H01L2224/76151 - CPC Classification Index

ClassID:

210308 ⎘

H01L2224/76151 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects; Means for depositing Means for direct writing

Sub-classes:

H01L2224/76152 » Syringe 5
H01L2224/76155 » Jetting means, e.g. ink jet 264
H01L2224/76158 » including a laser 1

Recent Application in this class:

20210280436

2021-09-09

Method of applying conductive adhesive and manufacturing device using the same

20200144077

2020-05-07

Method of applying conductive adhesive and manufacturing device using the same

20190124757

2019-04-25

Bare die integration with printed components on flexible substrate without laser cut

20170171958

2017-06-15

Bare die integration with printed components on flexible substrate without laser cut