ClassID:

210761

H01L2224/79988 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB]; Apparatus chuck; Auxiliary members on the pressing surface Material of the auxiliary member

Recent Application in this class: