Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same

Molded power-supply module with bridge inductor over other components

Electric power conversion apparatus

System-in-package using embedded-die coreless substrates, and processes of forming same

Silicon substrate for package

Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof

Chip package and method for forming the same

Integrated circuit package system with package stacking and method of manufacture thereof

Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut

Integrated circuit packaging system with lead frame and method of manufacture thereof

Semiconductor substrate and semiconductor chip

Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same

Distributed semiconductor device methods, apparatus, and systems

Board on chip package

Layered chip package with wiring on the side surfaces

Process for fabricating electronic components using liquid injection molding

QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Lead frame for semiconductor device and method of manufacturing of the same

Quad flat non-leaded semiconductor package

Package having spaced apart heat sink

High power semiconductor device for wireless applications and method of forming a high power semiconductor device

Multilayered board semiconductor device with BGA package

Semiconductor packaging and fabrication method using connecting plate for internal connection

Integrated circuit package for semiconductior devices with improved electric resistance and inductance

Electronic circuit device

Enhanced integrated circuit package

METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS

CONNECTING PAD PRODUCING METHOD

Semiconductor package and semiconductor device

Semiconductor package with embedded die and its methods of fabrication

Semiconductor device capable of switching operation mode and operation mode setting method therefor

Semiconductor device and optical pickup device

Semiconductor device with copper wirebond sites and methods of making same

Semiconductor device support for bonding

Light emitting device package and lighting system

CURRENT SENSOR FOR A SEMICONDUCTOR DEVICE AND SYSTEM

Semiconductor die having a redistribution layer

Thermal vias in an integrated circuit package with an embedded die

Semiconductor device and method of manufacturing a semiconductor device

Microwave circuit package

Semiconductor device having IPD structure with smooth conductive layer and bottom-side conductive layer

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor memory device with plural memory die and controller die

Light emitting device

Current sensors and methods

Semiconductor circuit and switching power supply apparatus

PACKAGE DEVICE AND FABRICATION METHOD THEREOF

Chip structure

Two-shelf interconnect

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

Semiconductor device assemblies

LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH

Integrated circuit packaging system with shield and method of manufacture thereof

Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame

Micro-optical device packaging system

Semiconductor device having a base, a cavity, a diaphragm, and a substrate

METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Method for manufacturing optical device, optical device, and biological information detector

RFID integrated circuit with integrated antenna structure

Semiconductor device

METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE

Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method

Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer

Land grid array package capable of decreasing a height difference between a land and a solder resist

Integrated circuit package with enlarged die paddle

Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same

Embedded component substrate and manufacturing methods thereof

Unique Package Structure

Method for making semiconductor package

SEMICONDUCTOR PACKAGE

Stacked semiconductor package

Systems and Methods Providing Arrangements of Vias

Semiconductor device packages having stacking functionality and including interposer

Stacked-die electronics package with planar and three-dimensional inductor elements

Semiconductor device

Semiconductor device

Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device

Interconnection tape providing a serial electrode pad connection in a semiconductor device

Edge connect wafer level stacking

Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate

Integrated circuit packaging system having dual sided connection and method of manufacture thereof

Recessed semiconductor substrates and associated techniques

Package for housing semiconductor element and semiconductor device using the same

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

LED assembly with a protective frame

Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the same

Method of manufacturing a semiconductor device

Array-molded package-on-package having redistribution lines

PACKAGE FOR SYNCHRONOUS RECTIFIER MODULE

Illumination device with semiconductor light-emitting elements

High frequency semiconductor device

Interconnection structure

Interconnection structure and its design method

Stacked package of semiconductor device

Semiconductor device structures and electronic devices including same hybrid conductive vias

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

Etched recess package on package system

Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof

Method of stacking flip-chip on wire-bonded chip

SEMICONDUCTOR DEVICE

NON-DIRECT BOND COPPER ISOLATED LATERAL WIDE BAND GAP SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT PACKAGE, METHOD FOR PRODUCING THE SAME AND INTERPOSER

Fabrication method of package structure having MEMS element

Signal transmission arrangement

Stacked semiconductor package

Signal isolators using micro-transformers

Chip module

Semiconductor integrated circuit

Bonded structure and manufacturing method for bonded structure

SEMICONDUCTOR PACKAGE

PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE

Dual die semiconductor package

EMI shielding package structure and method for fabricating the same

Package structure having MEMS element

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

Arrangement for energy conditioning

Semiconductor device manufacturing method

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

High frequency amplifier

Electronic devices and components for high efficiency power circuits

Laser optical path detection

WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCOTOR PACKAGE HAVING THE WIRING SUBSTRATE

Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas

Semiconductor device sealed in a resin section and method for manufacturing the same

SEMICONDUCTOR DEVICE

Attaching passive components to a semiconductor package

Microelectronic devices

Semiconductor package with single sided substrate design and manufacturing methods thereof

Tape wiring substrate and tape package using the same

Die package including multiple dies and lead orientation

Method for establishing and closing a trench of a semiconductor component

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

Light emitting diode package and method for forming the same

Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems

Microelectronic packages and methods therefor

Method for Fabricating Array-Molded Package-on-Package

METHOD OF PACKAGING SEMICONDUCTOR DEVICE

Method for manufacturing electronic device and electronic device

Electronic packages with fine particle wetting and non-wetting zones

Die bonding a semiconductor device

Wiring board, semiconductor device and method for manufacturing the same

Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof

Semiconductor chip package assembly with deflection-resistant leadfingers

Method and apparatus for directing molding compound flow and resulting semiconductor device packages

ISOLATOR AND METHOD OF MANUFACTURING THE SAME

High voltage devices and methods of forming the high voltage devices

Fabrication method of semiconductor package structure

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT

OPTOELECTRONIC DEVICE

SYSTEM-IN-PACKAGE HAVING EMBEDDED CIRCUIT BOARDS

Package structure

HEAT/ELECTRICITY DISCRETE METAL CORE-CHIP ON BOARD MODULE

VOLTAGE CONVERTER WITH INTEGRATED SCHOTTKY DEVICE AND SYSTEMS INCLUDING SAME

Semiconductor device and DC-to-DC converter

Inductive relayed coupling circuit between substrates

Quad flat no lead (QFN) package

Integrated circuit packaging system having planar interconnect and method for manufacture thereof

Semiconductor package and stack semiconductor package having the same

PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE

Semiconductor package

Semiconductor package

PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME

Semiconductor package having chip using copper process

Self repairing IC package design

Semiconductor device

Semiconductor package structure

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Circular shield of a circuit-substrate laminated module and electronic apparatus

Semiconductor package and method for making the same

Image sensor packaging structure with black encapsulant

ELECTRICAL MODULE

Disguising test pads in a semiconductor package

Bonding apparatus

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION

Device and method for limiting drain-source voltage of transformer-coupled push pull power conversion circuit

Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element

Systems employing a stacked semiconductor package

Apparatus and method for embedding components in small-form-factor, system-on-packages

Radio frequency amplifier with effective decoupling

SEMICONDUCTOR DEVICE, AND RESIN COMPOSITION USED FOR SEMICONDUCTOR DEVICE

Hybrid integrated circuit device

Metal plugged substrates with no adhesive between metal and polyimide

Multiple surface finishes for microelectronic package substrates

Lead frame land grid array with routing connector trace under unit

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Pre-soldered leadless package

Apparatus and method for embedding components in small-form-factor, system-on-packages

Integrated circuit package with embedded components

Stackable circuit structures and methods of fabrication thereof

METHOD FOR STACKING DIE IN THIN, SMALL-OUTLINE PACKAGE

Module for Use in a Multi Package Assembly and a Method of Making the Module and the Multi Package Assembly

Integrated circuit packaging system with embedded interconnect and method of manufacture thereof

Leadframe circuit and method therefor

Integrated circuit packaging system with package stacking and method of manufacture thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Printed wiring board and method for manufacturing printed wiring board

Method and apparatus for pass/fail determination of bonding and bonding apparatus

Semiconductor device and communication method

Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminates

External storage device and method of manufacturing external storage device

Integrated circuit packaging system with bond wire pads and method of manufacture thereof

Integrated circuit packaging system with a stackable package and method of manufacture thereof

Semiconductor devices including voltage switchable materials for over-voltage protection

High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same

Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps

Chip assembly with chip-scale packaging

Integrated circuit packaging system with stacking interconnect and method of manufacture thereof

Integrated circuit packaging system with package stacking and method of manufacture thereof

Semiconductor die package including IC driver and bridge

Panel based lead frame packaging method and device

Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof

Integrated circuit packaging system with shielded package and method of manufacture thereof

High voltage semiconductor device including a free wheel diode

Wiring board manufacturing method, semiconductor device manufacturing method and wiring board

Leadframe for leadless package, structure and manufacturing method using the same

SEMICONDUCTOR DEVICE WITH FILTER CIRCUIT

AREA REDUCTION FOR SURFACE MOUNT PACKAGE CHIPS

Semiconductor Device and Method of Confining Conductive Bump Material with Solder Mask Patch

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

Multi-chip stacked package and its mother chip to save interposer

Semiconductor device with sealed semiconductor chip

Leadframe for leadless package, structure and manufacturing method using the same

Heat radiation member for a semiconductor package with a power element and a control circuit

Auxiliary leadframe member for stabilizing the bond wire process

Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof

Semiconductor device, and communication apparatus and electronic apparatus having the same

Semiconductor device

Method for manufacturing semiconductor package system with die support pad

Package including an underfill material in a portion of an area between the package and a substrate or another package

Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting method

Universal IO unit, associated apparatus and method

Alternator with synchronous rectification equipped with an improved electronic power module

Stacked structure of semiconductor packages including through-silicon via and inter-package connector, and method of fabricating the same

Semiconductor device

Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area

Integrated circuit packaging system with stackable package and method of manufacture thereof

Integrated circuit packaging system with flip chip and method of manufacture thereof

3D interconnection structure and method of manufacturing the same

Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation

INTEGRATED PASSIVE DEVICE ASSEMBLY

Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region

Method of Fabricating Semiconductor Die with Through-Hole Via on Saw Streets and Through-Hole Via in Active Area of Die

Packaged device and method of manufacturing the same

Wireless apparatus having shielding function

Integrated circuit package system with warp-free chip

Semiconductor device and method of forming electrical interconnect with stress relief void

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHODS OF THE SAME

Stack semiconductor package and method for manufacturing the same

Semiconductor system-in-package and methods for making the same

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Semiconductor device including first semiconductor chip including first pads connected to first terminals, and second semiconductor chip including second pads connected to second terminals

Electrical bond connection system

Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE

MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE

Multi-layer thick-film RF package

SEMICONDUCTOR CHIP PACKAGE WITH MOLD LOCKS

Area efficient through-hole connections

Semiconductor device, production method for the same, and substrate

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Pad structure for semiconductor devices

Power semiconductor module and method for operating a power semiconductor module

SEMICONDUCTOR CHIP PACKAGE WITH MOLD LOCKS

Integrated circuit packaging system with interconnect and method of manufacture thereof

Integrated Circuit Packaging with Split Paddle

Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads

Semiconductor device and method of forming IPD on molded substrate

Bonding apparatus and bonding method

Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

SEMICONDUCTOR PACKAGE AND DC-DC CONVERTER

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Microelectronic package and method of manufacturing same

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Joint structure, joining material, and method for producing joining material containing bismuth

Spiral staircase shaped stacked semiconductor package and method for manufacturing the same

Semiconductor package and system

POWER AND SIGNAL DISTRIBUTION OF INTEGRATED CIRCUITS

Laminate electronic device

Integrated circuit packaging system with leads and method of manufacture thereof

Semiconductor package with metal straps

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOF

Semiconductor device package

Method of fabricating backside-illuminated image sensor

Semiconductor devices having redistribution structures and packages, and methods of forming the same

Dicing/die bonding film

Method of manufacturing a semiconductor device having a heat spreader

Method for making microstructures by converting porous silicon into porous metal or ceramics

Power semiconductor module

Semiconductor device, manufacturing method thereof, and electronic apparatus

Semiconductor apparatus and chip selection method thereof

Power semiconductor module and method for operating a power semiconductor module