211542 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Post-treatment of the connector or bonding area Cleaning, e.g. oxide removal step, desmearing
Sub-classes:Semiconductor device and method with clip arrangement in IC package
#2Method for fabricating stack die package
#3Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#4Method for fabricating stack die package