210956 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Pre-treatment of the bump connector or the bonding area; Reshaping the bump connector in the bonding apparatus, e.g. flattening the bump connector by heating means Induction heating, i.e. eddy currents