210689 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB]; Means for applying energy, e.g. heating means; Resistance welding electrodes, i.e. for ohmic heating in the lower part of the bonding apparatus, e.g. in the apparatus chuck