ClassID:

210905

H01L2224/80899 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding techniques; Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like; Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other using resilient parts in the bonding area