210332 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects; Means for applying energy, e.g. heating means; Laser in the lower part of the bonding apparatus, e.g. in the apparatus chuck