211408 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Post-treatment of the layer connector or bonding area Forming additional members, e.g. for reinforcing, fillet sealant
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
#2DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
#3ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
#4THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
#5Bonding of bridge to multiple semiconductor chips
#6ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
#7METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS REFLOW
#8SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME
#9MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS
#10ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
#11Bonding of bridge to multiple semiconductor chips
#12Stretchable display module and manufacturing method thereof
#13Seal ring structures and methods of forming same
#14Electronic device and method for manufacturing electronic device
#15Chip Module, Use of Chip Module, Test Arrangement and Test Method
#16Display panel, preparation method thereof, and display device
#17System and method for integration of biological chips
#18Image sensor including a back via stack
#19Electronic device and display device using the same
#20Display device and method of manufacturing the same
#21Circuit Carrier Having an Installation Place for Electronic Components, Electronic Circuit and Production Method
#22Semiconductor element bonding structure, method for producing semiconductor element bonding structure, and electrically conductive bonding agent
#23Thermal interface material having different thicknesses in packages
#24Seal ring structures and methods of forming same
#25PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE
#26Wafer-level packaging methods using a photolithographic bonding material
#27Hetero-integrated structure
#28SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#29Integrated multi-color light-emitting pixel arrays based devices by bonding
#30Methods and apparatus for a semiconductor device having bi-material die attach layer
#31NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME
#32STACKED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
#33Seal ring structures and methods of forming same
#34Thermal interface material having different thicknesses in packages
#35Thermal interface material having different thicknesses in packages
#36Methods and apparatus for semiconductor device having bi-material die attach layer
#37Seal ring structures and methods of forming same
#38Package structure and its fabrication method
#39Chip carrier configured for delamination-free encapsulation and stable sintering
#40Copper seed layer and nickel-tin microbump structures
#41BUMPLESS BUILD-UP LAYER PACKAGE WITH A PRE-STACKED MICROELECTRONIC DEVICES
#42Semiconductor module
#43Printed adhesion deposition to mitigate integrated circuit delamination
#44Method for forming an electrical device and electrical devices
#45Printed adhesion deposition to mitigate integrated circuit package delamination
#46Opto-electronic apparatus and manufacturing method thereof
#47Semiconductor device, display panel, display device, and electronic device
#48Bumpless build-up layer package with pre-stacked microelectronic devices
#49Semiconductor device module with solder layer
#50Low-stress dual underfill packaging
#51Electronic package and method of connecting a first die to a second die to form an electronic package
#52CMOS-MEMS integration by sequential bonding method
#53Low-stress dual underfill packaging
#54Semiconductor device and manufacturing method thereof
#55Semiconductor device having a bulge portion and manufacturing method therefor
#56Connection arrangement of an electric and/or electronic component
#57Bumpless build-up layer package with pre-stacked microelectronic devices
#58Joining method and semiconductor device manufacturing method
#59Light-emitting module and lamp using same
#60Bonding layer structure and method for wafer to wafer bonding
#61Semiconductor package and fabrication method thereof
#62Chip package and method for assembling chip package
#63Semiconductor device including a polymer disposed on a carrier
#64SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
#65Packaging methods, material dispensing methods and apparatuses, and automated measurement systems
#66Grown carbon nanotube die attach structures, articles, devices, and processes for making them
#67Joining method and semiconductor device manufacturing method
#68Electronic arrangement and method for producing an electronic arrangement
#69Liquid adhesive boundary control
#70Package structure, method for manufacturing same, and method for repairing package structure
#71Printed substrate manufacturing equipment and manufacturing method
#72Underfill method and chip package
#73Electronic element unit and reinforcing adhesive agent
#74Self-filleting die attach paste
#75Bumpless build-up layer package with pre-stacked microelectronic devices
#76Sintering silver paste material and method for bonding semiconductor chip
#77Power semiconductor module
#78PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD
#79Electronic device and method of manufacturing the same
#80Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation
#81Semiconductor device and method for manufacturing the same
#82Self-Filleting Die Attach Paste
#83Underfill method and chip package
#84Semiconductor device assembly having a stress-relieving buffer layer
#85Light emitting element
#86Semiconductor power module
#87SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#88Semiconductor device and method of manufacturing the same
#89PROTECTIVE THIN FILM COATING IN CHIP PACKAGING
#90POWER MODULE AND INVERTER FOR VEHICLES
#91Semiconductor package having insulated metal substrate and method of fabricating the same
#92Electronic device and method for fabricating the same
#93Low stress cavity package
#94SHIELDED WIREBOND
#95SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
#96Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates
#97PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS
#98Liquid epoxy resin composition and flip chip semiconductor device
#99Semiconductor package having insulated metal substrate and method of fabricating the same
#100Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus
#101Photodetector
#102SEMICONDUCTOR DEVICE INCLUDING WIRING SUBSTRATE HAVING ELEMENT MOUNTING SURFACE COATED BY RESIN LAYER
#103SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#104SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN
#105Flip-chip semiconductor package and chip carrier for preventing corner delamination
#106Semiconductor power module including epoxy resin coating
#107Edge coating a microelectronic device
#108Chip package
#109Semiconductor device and a manufacturing method thereof
#110Flip-chip semiconductor device and method for fabricating the same
#111Method and device for contacting semiconductor chips
#112Electronic device and method of manufacturing the same
#113Chip on a board
#114Image sensor module and camera module package having the same
#115Package substrate
#116Semiconductor package and substrate structure thereof
#117Packaged die on PCB with heat sink encapsulant and methods
#118Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
#119Printed circuit board and electronic apparatus including printed circuit board
#120Liquid epoxy resin composition and semiconductor device
#121Liquid epoxy resin composition and semiconductor device
#122Package or pre-applied foamable underfill for lead-free process
#123Electronic device and method for fabricating the same
#124Flip chip package structure
#125Chip package with grease heat sink
#126Chip assembly reinforcement
#127Semiconductor package including a semiconductor device, and method of manufacturing the same
#128Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module
#129Method of making chip package with grease heat sink
#130Packaged die on PCB with heat sink encapsulant and methods
#131Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device
#132Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same
#133Semiconductor device having heat conducting plate
#134Encapsulated component which is small in terms of height and method for producing the same
#135Underfill and encapsulation of carrier substrate-mounted flip-chip components
#136Process for producing semiconductor device and semiconductor device
#137Imaging system
#138Chip package with grease heat sink
#139Integrated multi-color light-emitting pixel arrays based devices by bonding