ClassID:

210324

H01L2224/76189 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects; Means for depositing; Means for blanket deposition Means for plating, e.g. for electroplating, electroless plating

Recent Application in this class: