES

Semiconductor device having an interconnect structure with TSV using encapsulant for structural support

Stackable molded microelectronic packages with area array unit connectors

Stackable molded microelectronic packages

Method for manufacturing semiconductor devices having a glass substrate

Integrated circuit/printed circuit board substrate structure and communications

Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds

Semiconductor device assembly and method thereof

System-in-a-package based flash memory card

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Semiconductor device including semiconductor packages stacked on one another

COMMUNICATION CONTROL METHOD AND COMMUNICATION SYSTEM

SEMICONDUCTOR DEVICE

Multi-chip package including chip address circuit

Semiconductor device and package

Semiconductor package without chip carrier and fabrication method thereof

System-in-a-package based flash memory card

Method for reducing chip warpage

Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof

Multi-chip package module and a doped polysilicon trench for isolation and connection

Semiconductor device having a capacitor

Reduction of etch microloading for through silicon vias

Method for manufacture of integrated circuit package system with protected conductive layers for pads

Thermally enhanced semiconductor package

ACTIVE ENERGY RAY-CURABLE PRESSURE-SENSITIVE ADHESIVE FOR RE-RELEASE AND DICING DIE-BONDING FILM

GALVANIC ISOLATION TRANSFORMER

Semiconductor device for DC-DC converter including high side and low side semiconductor switches

Method of manufacturing semiconductor modules and semiconductor module

Semiconductor package having a stacked structure

Ball grid array with improved single-ended and differential signal performance

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

Semiconductor package cooled by grounded cooler

Package for high power devices

Multi-chip package with thermal frame and method of assembling

Semiconductor package with an embedded printed circuit board and stacked die

Semiconductor apparatus including resin case

Semiconductor module and method of manufacturing the same

Lead frame and method for manufacturing the same

Semiconductor packages and methods of packaging semiconductor devices

Method for manufacturing a semiconductor device using an Al-Zn connecting material

Thermally and electrically enhanced ball grid array package

Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SILVER-COATED BALL AND METHOD FOR MANUFACTURING SAME

Integrated voltage regulator with embedded passive device(s) for a stacked IC

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect

Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof

Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure

SEMICONDUCTOR MODULE WITH COOLING MECHANISM AND PRODUCTION METHOD THEREOF

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME

Semiconductor device with lead terminals having portions thereof extending obliquely

Integrated circuit package system with package stand-off and method of manufacture thereof

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

Thin semiconductor package and method for manufacturing same

Multilayer structures for magnetic shielding

Boost converter with integrated high power discrete FET and low voltage controller

Wafer scale package for high power devices

Package for a light emitting element

SEMICONDUCTOR MEMORY CARD AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing semiconductor device, and bonding apparatus

Set of multiaxial force and torque sensor and assembling method

Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof

Methods of making a semiconductor device

Semiconductor device and snubber device having a SiC-MOSFET and a Zener diode

Power semiconductor device and power conversion device

Cut-edge positioning type soldering structure and method for preventing pin deviation

Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system

Three-dimensional semiconductor integrated circuit

Voltage Spike Protection for Power DMOS Devices

Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module

Semiconductor package having gap-filler injection-friendly structure

Pop precursor with interposer for top package bond pad pitch compensation

Semiconductor package and method for making the same

Packaged semiconductor device having improved locking properties

Semiconductor device

Electrode pad having a recessed portion

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device

Method of manufacturing an electronic device with a package locking system

Tungsten stiffener for flexible substrate assembly

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

Etched surface mount islands in a leadframe package

Finger sensor including encapsulating layer over sensing area and related methods

Combined packaged power semiconductor device

Light emitting device and lighting system having the same

PACKAGED LEDS WITH PHOSPHOR FILMS, AND ASSOCIATED SYSTEMS AND METHODS

Method for testing a contact structure

Method of manufacturing cooling fin and package substrate with cooling fin

INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Package substrate

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

Device for removing electromagnetic interference and semiconductor package including the same

Chip package structure

STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS

STACKED CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD

Package on package having improved thermal characteristics

Semiconductor device and manufacturing method thereof

Semiconductor package

Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate

Semiconductor arrangement with a solder resist layer

Method of manufacturing a substrate strip with wiring

Surface mountable device

Component having a through-contact

Semiconductor Package

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

Multi-chip package with pillar connection

CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD

Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof

Integrated circuit apparatus, systems, and methods

Apparatus for thermally enhanced semiconductor package

Integrated circuit package system with package stacking and method of manufacture thereof

SEMICONDUCTOR DEVICE

Pad configurations for an electronic package assembly

Semiconductor component and method of manufacture

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

Semiconductor package with a conductive shielding member

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

AC switch having compound semiconductor MOSFETs

Manufacturing method of semiconductor device

Semiconductor package and method of forming the same

Method of using white resin in an electronic device

Integrated battery and IC

Reception circuit and signal reception method

Inductive circuit arrangement

SIGNAL TRANSMISSION SYSTEM AND SIGNAL TRANSMISSION METHOD

Microelectronic packages having cavities for receiving microelectronic elements

Package stacking through rotation

Integrated circuit package system with embedded die superstructure and method of manufacture thereof

Chip package having a chip combined with a substrate via a copper pillar

Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

Semiconductor device with substrate-side exposed device-side electrode and method of fabrication

Semiconductor module with electrical switching elements

Detector module

RIBBON BONDING TOOLS AND METHODS OF USING THE SAME

Method for fabricating chip elements provided with wire insertion grooves

METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE

Method for fabricating heat dissipation package structure

Method of fabricating wiring board and method of fabricating semiconductor device

Semiconductor module device and driving apparatus having the same

Electrical connections for multichip modules

Integrated circuit packaging system with dual side connection and method of manufacture thereof

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

Integrated circuit packaging system with isolated pads and method of manufacture thereof

Electronic device incorporating the white resin

Near chip scale semiconductor packages

THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS

Method for manufacturing a semiconductor component

Stacked electronic component and manufacturing method thereof

Semiconductor Package

Stacking integrated circuits containing serializer and deserializer blocks using through silicon via

Chip packaging

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

Chip package and method for forming the same

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Chip package device and manufacturing method thereof

Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material

Leadless package for high current devices

Direct contact leadless package

Stacked-die package for battery power management

LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Three-dimensional package structure

Semiconductor Device with Circuit for Reduced Parasitic Inductance

Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device

Thin film light emitting diode

Semiconductor package having an antenna with reduced area and method for fabricating the same

Fuel gauge circuit and battery pack

IC Chip Coating Material and Vacuum Fluorescent Display Device Using Same

Integrated circuit with supply line intra-chip clock interface and methods for use therewith

Stacked semiconductor package and method for manufacturing the same

Semiconductor device and method for fabricating semiconductor device

Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint

Semiconductor structure and manufacturing method thereof

Semiconductor package, semiconductor device, and semiconductor module

Chip unit and stack package having the same

Semiconductor device and power semiconductor device

Nano-structured gasket for cold weld hermetic MEMS package and method of manufacture

Lead frame, semiconductor apparatus using this lead frame, intermediate product thereof and manufacturing method thereof

Die backside standoff structures for semiconductor devices

Interdigitated conductive support for GaN semiconductor die

SUBSTRATE FOR AN ELECTRICAL DEVICE

Isolating wire bonding in integrated electrical components

Microelectronic packages and methods therefor

Stackable layer containing ball grid array package

Electronic component device and method for producing the same

NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device packages including a semiconductor device and a redistribution element

Stackable power MOSFET, power MOSFET stack, and process of manufacture

Carbon nanotube circuit component structure

Laser etch via formation

INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD

SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor chip with post-passivation scheme formed over passivation layer

Lead frame based semiconductor package and a method of manufacturing the same

LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Isolated wire bond in integrated electrical components

Semiconductor device

Light Emitting Diode Package Structure and Manufacturing Method Therefor

Semiconductor device

Cutting blade for a wire bonding system

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

Die package

Semiconductor device with stacked semiconductor chips

Semiconductor on semiconductor substrate multi-chip-scale package

Method of making a connection component with posts and pads

Integrated circuits with multiple I/O regions

Integrated circuit package system with contoured encapsulation and method for manufacturing thereof

Quad flat non-leaded semiconductor package and fabrication method thereof

Lead frame package structure for side-by-side disposed chips

Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height

Semiconductor device packages with electromagnetic interference shielding

Semiconductor package structure and package process

LIGHT-EMITTING DIODE PACKAGE USING A LIQUID CRYSTAL POLYMER

Device for protecting an electronic integrated circuit housing against physical or chemical ingression

TRANSDUCER OF AN ULTRASONIC BONDER

Method of manufacturing a power transistor module and package with integrated bus bar

Method for manufacturing integrated circuit package system with under paddle leadfingers

Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof

Rigid power module suited for high-voltage applications

Package-on-package system with through vias and method of manufacture thereof

Stack package having flexible conductors

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor device and method of wafer level package integration

Wafer level die integration and method therefor

Semiconductor device having multiple semiconductor elements

Stacked semiconductor package

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Chip package structure and method of making the same

Ultra high speed signal transmission/reception

Semiconductor device capable of switching operation modes

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS

Light emitting diode and light source module incorporating the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate

Leadframe package for high-speed data rate applications

Ball-Grid Array Device Having Chip Assembled on Half-Etched metal Leadframe

Method for manufacture of inline integrated circuit system

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

OPTO-ELECTRONIC TRANSCEIVER MODULE SYSTEM

ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof

Semiconductor device

Embedded semiconductive chips in reconstituted wafers, and systems containing same

SEMICONDUCTOR DEVICE

System in package with heat sink

Stacked Semiconductor Device Package Assemblies with Reduced Wire Sweep and Manufacturing Methods Thereof

SEMICONDUCTOR LAMINATION PACKAGE AND METHOD OF PRODUCING SEMICONDUCTOR LAMINATION PACKAGE

LEAD FRAME WITH RECESSED DIE BOND AREA

Integrated circuit devices having selectively strengthened composite interlayer insulation layers and methods of fabricating the same

Monolithic semiconductor switches and method for manufacturing

Semiconductor device and communication method

Semiconductor device and method of forming high-attenuation balanced band-pass filter

Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same

Heat dissipation by through silicon plugs

Semiconductor package with through silicon vias

Semiconductor device, method for manufacturing semiconductor device, apparatus for manufacturing semiconductor device, and method for evaluating semiconductor device

Method for manufacturing wafer scale heat slug system

SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME

Chipstack package and manufacturing method thereof

SEMICONDUCTOR CHIP USED FOR EVALUATION, EVALUATION SYSTEM, AND REPAIRING METHOD THEREOF

Semiconductor chip with coil element over passivation layer

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor packages having warpage compensation

Semiconductor device

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure

Integrated circuit packaging system with leads and method of manufacture thereof

Integrated circuit packaging system with an intermediate pad and method of manufacture thereof

Dual-leadframe multi-chip package and method of manufacture

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Method for fabrication of a semiconductor device and structure

Integrated circuit having a semiconductor substrate with barrier layer

Method for fabrication of a semiconductor device and structure

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same