210894 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester; Hardening the adhesive by curing, i.e. thermosetting Ultraviolet [UV] curing
METHOD OF ASSEMBLY BY DIRECT BONDING OF ELECTRONIC COMPONENTS
#2BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
#3Using MEMS fabrication incorporating into LED device mounting and assembly
#4Method of manufacturing a semiconductor device
#5Using MEMS fabrication incorporating into LED device mounting and assembly