Multi-chip package and method of manufacturing thereof

Integrated circuit packaging system with pad connection and method of manufacture thereof

Electronic component

PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE CONFIGURED TO IMPROVE SOLDER JOINT RELIABILITY AND SEMICONDUCTOR PACKAGE HAVING THE SAME

Semiconductor package

Semiconductor device with stacked power converter

System and method for integrated waveguide packaging

Stacked package structure including insulating layer between two stacked packages

Multi-chip package

Semiconductor device for smoothing the voltage of the end face of a drain of a high frequency semiconductor chip

WIRE BONDING METHOD

Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding

Semiconductor device and manufacturing method of a semiconductor device

Radiofrequency amplifier

Edge connect wafer level stacking

Semiconductor chip and semiconductor device

Detector array with a through-via interposer

MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME

Semiconductor devices having electrodes

Integrated circuit package system with stacked die

Clip interconnect with encapsulation material locking feature

Integrated circuit packaging system with multi-row leads and method of manufacture thereof

Compensation network for RF transistor

Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

IMAGING OPERATIONS FOR A WIRE BONDING SYSTEM

Semiconductor device and electronic device

Stacked packaged integrated circuit devices

Multi-chip module

MODULE HOUSING AND METHOD FOR MANUFACTURING A MODULE HOUSING

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

Integrated circuit packaging system with stack interconnect and method of manufacture thereof

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Integrated circuit device having die bonded to the polymer side of a polymer substrate

Using bump bonding to distribute current flow on a semiconductor power device

DIE DOWN DEVICE WITH THERMAL CONNECTOR

ENHANCED HEAT SPREADER FOR USE IN AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic devices

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE WITH ELECTROMAGNETIC SHIELDING

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS, MOUNTING METHOD AND SEMICONDUCTOR CHIP FOR VERTICAL MOUNTING ONTO CIRCUIT SUBSTRATES

ULTRA THIN DIE TO IMPROVE SERIES RESISTANCE OF A FET

Package and high frequency terminal structure for the same

Input/output core design and method of manufacture therefor

Integrated circuit packaging system with foldable substrate and method of manufacture thereof

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Semiconductor package with bonding wires of reduced loop inductance

Stacked integrated circuit package having recessed sidewalls

Microelectronic package with terminals on dielectric mass

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Integrated circuit packaging system with connection structure and method of manufacture thereof

Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground

Microelectronic devices and methods for manufacturing microelectronic devices

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor packages with reduced solder voiding

Power semiconductor module

Contact pad

Chip-scale semiconductor die packaging method

In-package microelectronic apparatus, and methods of using same

Quad flat package with exposed paddle

Systems and methods for ESD protection for RF couplers in semiconductor packages

DIFFERENTIAL SIGNAL TRANSMISSION LINE, IC PACKAGE, AND METHOD FOR TESTING SAID DIFFERENTIAL SIGNAL TRANSMISSION LINE AND IC PACKAGE

Semiconductor packages and methods for producing the same

Semiconductor devices and methods of manufacturing the same

System for relieving stress and improving heat management in a 3D chip stack

Integrated circuit system with distributed power supply comprising interposer and voltage regulator module

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES

High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Method for Producing an Electrical Circuit and Electrical Circuit

Hybrid integrated circuit device and electronic device

Semiconductor module having an insert and method for producing a semiconductor module having an insert

ANTENNA

Semiconductor module

Reversible top/bottom MEMS package

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

Power package module with low and high power chips and method for fabricating the same

DISCRETE CIRCUIT COMPONENT HAVING COPPER BLOCK ELECTRODES AND METHOD OF FABRICATION

Chip design having integrated fuse and method for the production thereof

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Semiconductor module having a semiconductor chip stack and method

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Semiconductor device packages with protective layer and related methods

Semiconductor device having die pads isolated from interconnect portion and method of assembling same

High power ceramic on copper package

Semiconductor package device with a heat dissipation structure and the packaging method thereof

Integrated circuit package system with encapsulation lock

Semiconductor device and method of shielding semiconductor die from inter-device interference

Package structure with micro-electromechanical element and manufacturing method thereof

FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE

Method of operating a clamping system of a wire bonding machine

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

LAMINATED SUBSTRATE WITH COILS

Element mounting substrate and semiconductor module

Device with semiconductor die attached to a leadframe

Carrier body for a semiconductor component, semiconductor component and method for producing a carrier body

Bond pad for wafer and package for CMOS imager

HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS

Atomic layer deposition encapsulation for power amplifiers in RF circuits

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

Package substrate and fabrication method thereof

Microelectronic devices and methods for filing vias in microelectronic devices

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

ENCAPSULATED CIRCUIT DEVICE FOR SUBSTRATES HAVING AN ABSORPTION LAYER, AND METHOD FOR THE MANUFACTURE THEREOF

Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics

Method and structure for top metal formation of liquid crystal on silicon devices

Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package

Semiconductor device for semiconductor package having through silicon vias of different heights

SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR PACKAGE

Chip package structure and chip packaging method

Leadframe package structure and manufacturing method thereof

Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die

Submount and manufacturing method thereof

Semiconductor device and the method of manufacturing the same

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Method for manufacturing semiconductor package

Semiconductor multi-project or multi-product wafer process

Printed Circuit Board For Board-On-Chip Package, Board-On-Chip Package Including The Same, And Method Of Fabricating The Board-On-Chip Package

PACKAGE SUBSTRATE

Semiconductor device comprising thin-film terminal with deformed portion

Semiconductor assembly and semiconductor package including a solder channel

Integrated circuit packaging system with interposer interconnections and method of manufacture thereof

Semiconductor device including shielding layer and fabrication method thereof

Massively parallel interconnect fabric for complex semiconductor devices

Flexible packaging for chip-on-chip and package-on-package technologies

Chip Capacitor Precursors

Off-chip VIAS in stacked chips

Semiconductor device packages stacked together having a redistribution layer

SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MODULE USING THE SAME

Semiconductor module comprising an insert

Electronic Package and Method of Making an Electronic Package

Delamination resistant device package having raised bond surface and mold locking aperture

Assembly method for converting the precursors to capacitors

Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof

SINTERED CERAMIC AND SUBSTRATE COMPRISING SAME FOR SEMICONDUCTOR DEVICE

Circuit device

Set of resin compositions for preparing system-in-package type semiconductor device

SEMICONDUCTOR PACKAGE

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same

Package for semiconductor device including guide rings and manufacturing method of the same

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

Integrated circuit packaging system with interlock and method of manufacture thereof

Integrated circuit packaging system with lead encapsulation and method of manufacture thereof

Semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor chip package

Communication device

Semiconductor Package for Higher Power Transistors

Module with silicon-based layer

Method for mounting luminescent device

Integrated circuit with intra-chip clock interface and methods for use therewith

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Power conversion module

Chip to dielectric waveguide interface for sub-millimeter wave communications link

High frequency amplifier

Flexible distributed LED-based light source and method for making the same

Metal can impedance control structure

Integrated circuit packaging system with die paddles and method of manufacture thereof

Stacked multi-die packages with impedance control

Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist

SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS EMPLOYING THE SAME

Method for depackaging prepackaged integrated circuit die and a product from the method

Semiconductor device and method of forming composite bump-on-lead interconnection

Integrated circuit packaging system with post and method of manufacture thereof

Semiconductor device with parasitic bipolar transistor

Integrated power converter package with die stacking

Integrated circuit packaging system with stack interconnect and method of manufacture thereof

Integrated circuit packaging system with paddle molding and method of manufacture thereof

TSOP with impedance control

Transition from a chip to a waveguide port

SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR

Vertical discrete devices with trench contacts and associated methods of manufacturing

Electronic device comprising a chip disposed on a pin

Method of making a high frequency device package

Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops

Semiconductor device including coupling conductive pattern

Method of manufacture of integrated circuit packaging system with stacked integrated circuit

SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE DIES AND A COMMON NODE STRUCTURE

MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

Complex semiconductor device for use in mobile equipment

Electronic Device, Circuit Board Assembly, and Semiconductor Device

Power amplifier circuit

SEMICONDUCTOR DEVICE AND SIGNAL TRANSMISSION METHOD

Electronic packaging with a variable thickness mold cap

Integrated circuit packaging system with film encapsulation and method of manufacture thereof

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Semiconductor component and device provided with heat dissipation means

Embedded ball grid array substrate and manufacturing method thereof

Semiconductor device

Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking

Semiconductor module and method for production thereof

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

POWER SEMICONDUCTOR MODULE HAVING SINTERED METAL CONNECTIONS, PREFERABLY SINTERED SILVER CONNECTIONS, AND PRODUCTION METHOD

Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Package structure for DC-DC converter

Semiconductor packages having increased input/output capacity and related methods

Method of fabricating a semiconductor device having a resin with warpage compensated structures

Manufacturing method for semiconductor device carrier and semiconductor package using the same

LED light source unit for backlight of liquid crystal display, and liquid crystal display

Multi-chip package with offset die stacking

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

SUBSTRATE FOR A MICROELECTRONIC PACKAGE AND METHOD OF FABRICATING THEREOF

Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

Lead frame for semiconductor device

Semiconductor device and method of blowing fuse thereof

Method for manufacturing semiconductor device

METHOD FOR MANUFACTURING CHIP PACKAGE

Method for manufacturing semiconductor devices

Semiconductor apparatus, inspection method thereof and electric device

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Substrate dicing technique for separating semiconductor dies with reduced area consumption

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE HAVING THROUGH-SILICON-VIA (TSV) CHIP EMBEDDED THEREIN AND FABRICATION METHOD THEREOF

Semiconductor package

Structures embedded within core material and methods of manufacturing thereof

Package structure

Semiconductor apparatus

Helical springs electrical connecting a plurality of packages

Semiconductor package for forming a leadframe package

ELECTRONIC ASSEMBLY

Wiring board and method of manufacturing a semiconductor device

APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS

Authentication device, authentication method, and an information storage medium storing a program

Method of making a compliant printed circuit peripheral lead semiconductor package

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate

IMPLEMENTING MULTIPLE DIFFERENT TYPES OF DIES FOR MEMORY STACKING

Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame

Apparatus and method for forming a wire loop

Wireless communication device and semiconductor package device having a power amplifier therefor

Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die

VERTICALLY CONTACTED ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME

Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP

Integrated circuit packaging system with stacked lead and method of manufacture thereof

Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof

Semiconductor package substrate and semiconductor package having the same

Integrated inductor

Monolithic microwave integrated circuit

SEMICONDUCTOR DEVICE WITH LESS POWER SUPPLY NOISE

Capillary and ultrasonic transducer for ultrasonic bonding

Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package

High temperature operating package and circuit design

Side wettable plating for semiconductor chip package

Stacked assembly including plurality of stacked microelectronic elements

Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV

High-voltage packaged device

Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device

Compact semiconductor package with integrated bypass capacitor

Package and fabrication method of the same

Semiconductor package and method of testing same

In-plane silicon heat spreader and method therefor

Methods of operating electronic devices, and methods of providing electronic devices

Method for manufacturing ball grid array package stacking system

Ultra-thin quad flat no-lead (QFN) package

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

Method of making an electronic device

Circuit Device

Solder joint inspection

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Semiconductor device having a pad

Chip package and fabricating method thereof

BALL GRID ARRAY PACKAGE

Routable array metal integrated circuit package fabricated using partial etching process

Integrated circuit packaging system with rounded interconnect

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor element with semiconductor die and lead frames

Leadframe for IC package and method of manufacture

Semiconductor device packages having electromagnetic interference shielding and related methods

Power semiconductor device

Light emitting diode light source having a ceramic substrate

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME

Arrangement for energy conditioning

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor device

Integrated circuits with phase change devices

Doherty amplifier and semiconductor device

Circuit device and method of manufacturing the same

Semiconductor device with conductive vias between saw streets

Semiconductor device and method of conforming conductive vias between insulating layers in saw streets

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Semiconductor device

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Integrated circuit package with open substrate and method of manufacturing thereof

Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip

Semiconductor package structure and forming method thereof

Semiconductor device and method of forming stress relief layer between die and interconnect structure

Package-on-package structures with reduced bump bridging

Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch

Lid for an electrical hardware component

Integrated circuit packaging system with island terminals and method of manufacture thereof

Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof

BONDING STRUCTURE AND METHOD