H01L2224/7618 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects; Means for depositing Means for blanket deposition

• H01L2224/76181 » for spin coating, i.e. spin coater 0
• H01L2224/76182 » for curtain coating 0
• H01L2224/76183 » for immersion coating, i.e. bath 0
• H01L2224/76184 » for spray coating, i.e. nozzle 0
• H01L2224/76185 » Means for physical vapour deposition [PVD] 0
• H01L2224/76188 » Means for chemical vapour deposition [CVD], e.g. for laser CVD 0
• H01L2224/76189 » Means for plating, e.g. for electroplating, electroless plating 1