Patents-Review.com
ClassID:

211365 ⎘

H01L2224/83874 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester; Hardening the adhesive by curing, i.e. thermosetting Ultraviolet [UV] curing

Recent Application in this class:
#1
20250279392
2025-09-04

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

 #2
20250183223
2025-06-05

IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD

 #3
20250140653
2025-05-01

HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE

 #4
20250081647
2025-03-06

IMAGE SENSOR PACKAGES AND RELATED METHODS

 #5
20240395759
2024-11-28

FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

 #6
20240371817
2024-11-07

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #7
20240304639
2024-09-12

OPTICAL SENSOR PACKAGE

 #8
20240186279
2024-06-06

IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVICE ATTACHMENT

 #9
20240105669
2024-03-28

DOCUMENT STRUCTURE FORMATION

 #10
20240038795
2024-02-01

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE

 #11
20230420404
2023-12-28

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE

 #12
20230377936
2023-11-23

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy Assembly

 #13
20230299247
2023-09-21

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

 #14
20230191747
2023-06-22

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

 #15
20230154906
2023-05-18

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

 #16
20230112750
2023-04-13

Contact pad for semiconductor device

 #17
20230037241
2023-02-02

TRANSPARENT DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND TRANSPARENT DISPLAY DEVICE

 #18
20230019546
2023-01-19

IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD

 #19
20230011327
2023-01-12

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

 #20
20220367770
2022-11-17

DISPLAY PANEL AND METHOD OF MANUFACTURING SAME

 #21
20220352108
2022-11-03

Circuits including micropatterns and using partial curing to adhere dies

 #22
20220344297
2022-10-27

SEMICONDUCTOR PACKAGE INHIBITING VISCOUS MATERIAL SPREAD

 #23
20220328451
2022-10-13

Display device and method of manufacturing the same

 #24
20220310547
2022-09-29

DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

 #25
20220271004
2022-08-25

Electronic device and method of transferring electronic element using stamping and magnetic field alignment

 #26
20220149031
2022-05-12

SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUPPORT PIECE FORMATION LAMINATE FILM AND MANUFACTURING METHOD THEREFOR

 #27
20220085265
2022-03-17

Micro LED display and manufacturing method therefor

 #28
20220078918
2022-03-10

Forming electrical interconnections using capillary microfluidics

 #29
20220059496
2022-02-24

Electronic device and method of transferring electronic element using stamping and magnetic field alignment

 #30
20210398931
2021-12-23

Connection structure

 #31
20210384156
2021-12-09

Display device and method of manufacturing the same

 #32
20210358882
2021-11-18

Semiconductor chip mounting tape and method of manufacturing semiconductor package using the tape

 #33
20210265191
2021-08-26

Methods for releasing ultra-small or ultra-thin discrete components from a substrate

 #34
20210175191
2021-06-10

Contact pad for semiconductor device

 #35
20210159208
2021-05-27

Chip bonding method and bonding device

 #36
20210125964
2021-04-29

Sawing underfill in packaging processes

 #37
20210057383
2021-02-25

Sawing underfill in packaging processes

 #38
20210043600
2021-02-11

Display device and method of manufacturing the same

 #39
20210013169
2021-01-14

DISPLAY PANEL AND MANUFACTURING METHOD OF THE DISPLAY PANEL

 #40
20200411493
2020-12-31

Composite semiconductor component having projecting elements projecting from a carrier substrate and method for producing the composite semiconductor component

 #41
20200402867
2020-12-24

Method For Manufacturing Led Display

 #42
20200365552
2020-11-19

Adhesive bonding composition and method of use

 #43
20200343211
2020-10-29

Connection structure

 #44
20200328199
2020-10-15

Receiver optical module and process of assembling the same

 #45
20200321318
2020-10-08

Memory devices with controllers under memory packages and associated systems and methods

 #46
20200294867
2020-09-17

Assembly process for circuit carrier and circuit carrier

 #47
20200266074
2020-08-20

Multi-die package with bridge layer

 #48
20200135534
2020-04-30

Setting up ultra-small or ultra-thin discrete components for easy assembly

 #49
20200098718
2020-03-26

Connection structure

 #50
20200051936
2020-02-13

Contact pad for semiconductor device

 #51
20190341364
2019-11-07

Adhesive bonding composition and method of use

 #52
20190326253
2019-10-24

Selectively cross-linked thermal interface materials

 #53
20190237424
2019-08-01

Connection structure and method for manufacturing connection structure

 #54
20190237410
2019-08-01

Semiconductor packages

 #55
20190229071
2019-07-25

Semiconductor package

 #56
20190225837
2019-07-25

Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

 #57
20190206831
2019-07-04

Alignment method, method for connecting electronic component, method for manufacturing connection body, connection body and anisotropic conductive film

 #58
20190189526
2019-06-20

Placement method for circuit carrier and circuit carrier

 #59
20190148279
2019-05-16

Electronics package having a self-aligning interconnect assembly and method of making same

 #60
20190131288
2019-05-02

Receiver optical module and process of assembling the same

 #61
20190059160
2019-02-21

Electronic Device and Method of Making the Same Using Surface Mount Technology

 #62
20190057891
2019-02-21

Placing ultra-small or ultra-thin discrete components

 #63
20190051612
2019-02-14

Semiconductor packages

 #64
20190043734
2019-02-07

Electronics package with integrated interconnect structure and method of manufacturing thereof

 #65
20180358246
2018-12-13

Transfer printing using ultrasound

 #66
20180350776
2018-12-06

Memory devices with controllers under memory packages and associated systems and methods

 #67
20180277510
2018-09-27

Selectively cross-linked thermal interface materials

 #68
20180247924
2018-08-30

Electronics package having a multi-thickness conductor layer and method of manufacturing thereof

 #69
20180218994
2018-08-02

Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method

 #70
20180218990
2018-08-02

Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure

 #71
20180122778
2018-05-03

Integrated circuit module and method of forming same

 #72
20180082857
2018-03-22

Electrical interconnect structure for an embedded electronics package

 #73
20180056455
2018-03-01

Engineered polymer-based electronic materials

 #74
20170301637
2017-10-19

Contact pad for semiconductor device

 #75
20170271299
2017-09-21

ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY PANEL, AND THEIR FABRICATION METHODS

 #76
20170236799
2017-08-17

Bonding method for connecting two wafers

 #77
20170236724
2017-08-17

Methods for making multi-die package with bridge layer

 #78
20170213809
2017-07-27

Sawing underfill in packaging processes

 #79
20170206383
2017-07-20

Electronic device

 #80
20170200707
2017-07-13

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

 #81
20170170149
2017-06-15

Memory devices with controllers under memory packages and associated systems and methods

 #82
20170154866
2017-06-01

Adhesive bonding composition and method of use

 #83
20170141088
2017-05-18

Three layer stack structure

 #84
20170117247
2017-04-27

Method for bonding substrates

 #85
20170102419
2017-04-13

Electronic device

 #86
20170100917
2017-04-13

Bonding structure on gold thin film

 #87
20170062379
2017-03-02

Anisotropic conductive film structures

 #88
20160368015
2016-12-22

Liquid ejection device

 #89
20160351531
2016-12-01

Connection body

 #90
20160343629
2016-11-24

Wafer stack protection seal

 #91
20160327826
2016-11-10

Connection body, method for manufacturing a connection body, connecting method and anisotropic conductive adhesive agent

 #92
20160284958
2016-09-29

Method for coating conductive substrate with adhesive

 #93
20160260695
2016-09-08

Fan out system in package and method for forming the same

 #94
20160260684
2016-09-08

System in package fan out stacking architecture and process flow

 #95
20160236471
2016-08-18

Microfluidic delivery member with filter and method of forming same

 #96
20160214364
2016-07-28

Member bonding apparatus and method

 #97
20160190091
2016-06-30

Laser assisted transfer welding process

 #98
20160181229
2016-06-23

Mounting structure of semiconductor device and method of manufacturing the same

 #99
20160172313
2016-06-16

SUBSTRATE WITH A SUPPORTING PLATE AND FABRICATION METHOD THEREOF

 #100
20160148918
2016-05-26

Memory devices with controllers under memory packages and associated systems and methods

 #101
20160143154
2016-05-19

Component mounting apparatus

 #102
20160115354
2016-04-28

Radical polymerizable adhesive composition and method of producing electrical connection body

 #103
20160093597
2016-03-31

Multi-die package with bridge layer and method for making the same

 #104
20160083537
2016-03-24

Resin composition, resin sheet, and production method for semiconductor device

 #105
20160056136
2016-02-25

Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof

 #106
20150380395
2015-12-31

Flip-chip assembly process comprising pre-coating interconnect elements

 #107
20150367560
2015-12-24

Curing a heat-curable material in an embedded curing zone

 #108
20150348953
2015-12-03

OPTOELECTRONIC PACKAGE AND METHOD FOR MAKING SAME

 #109
20150311188
2015-10-29

Methods of fabrication and testing of three-dimensional stacked integrated circuit system-in-package

 #110
20150303127
2015-10-22

Chip-scale packaging with protective heat spreader

 #111
20150279771
2015-10-01

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #112
20150243626
2015-08-27

Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method

 #113
20150132873
2015-05-14

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

 #114
20150107765
2015-04-23

UV-curable anisotropic conductive adhesive

 #115
20150076662
2015-03-19

Composite substrate manufacturing method, semiconductor element manufacturing method, composite substrate, and semiconductor element

 #116
20150050781
2015-02-19

Semiconductor package with embedded die and its methods of fabrication

 #117
20140353540
2014-12-04

Anisotropic conductive adhesive with reduced migration

 #118
20140346684
2014-11-27

Connection method, connection structure, insulating adhesive member, electronic component having adhesive member, and method for manufacturing same

 #119
20140264762
2014-09-18

Wafer stack protection seal

 #120
20140252399
2014-09-11

Electronic packaging substrate with etching indentation as die attachment anchor and method of manufacturing the same

 #121
20140091509
2014-04-03

Methods for forming 3DIC package

 #122
20140021624
2014-01-23

Mounting structure of semiconductor device and method of manufacturing the same

 #123
20140000804
2014-01-02

FIXING TECHNOLOGY FOR COMPONENT ATTACH

 #124
20130285243
2013-10-31

Easily assembled chip assembly and chip assembling method

 #125
20130277847
2013-10-24

Chip package and method for assembling chip package

 #126
20130187258
2013-07-25

Sawing underfill in packaging processes

 #127
20130153277
2013-06-20

Electrically bonded arrays of transfer printed active components

 #128
20130133822
2013-05-30

Component placement on flexible and/or stretchable substrates

 #129
20130095608
2013-04-18

Methods for forming 3DIC package

 #130
20130064967
2013-03-14

Liquid adhesive boundary control

 #131
20130042972
2013-02-21

Dual Cure Thermally Conductive Adhesive

 #132
20120248977
2012-10-04

Light emitting device-light receiving device assembly, and manufacturing method thereof

 #133
20120161325
2012-06-28

Semiconductor device package

 #134
20120115262
2012-05-10

Laser assisted transfer welding process

 #135
20120106111
2012-05-03

ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAGNETIC NANO-PARTICLES

 #136
20120091594
2012-04-19

Method of producing a chip package, and chip package

 #137
20110215464
2011-09-08

Semiconductor package with embedded die and its methods of fabrication

 #138
20110207253
2011-08-25

FLIP-CHIP LED MODULE FABRICATION METHOD

 #139
20110201195
2011-08-18

Flip chip mounting method and bump forming method

 #140
20110062599
2011-03-17

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

 #141
20100317132
2010-12-16

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

 #142
20100295165
2010-11-25

Stress-engineered interconnect packages with activator-assisted molds

 #143
20100224985
2010-09-09

Chip-scale packaging with protective heat spreader

 #144
20100203675
2010-08-12

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

 #145
20090253233
2009-10-08

Method of fabricating bonding structure

 #146
20090246988
2009-10-01

Contact structure and forming method thereof and connecting structure thereof

 #147
20090168354
2009-07-02

Thermally and electrically conductive interconnect structures

 #148
20090117688
2009-05-07

Flip chip mounting method and bump forming method

 #149
20090115042
2009-05-07

SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME

 #150
20090085220
2009-04-02

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING

 #151
20090045525
2009-02-19

Semiconductor element and semiconductor device

 #152
20090039291
2009-02-12

Mounting method, electric part-mounted substrate and an electric device

 #153
20090023245
2009-01-22

Flip chip mounting method and bump forming method

 #154
20090008800
2009-01-08

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

 #155
20080284046
2008-11-20

Flip chip mounting method and bump forming method

 #156
20080131999
2008-06-05

METHOD OF DIE STACKING USING INSULATED WIRE BONDS

 #157
20080131998
2008-06-05

Method of fabricating a film-on-wire bond semiconductor device

 #158
20080128921
2008-06-05

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

 #159
20080128880
2008-06-05

DIE STACKING USING INSULATED WIRE BONDS

 #160
20080108168
2008-05-08

Structure of image sensor module and method for manufacturing of wafer level package

 #161
20080104832
2008-05-08

Method for manufacturing electronic substrate

 #162
20080099916
2008-05-01

Bonding structure

 #163
20070298539
2007-12-27

Method for bonding semiconductor chip

 #164
20070290346
2007-12-20

Method for manufacturing an electronic component and corresponding electronic component

 #165
20070257362
2007-11-08

Process for forming bumps and solder bump

 #166
20070205494
2007-09-06

Chip-size package structure and method of the same

 #167
20070132099
2007-06-14

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

 #168
20070128827
2007-06-07

Method and system for increasing yield of vertically integrated devices

 #169
20070126097
2007-06-07

Chip package structure

 #170
20070117274
2007-05-24

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

 #171
20070080435
2007-04-12

Semiconductor packaging process and carrier for semiconductor package

 #172
20070037317
2007-02-15

Method and device for attaching a chip in a housing

 #173
20060231958
2006-10-19

Fan out type wafer level package structure and method of the same

 #174
20060172460
2006-08-03

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

 #175
20060099809
2006-05-11

Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin

 #176
20060099739
2006-05-11

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

 #177
20060087036
2006-04-27

Chip-size package structure and method of the same

 #178
20060065738
2006-03-30

RFID DEVICE AND METHOD OF MANUFACTURE

 #179
20050242409
2005-11-03

Image sensor with a protection layer

 #180
20050242408
2005-11-03

Structure of image sensor module and a method for manufacturing of wafer level package

 #181
20050196897
2005-09-08

Method and apparatus for joining semiconductor

 #182
20050042795
2005-02-24

Photo-semiconductor module and method for manufacturing the same

 #183
20050009241
2005-01-13

Process for producing semiconductor device and semiconductor device

 #184
15465872
2018-08-14

Selectively cross-linked thermal interface materials