H01L2224/83011 - CPC Classification Index

ClassID:

211233 ⎘

H01L2224/83011 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Pre-treatment of the layer connector or the bonding area; Cleaning the layer connector, e.g. oxide removal step, desmearing Chemical cleaning, e.g. etching, flux

Recent Application in this class:

20250349818

2025-11-13

BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES

20250079364

2025-03-06

METHODS AND STRUCTURES EMPLOYING METAL OXIDE FOR DIRECT METAL BONDING

20240371850

2024-11-07

TECHNIQUES FOR PROCESSING DEVICES

20240321855

2024-09-26

BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES

20230420408

2023-12-28

SELF-ALIGNING BONDING BY HYDROPHILIC CONTRAST

20230115289

2023-04-13

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

20210375850

2021-12-02

Techniques for processing devices

20210225803

2021-07-22

COVALENTLY BONDED SEMICONDUCTOR INTERFACES

20200365575

2020-11-19

Techniques for processing devices

#10

20190252364

2019-08-15

Techniques for processing devices

#11

20190103378

2019-04-04

Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement

#12

20180247914

2018-08-30

Method of bonding semiconductor substrates

#13

20180090420

2018-03-29

Method of manufacturing semiconductor device and semiconductor device

#14

20180012873

2018-01-11

System and method for the fluidic assembly of micro-LEDs utilizing negative pressure

#15

20180001614

2018-01-04

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

#16

20170207193

2017-07-20

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

#17

20170179073

2017-06-22

Method for performing direct bonding between two structures

#18

20170103964

2017-04-13

Apparatus and methods for micro-transfer-printing

#19

20160293522

2016-10-06

Au-based solder die attachment semiconductor device and method for manufacturing the same

#20

20160172328

2016-06-16

Bonding method using bonding material

#21

20160099087

2016-04-07

Bonding material and bonding method using the same

#22

20160071817

2016-03-10

Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas

#23

20160035691

2016-02-04

Semiconductor device and method of fabricating same

#24

20160020130

2016-01-21

Apparatus and methods for micro-transfer-printing

#25

20160020127

2016-01-21

Apparatus and methods for micro-transfer-printing

#26

20160020120

2016-01-21

Apparatus and methods for micro-transfer-printing

#27

20160016399

2016-01-21

Apparatus and methods for micro-transfer-printing

#28

20150249191

2015-09-03

Method of manufacturing light-emitting device and wiring substrate for light-emitting element

#29

20150235918

2015-08-20

Sealing structure for a bonded wafer and method of forming the sealing structure

#30

20150228535

2015-08-13

Bonded processed semiconductor structures and carriers

#31

20150179604

2015-06-25

Method for bonding substrates

#32

20150021792

2015-01-22

Electronic device and method for fabricating an electronic device

#33

20140110848

2014-04-24

Strong, heat stable junction

#34

20130285248

2013-10-31

Package structure and substrate bonding method

#35

20130256907

2013-10-03

Bonded processed semiconductor structures and carriers

#36

20130029438

2013-01-31

Method for manufacturing wafer-bonded semiconductor device

#37

20120298009

2012-11-29

Bonding material and bonding method using the same

#38

20120160903

2012-06-28

METHOD OF JOINING METAL

#39

20120153453

2012-06-21

Metallic thermal joint for high power density chips

#40

20120115305

2012-05-10

Method and structure for wafer to wafer bonding in semiconductor packaging

#41

20120013013

2012-01-19

Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region

#42

20110081738

2011-04-07

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

#43

20070228112

2007-10-04

Method and arrangement for forming a microelectronic package

#44

20060097354

2006-05-11