ClassID:

211547

H01L2224/84919 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Post-treatment of the connector or bonding area; Cleaning, e.g. oxide removal step, desmearing Combinations of two or more cleaning methods provided for in at least two different groups from  -