H01L2224/81035 - CPC Classification Index

ClassID:

210953 ⎘

H01L2224/81035 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Pre-treatment of the bump connector or the bonding area; Reshaping the bump connector in the bonding apparatus, e.g. flattening the bump connector by heating means

Sub-classes:

H01L2224/81037 » using a polychromatic heating lamp 0
H01L2224/81039 » using a laser 1
H01L2224/81041 » Induction heating, i.e. eddy currents 0

Recent Application in this class:

20250219018

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AND ELECTRONIC DEVICE

20250210584

METHOD OF BONDING LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING DISPLAY DEVICE, HAVING THE SAME

20240387192

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

20230335411

Chip package structure with nickel layer

20220238352

Chip package structure with conductive adhesive layer

20210313195

Chip package structure with conductive adhesive layer and method for forming the same

20190013293

Method for producing semiconductor chip

20180350767

BALL GRID ARRAY SOLDER ATTACHMENT

20180254255

Method for producing semiconductor package

20170179069

BALL GRID ARRAY SOLDER ATTACHMENT