ClassID:

211420

H01L2224/84014 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Pre-treatment of the connector and/or the bonding area; Cleaning, e.g. oxide removal step, desmearing Thermal cleaning, e.g. decomposition, sublimation