Patents-Review.com
ClassID:

211235 ⎘

H01L2224/83013 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Pre-treatment of the layer connector or the bonding area; Cleaning the layer connector, e.g. oxide removal step, desmearing Plasma cleaning

Recent Application in this class:
#1
20260027805
2026-01-29

THERMALLY CONDUCTIVE SUBSTRATE BONDING INTERFACE

 #2
20250253282
2025-08-07

STORAGE LAYERS FOR WAFER BONDING

 #3
20250233117
2025-07-17

METHOD OF FORMING SEMICONDUCTOR DEVICE USING HIGH STRESS CLEAVE PLANE

 #4
20250219020
2025-07-03

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBSTRATE

 #5
20240404990
2024-12-05

PROCESSED STACKED DIES

 #6
20240371850
2024-11-07

TECHNIQUES FOR PROCESSING DEVICES

 #7
20230387065
2023-11-30

Storage layers for wafer bonding

 #8
20230299060
2023-09-21

Method of forming semiconductor device using high stress cleave plane

 #9
20230282610
2023-09-07

Processed stacked dies

 #10
20230062412
2023-03-02

Storage layers for wafer bonding

 #11
20210375850
2021-12-02

Techniques for processing devices

 #12
20210242184
2021-08-05

Method of forming semiconductor device using range compensating material

 #13
20210104487
2021-04-08

Processed stacked dies

 #14
20200365575
2020-11-19

Techniques for processing devices

 #15
20200194409
2020-06-18

Three dimensional integrated circuit

 #16
20190326207
2019-10-24

Integrated circuit packaging method and integrated packaged circuit

 #17
20190295982
2019-09-26

Chip wiring method and structure

 #18
20190252364
2019-08-15

Techniques for processing devices

 #19
20190097088
2019-03-28

Optoelectronic component and method for producing an optoelectronic component

 #20
20180331066
2018-11-15

Processed stacked dies

 #21
20180182654
2018-06-28

Die tray with channels

 #22
20180001614
2018-01-04

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

 #23
20170207193
2017-07-20

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

 #24
20170103964
2017-04-13

Apparatus and methods for micro-transfer-printing

 #25
20160071817
2016-03-10

Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas

 #26
20160020130
2016-01-21

Apparatus and methods for micro-transfer-printing

 #27
20160020127
2016-01-21

Apparatus and methods for micro-transfer-printing

 #28
20160020120
2016-01-21

Apparatus and methods for micro-transfer-printing

 #29
20160016399
2016-01-21

Apparatus and methods for micro-transfer-printing

 #30
20150287696
2015-10-08

Mounting method

 #31
20150224755
2015-08-13

Method for coating and bonding substrates

 #32
20150179604
2015-06-25

Method for bonding substrates

 #33
20150076216
2015-03-19

Reducing formation of oxide on solder

 #34
20150048523
2015-02-19

Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer

 #35
20140154867
2014-06-05

Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation

 #36
20130285248
2013-10-31

Package structure and substrate bonding method

 #37
20120288996
2012-11-15

METHODS AND APPARATUS FOR APPLYING AN ADHESIVE TO A CIRCUIT BOARD

 #38
20120153496
2012-06-21

Method of fabricating a TSV for 3D packaging of semiconductor device

 #39
20120153453
2012-06-21

Metallic thermal joint for high power density chips

 #40
20120111925
2012-05-10

Reducing formation of oxide on solder

 #41
20110081738
2011-04-07

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

 #42
20110045638
2011-02-24

HEAT RESISTANT MASKING TAPE AND USAGE THEREOF

 #43
20060097354
2006-05-11

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head