H01L2224/76152 - CPC Classification Index

ClassID:

210309 ⎘

H01L2224/76152 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects; Means for depositing; Means for direct writing Syringe

Recent Application in this class:

20210358880

2021-11-18

Method for producing an electrically conductive connection on a substrate, microelectronic device and method for the production thereof

20120298401

2012-11-29

METHOD FOR FABRICATING A THREE-DIMENSIONAL ULTRAFINE POLYMER CONDUCTING WIRE, OMNIDIRECTIONAL WIRING, AND ULTRAFINE POLYMER CONDUCTING WIRE FABRICATED USING THE METHOD

20090023247

2009-01-22

Method for forming side wirings

20090020889

2009-01-22

Semiconductor apparatus having side surface wiring

20090020887

2009-01-22

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF