H01L2224/76185 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects; Means for depositing; Means for blanket deposition Means for physical vapour deposition [PVD]

• H01L2224/76186 » Means for sputtering, e.g. target 0
• H01L2224/76187 » Means for evaporation 0