Semiconductor device and power supply device

Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Power module assembly with reduced inductance

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Light-emitting diode package

Method of manufacturing integrated circuit having stress tuning layer

Method of manufacturing the semiconductor device

Semiconductor device

Method of fabricating a package structure

Method for connecting a die assembly to a substrate in an integrated circuit

Optical signaling for a package-on-package stack

Semiconductor device

Integrated circuit package system with through semiconductor vias and method of manufacture thereof

Hybrid package

Ball grid array substrate with insulating layer and semiconductor chip package

Semiconductor package and method for fabricating the same

Method of attaching an interconnection plate to a semiconductor die within a leadframe package

Lead frame and intermediate product of semiconductor device

Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV

Semiconductor sensor for detecting a light radiation

Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same

Semiconductor chip, stack module, and memory card

Method of manufacturing a lead frame with a nickel coating

INTEGRATED CIRCUIT PACKAGE HAVING A CASTELLATED HEATSPREADER

Semiconductor package and method of manufacturing the same

Area reduction for die-scale surface mount package chips

Area reduction for surface mount package chips

Integrated circuit packaging system with cavity and method of manufacture thereof

Methods and devices for manufacturing cantilever leads in a semiconductor package

Multiple leadframe package

Area reduction for electrical diode chips

Area reduction for electrical diode chips

Semiconductor Device

Open cavity leadless surface mountable package for high power RF applications

Light emitting diode package and method of fabricating the same

Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate

Package-on-package system with via z-interconnections and method for manufacturing thereof

Electrical connection for multichip modules

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor packages having passive elements mounted thereonto

PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING SAME

Semiconductor package and process for fabricating same

Overmolded semiconductor package with a wirebond cage for EMI shielding

Solid state image capture device and method for manufacturing same

Semiconductor integrated circuit and multi-chip module

Connection for off-chip electrostatic discharge protection

Die stacking system and method

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit package system for stackable devices and method for manufacturing thereof

Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure

Integrated circuit packaging system with protective coating and method of manufacture thereof

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with shaped lead and method of manufacture thereof

Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings

Molded leadframe substrate semiconductor package

Pad layout structure of driver IC chip

Electronic component, board unit, and information-processing device

Electronic device

Stacked semiconductor device and method of connection test in the same

Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die

ELECTRONIC DEVICE

Method for manufacturing a semiconductor component

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding

Semiconductor device and method of forming bump-on-lead interconnection

Semiconductor device and method of manufacturing the same

STACKED SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

Mechanical coupling in a multi-chip module using magnetic components

RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors

SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND LEAD FRAME, COMPRISING A BENT CONTACT SECTION

Optoelectronic component and method for producing an optoelectronic component

MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AND ITS FABRICATION METHOD

Multiple die layout for facilitating the combining of an individual die into a single die

Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same

Semiconductor integrated circuit

3D smart power module

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

Package-on-package type semiconductor package

Semiconductor device and adhesive sheet

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Semiconductor package with semiconductor core structure and method of forming the same

Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof

Integration of SMD components in an IC housing

Semiconductor device and method of forming interposer with opening to contain semiconductor die

Semiconductor package and method of manufacturing the semiconductor package

Integrated circuit packaging system with cap layer and method of manufacture thereof

Integrated circuit packaging system with circuitry stacking and method of manufacture thereof

CHIP PACKAGE AND PROCESS THEREOF

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Semiconductor device having semiconductor chip within multilayer substrate

Semiconductor device including vertical transistor and horizontal transistor

LEAD FRAME AND METHOD OF FORMING SAME

Plastic electronic component package

Stack-type semiconductor package and electronic system including the same

Integrated circuit packaging system with fan-in package and method of manufacture thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Stacked-die package including substrate-ground coupling

Through hole electrode substrate with different area weighted average crystal grain diameter of metal in the conductive part and semiconductor device using the through hole electrode substrate

Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof

Three-dimensionally integrated semicondutor device and method for manufacturing the same

Semiconductor package

Substrate and package with micro BGA configuration

Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP

Integrated circuit packaging system with package-on-package and method of manufacture thereof

SEMICONDUCTOR DEVICE PACKAGE WITH DOWN-SET LEADS

Leadframe and chip package

Semiconductor die containing lateral edge shapes and textures

Device package substrate and method of manufacturing the same

Metal oxide semiconductor field effect transistor integrating a capacitor

Laminated substrate for an integrated circuit BGA package and printed circuit boards

Method of integrating a MOSFET with a capacitor

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

Manufacturing method of leadframe and semiconductor device

MEMS device package with vacuum cavity by two-step solder reflow method

SEMICONDUCTOR DEVICE

Semiconductor device and semiconductor package having the same

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

Impedance optimized chip system

Delamination resistant packaged die having support and shaped die having protruding lip on support

Electronic device submounts with thermally conductive vias and light emitting devices including the same

LAMINATION METHOD OF ADHESIVE TAPE AND LEAD FRAME

Method of calibrating a constant voltage supply for an ultrasonic transducer of a wire bonding machine

DICING/DIE BONDING FILM

Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond

HIGH-DENSITY MEMORY ASSEMBLY

Semiconductor device, and power conversion device using semiconductor device

Light-emitting device, planar light source including the light-emitting device, and liquid crystal display device including the planar light source

Transformer signal coupling for flip-chip integration

Electronic devices with extended metallization layer on a passivation layer

Wafer Level Stacked Die Packaging

SEMICONDUCTOR DEVICE PACKAGES WITH INTEGRATED HEATSINKS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Off-chip vias in stacked chips

Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant

Direct contact leadless package for high current devices

Semiconductor device with acene heat spreader

Encapsulant interposer system with integrated passive devices and manufacturing method therefor

Semiconductor package and method of manufacturing the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Hybrid Packaged Gate Controlled Semiconductor Switching Device Using GaN MESFET

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

Connector, Package Using the Same and Electronic Device

Photosensitive adhesive

Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same

Vertically stacked pre-packaged integrated circuit chips

Fabrication of compact opto-electronic component packages

High frequency circuit having multi-chip module structure

METHOD FOR ARRANGING COOLING FOR A COMPONENT AND A COOLING ELEMENT

MANUFACTURE OF A SMART CARD

Interposer chip and manufacturing method thereof

SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME

Stacked packaging improvements

Semiconductor device having stable signal transmission at high speed and high frequency

Electronic part and method of manufacturing the same

Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars

Light emitting diode package

Flip chip cavity package

Wireless transmission system and wireless transmission method

Illumination apparatus

METAL FRAME FOR ELECTRONIC PART

Circuit board having bypass pad

Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same

Integrated circuit

Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Ball-grid-array package, electronic system and method of manufacture

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

Embedded semiconductor die package and method of making the same using metal frame carrier

High bond line thickness for semiconductor devices

Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof

Manufacturing method for integrating a shunt resistor into a semiconductor package

Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages

Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon

Integrated circuit device and electronic equipment

Edge connect wafer level stacking

Power semiconductor circuit device and method for manufacturing the same

POWER DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor package requiring reduced manufacturing processes

Semiconductor device having an interposer

Microwave module

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor package and stacked semiconductor package having the same

Wireless communication unit and semiconductor device having a power amplifier therefor

Method and apparatus for manufacturing semiconductor device

Integrated circuit device and electronic apparatus

Semiconductor device and programming method

WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE

Semiconductor device and method of forming an interposer package with through silicon vias

SEMICONDUCTOR DEVICE

SUBSTRATE STRUCTURE FOR CAVITY PACKAGE

Semiconductor Package Thermal Performance Enhancement and Method

Method of reducing memory card edge roughness by edge coating

Integrated circuit packaging system with through silicon via base and method of manufacture thereof

Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame

Image sensor package structure with large air cavity

High frequency field-effect transistor

Thin foil semiconductor package

TEST CIRCUIT UNDER PAD

Semiconductor packages and methods of fabricating the same

High-bandwidth ramp-stack chip package

Semiconductor packages including heat slugs

PoP precursor with interposer for top package bond pad pitch compensation

Encapsulant cavity integrated circuit package system and method of fabrication thereof

Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNECTION WITHOUT USING WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME

Method for the low-temperature pressure sintering of electronic units to heat sinks

Semiconductor device

Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device

Manufacturing process for embedded semiconductor device

Method for packaging semiconductor dies having through-silicon vias

Semiconductor Device and Method of Forming Conductive TSV in Peripheral Region of Die Prior to Wafer Singulaton

MULTI-CHIP PACKAGE STRUCTURE SUITABLE FOR MULTI-PROCESSOR SYSTEM HAVING MEMORY LINK ARCHITECTURE

Providing in package power supplies for integrated circuits

Integrated circuit package system employing device stacking and method of manufacture thereof

METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGNING APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods

Semiconductor chip package

Leadframe having delamination resistant die pad

Semiconductor chip package

Multi-Connect Lead

Semiconductor device

Semiconductor-on-insulator with back side heat dissipation

Multi-die DC-DC buck power converter with efficient packaging

Method for exposing and cleaning insulating coats from metal contact surfaces

Near chip scale package integration process

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Dual-level package

Electronic circuit device

Multilayer dielectric substrate and semiconductor package

RESIN VARNISH USED FOR ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

System and method to reduce the bondwire/trace inductance

Simplified multichip packaging and package design

Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces

Lighting device, display, and method for manufacturing the same

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING

Semiconductor optical interconnection device and semiconductor optical interconnection method

Die-to-die electrical isolation in a semiconductor package

Chip scale module package in BGA semiconductor package

Semiconductor chip package and method for designing the same

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Systems and Methods of Improved Heat Dissipation with Variable Pitch Grid Array Packaging

Semiconductor Chip Secured to Leadframe by Friction

LEAD FRAME, AND ELECTRONIC PART USING THE SAME

Lead frame routed chip pads for semiconductor packages

Method of assembling a multi-component electronic package

Power converter integrated circuit floor plan and package

Light-emitting device and manufacturing method thereof

Wire payout measurement and calibration techniques for a wire bonding machine

Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages

SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME

Method of manufacturing semiconductor device

Coil transducer isolator packages

Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using same

Radio-frequency system in package including antenna

Power module and vehicle-mounted inverter using the same

PACKAGE PROCESS AND PACKAGE STRUCTURE

Layered chip package

Semiconductor device including two heat sinks and method of manufacturing the same

Semiconductor package and method of forming the same

Near chip scale semiconductor packages

Semiconductor package structure and package method thereof

Package manufacturing method and semiconductor device

FLAT CHIP PACKAGE AND FABRICATION METHOD THEREOF

Multi-chip package and method of providing die-to-die interconnects in same

Semiconductor packaging structure having conductive gel to package semiconductor device

IC PACKAGE DESIGN WITH STRESS RELIEF FEATURE

Semiconductor device with embedded interconnect pad

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Integrated circuit package system using heat slug

Semiconductor chip

Integrated Direct Conversion Detector Module

METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Methods of operating electronic devices, and methods of providing electronic devices

MEMORY CARD

Adhesive film for semiconductor and semiconductor device using the adhesive film

Integrated circuit package system with redistribution layer and method for manufacturing thereof

Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof

Wafer level stack structure for system-in-package and method thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONTACT PADS AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Integrated circuit packaging system with a dual substrate package and method of manufacture thereof

Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof

EQUIPOTENTIAL PAD CONNECTION

Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds

Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same

Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

Semiconductor device that suppresses malfunctions due to noise generated in internal circuit

Semiconductor package having substrate with solder ball connections and method of fabricating the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME

Methods to fabricate integrated circuits by assembling components

Semiconductor device having a sealing resin and method of manufacturing the same

Integrated circuit package having a castellated heatspreader

Integrated circuit package stacking system with redistribution and method of manufacture thereof