SEMICONDUCTOR PACKAGE, STACK MODULE, CARD, AND ELECTRONIC SYSTEM

Package-on-package technology for fan-out wafer-level packaging

Integrated circuit packaging system with a stack package and method of manufacture thereof

Processes and structures for IC fabrication

Methods for interconnecting bonding pads between components

Enhanced integrated circuit package

Integrated circuit packaging system with high lead count and method of manufacture thereof

IC PACKAGE HAVING AN INDUCTOR ETCHED INTO A LEADFRAME THEREOF

Semiconductor device

Processes and structures for IC fabrication

Image sensor package and image sensing module using same

Radio frequency unit analog level detector and feedback control system

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

Method and apparatus for no lead semiconductor package

Manufacturing method of a lead frame

In-package microelectronic apparatus, and methods of using same

High Frequency Wiring Board, Package for Housing Electronic Component, Electronic Device, and Communication Apparatus

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

Integrated package

Semiconductor device

Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support

Semiconductor die attachment method using non-conductive screen print and dispense adhesive

Method of manufacturing layered chip package

Optical module and method for manufacturing same

Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module

Packaged electronic devices having die attach regions with selective thin dielectric layer

Semiconductor device

Integrated circuit packaging system with interposer interconnections and method of manufacture thereof

Semiconductor device and method of forming IPD structure using smooth conductive layer and bottom-side conductive layer

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

Bonding apparatus and bonding stage height adjustment method for the bonding apparatus

Semiconductor package with position member

Semiconductor device and method of manufacturing the same

Power semiconductor device and method for its production

Solid state switch arrangement

Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device

SEMICONDUCTOR PACKAGE USING CONDUCTIVE PLUG TO REPLACE SOLDER BALL

Semiconductor package

Method for fabrication of a semiconductor device and structure

Arrangement for energy conditioning

Substrate for electrical device

Semiconductor device with an improved solder joint

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

LID FOR A FUNCTIONAL PART AND A PROCESS FOR ITS MANUFACTURE

Heat sink and assembly or module unit

Semiconductor package, lead frame, and wiring board with the same

Lens support and wirebond protector

Circuit board having bypass pad

Semiconductor die having a redistribution layer

Semiconductor device

Stackable Package Having Embedded Interposer and Method for Making the Same

SUBSTRATE HAVING EMBEDDED SINGLE PATTERNED METAL LAYER, AND PACKAGE APPLIED WITH THE SAME, AND METHODS OF MANUFACTURING OF THE SUBSTRATE AND PACKAGE

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Integrated circuit packaging system with leads and transposer and method of manufacture thereof

Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE

Die down ball grid array packages and method for making same

Power semiconductor module including substrates spaced from each other

Antennas using chip-package interconnections for millimeter-wave wireless communication

Semiconductor chip and semiconductor device including the same

Techniques for packaging multiple device components

Die Exposed Chip Package

Mold lock on heat spreader

Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same

Semiconductor Device Package Having Chip With Conductive Layer

High power ceramic on copper package

SEMICONDUCTOR DEVICE

Semiconductor device driving bridge-connected power transistor

Photo detector

Massively parallel interconnect fabric for complex semiconductor devices

Molded housing used in force fit method

Package with multiple dies

Methodology for processing a panel during semiconductor device fabrication

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Method for manufacturing a rigid power module suited for high-voltage applications

Semiconductor device

Electronic component for surface mounting

Plastic package and method of fabricating the same

System and method for multi-chip module die extraction and replacement

Semiconductor package including power ball matrix and power ring having improved power integrity

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Substrate for a microelectronic package and method of fabricating thereof

Semiconductor packages and electronic systems including the same

Microelectronic packages fabricated at the wafer level and methods therefor

Leadframe

Power lead-on-chip ball grid array package

Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device including an inductor that is inductively coupled to another inductor

Method for Mounting Flip Chip and Substrate Used Therein

Method of fabricating stacked semiconductor structure

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

Multi-chip packages providing reduced signal skew and related methods of operation

Interposer substrate including capacitor for adjusting phase of signal transmitted in same interposer substrate

IC package reducing wiring layers on substrate and its carrier

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND SUBSTRATE PROCESSING METHOD

Electronic device package

Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof

Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof

Integrated circuit package system with leaded package and method for manufacturing thereof

Panel, semiconductor device and method for the production thereof

SEMICONDUCTOR MODULE

Method of forming an inductor on a semiconductor wafer

Semiconductor chip pad structure and method for manufacturing the same

Active area bonding compatible high current structures

Widebody coil isolators

Exposed die pad package with power ring

Semiconductor device capable of switching operation modes

Microelectronic packages and methods therefor

Interconnection of IC Chips by Flex Circuit Superstructure

Assembling substrates that can form 3-D structures

Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layer

SEMICONDUCTOR DEVICE

Stacked microfeature devices

Power semiconductor module comprising a connection device with internal contact spring connection elements

Semiconductor package and manufacturing method thereof

Stacked semiconductor package and method of manufacturing thereof

Staircase shaped stacked semiconductor package

Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof

Package-on-package interconnect stiffener

Relay board and semiconductor device having the relay board

Semiconductor device and manufacturing method thereof

ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Manufacturing method of advanced quad flat non-leaded package

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package to remove power noise using ground impedance

Process for producing connector and connector produced by the same process

Method of fabricating a two-sided die in a four-sided leadframe based package

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS

Manufacturing method of bottom substrate of package

SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRUCTURE

Semiconductor optical communication module and manufacturing method thereof

DC/DC converter package having separate logic and power ground terminals

Semiconductor package having underfill agent dispersion

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Stacked memory device including a pre-decoder/pre-driver sandwiched between a plurality of inter-decoders/inter-drivers

Stacked multichip package

Integrated circuit package system with multiple device units and method for manufacturing thereof

Packaged microelectronic devices and associated systems

Through-hole contacts in a semiconductor device

Method of fabricating semiconductor device and the semiconductor device

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor device

Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof

Semiconductor packages and electronic systems including the same

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof

Integrated circuit packaging system having dual sided connection and method of manufacture thereof

Integrated circuit packaging system with package stacking and method of manufacture thereof

Integrated circuit packaging system with stacked configuration and method of manufacture thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST TYPE INTERCONNECTOR AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit having wiring structure, solid image pickup element having the wiring structure, and imaging device having the solid image pickup element

Semiconductor module and camera module mounting said semiconductor module

Multilayer wiring substrate having a castellation structure

Wafer level packaging using flip chip mounting

Film-like adhesive, adhesive sheet, and semiconductor device using same

Semiconductor package

Power module

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

IO cell with multiple IO ports and related techniques for layout area saving

Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site

SEMICONDUCTOR DEVICE, AND STACKED STRUCTURE, PACKAGE, MODULE, AND ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Methods and systems for packaging integrated circuits

Stack type semiconductor package apparatus

Semiconductor package

Integrated circuit packaging system with layered packaging and method of manufacture thereof

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

Semiconductor device and semiconductor package having the same

Making a semiconductor device having conductive through organic vias

SEMICONDUCTOR PACKAGE SUBSTRATE INCLUDING FUSES, SEMICONDUCTOR DEVICE PACKAGE, SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND BACKSIDE ILLUMINATION SOLID-STATE IMAGING DEVICE

Semiconductor device having finger electrodes

Semiconductor device and method for manufacturing the same

Multiple layer strain gauge

Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die

Method for manufacturing capacitor embedded in interposer

FLMP buck converter with a molded capacitor and a method of the same

Microelectronic packages and methods therefor

Microelectronic assembly with impedance controlled wirebond and reference wirebond

SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM

Semiconductor device

Thee-dimensional integrated semiconductor device and method for manufacturing same

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND PACKAGING METHOD THEREOF

Flexible packaging for chip-on-chip and package-on-package technologies

Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

Wire loop and method of forming the wire loop

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Multi-die semiconductor package with heat spreader

Semiconductor device

Integrated circuit package-in-package system and method for making thereof

Semiconductor Packaging with Integrated Passive Componentry

Semiconductor device which can transmit electrical signals between two circuits

Semiconductor device

WIRING MEMBER, METAL COMPONENT WITH RESIN AND RESIN SEALED SEMICONDUCTOR DEVICE, AND PROCESSES FOR PRODUCING THEM

BONDING METHOD AND BONDING DEVICE

Method for manufacturing integrated circuit device having antenna conductors

Method of fabricating a semiconductor package with mold lock opening

Light emitting diode package and manufacturing method thereof

Semiconductor device

Semiconductor device

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

SEMICONDUCTOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE USING THE SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE

Lead and lead frame for power package

Routable array metal integrated circuit package

Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof

RF-IC PACKAGING METHOD AND CIRCUITS OBTAINED THEREBY

Composition encapsulating optical semiconductor and optical semiconductor device using same

Light emitting diode chip with electrical insulation element

Semiconductor device having a junction FET and a MISFET for control

WIRE SUPPLY DEVICE FOR A WIRE BONDER

Wireless communication device integrated into a single package

Component-containing module

Semiconductor device having shifted stacked chips

Semiconductor device

CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME

Lead frame

Complete power management system implemented in a single surface mount package

Quad flat non-leaded package

Lead frame

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate

Printed wiring board

Electronic device and lead frame

Semiconductor device and method of forming through vias with reflowed conductive material

Integrated circuit package having integrated faraday shield

Moisture-proof device, moisture-proof IC, and method for increasing moisture-proof capability of IC

Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package

Semiconductor device and method of forming through vias with reflowed conductive material

Semiconductor device having wiring layers with power-supply plane and ground plane

Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers

Circuit carrier and semiconductor package using the same

Stack package

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Reduced-crosstalk wirebonding in an optical communication system

Optical semiconductor device encapsulated with silicone resin

Lead frame assembly, package structure and LED package structure

Fully reflective and highly thermoconductive electronic module and method of manufacturing the same

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

Method of manufacturing semiconductor devices

Semiconductor device with additional power supply paths

Wire bonding method and semiconductor device

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Micro Ball Feeding Method

Package-on-package system with through vias and method of manufacture thereof

Quad flat package with exposed common electrode bars

Chip package and manufacturing method thereof

Manufacturing method of semiconductor device

Semiconductor apparatus with decoupling capacitor

Semiconductor device and wire bonding method

Electronic component device, and method of manufacturing the same

Thin film light emitting diode

Wire bonding apparatus, record medium storing bonding control program, and bonding method

PACKAGE SUBSTRATE STRUCUTRE WITH CAVITY AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Thermoplastic material

Wireless radio frequency signal transceiving system

Carrier assembly for an integrated circuit

III-nitride devices and circuits

Electronic component

Power transistor package with integrated bus bar

Layered chip package with wiring on the side surfaces

Semiconductor assembly with one metal layer after base metal removal

Integrated circuit package system including shield

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires

Implantable microelectronic device and method of manufacture

ELECTRICAL DEVICE HAVING A POWER SOURCE WITH A MAGNETIC CAPACITOR AS AN ENERGY STORAGE DEVICE

Thermally enhanced semiconductor package

Package-on-package using through-hole via die on saw streets

MULTI-CHIP SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIAS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

LEADFRAME FOR SEMICONDUCTOR PACKAGES

Semiconductor device and manufacturing method therefor

Semiconductor chip package

CAPACITOR STRUCTURE IN A SEMICONDUCTOR DEVICE

Integrated Circuit Package for Magnetic Capacitor

Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same

Simple radio frequency integrated circuit (RFIC) packages with integrated antennas

Electronic packages with fine particle wetting and non-wetting zones

Method of manufacturing semiconductor device

Illumination device with semiconductor light-emitting elements

Package substrate structure and chip package structure and manufacturing process thereof

Adhesive tape and semiconductor package using the same

Method for manufacturing a semiconductor component and structure therefor

Monolithic semiconductor switches and method for manufacturing

Electronic device

CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME

Method for producing a metal-ceramic substrate for electric circuits on modules

Method to prevent corrosion of bond pad structure

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method of the same

3D integration of vertical components in reconstituted substrates