H01L2224/76261 - CPC Classification Index

ClassID:

210331 ⎘

H01L2224/76261 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects; Means for applying energy, e.g. heating means Laser

Sub-classes:

H01L2224/76262 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 0
H01L2224/76263 » in the upper part of the bonding apparatus 0

Recent Application in this class:

20140069697

2014-03-13

Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate