H01L2224/7615 - CPC Classification Index

ClassID:

210307 ⎘

H01L2224/7615 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects Means for depositing

Sub-classes:

H01L2224/76151 » Means for direct writing 4
H01L2224/76161 » Means for screen printing, e.g. roller, squeegee, screen stencil 0
H01L2224/7617 » Means for applying a preform, e.g. laminator 2
H01L2224/7618 » Means for blanket deposition 0

Recent Application in this class:

20210280436

2021-09-09

Method of applying conductive adhesive and manufacturing device using the same

20200144077

2020-05-07

Method of applying conductive adhesive and manufacturing device using the same